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  • '''Atomic Layer Deposition (ALD)''' is a thin-film deposition technique used in the fabrication of semiconductor devices, microelectronic ALD offers several advantages over other thin-film deposition techniques, including precise thickness control at the atomic level, unifor
    2 KB (261 words) - 11:22, 5 April 2024
  • Chemical Vapor Deposition (CVD) is a thin-film deposition technique in which thin films are deposited onto a substrate surface throug ...face or with other reactive species present in the chamber, leading to the deposition of a thin film of material on the substrate.
    1 KB (186 words) - 13:14, 9 April 2024

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  • Step T006 is the deposition step. Note the extra long cool-down time in step T012. Reducing the cool-do
    3 KB (238 words) - 12:27, 31 January 2023
  • Step T004 is the deposition step and step T005 is the cool-down step (300 s).
    2 KB (199 words) - 15:02, 30 January 2023
  • ...charge H2O || DisChem || Proprietary || || Anti-charging for EBL || Metal Deposition (Au)
    917 bytes (100 words) - 15:44, 3 July 2023
  • Step T006 is the deposition step.
    3 KB (213 words) - 12:31, 31 January 2023
  • [[Category:Deposition]] | Instrument_Type = Deposition
    4 KB (450 words) - 15:29, 13 February 2024
  • Step T004 is the deposition step and step T005 is the cool-down step (300 s).
    2 KB (199 words) - 15:02, 30 January 2023
  • ...ing with process troubleshooting. His main area of focus is physical vapor deposition, including sputtering, and thermal and electron-beam evaporation. He also t
    1 KB (143 words) - 16:50, 25 April 2024
  • [[Category:Deposition]] | Instrument_Type = Deposition
    5 KB (770 words) - 13:54, 3 January 2024
  • ==Deposition== === [[How PVD works|Physical Vapor Deposition (PVD)]] ===
    6 KB (765 words) - 16:59, 25 April 2024
  • [[Category:Deposition]] | Instrument_Type = Deposition
    949 bytes (135 words) - 13:47, 20 March 2024
  • Physical vapor deposition (PVD) is a thin film deposition technique used to create coatings or thin films on substrates in a variety ...process, which uses a magnetic field to enhance efficiency and control the deposition.
    11 KB (1,676 words) - 11:23, 10 April 2024
  • ...niversity of Pennsylvania (Penn). He is responsible for the Physical Vapor Deposition (PVD) and electrical characterization tools within the QNF. Prior to joinin
    1 KB (160 words) - 14:52, 24 August 2022
  • [[Category:Deposition]] | Instrument_Type = Deposition
    1 KB (187 words) - 13:54, 3 January 2024
  • [[Category:Deposition]] | Instrument_Type = Deposition
    9 KB (1,343 words) - 11:42, 30 April 2024
  • [[Category:Deposition]] | Instrument_Type = Deposition
    2 KB (319 words) - 13:54, 3 January 2024
  • [[Category:Deposition]] | Instrument_Type = Physical vapor deposition
    1 KB (195 words) - 12:48, 4 April 2024
  • | Instrument_Type = Deposition
    1 KB (135 words) - 14:11, 3 January 2024
  • [[Category:Deposition]] | Instrument_Type = Deposition
    3 KB (440 words) - 15:29, 9 January 2024
  • * [https://upenn.app.box.com/file/1004242723681 Deposition and Etch Characterization of LPCVD SiNx thin films] * [https://upenn.app.box.com/file/1004880785762 ALD deposition of SiO2 using BDEAS and Ozone precursors]
    1 KB (208 words) - 15:23, 3 July 2023
  • Step T006 is the deposition step.
    3 KB (213 words) - 12:32, 31 January 2023

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