Search results
Jump to navigation
Jump to search
Page title matches
- 550 bytes (62 words) - 13:01, 7 June 2024
- 468 bytes (62 words) - 14:56, 3 June 2024
- 235 bytes (33 words) - 10:57, 7 June 2024
- 235 bytes (33 words) - 15:37, 17 June 2024
- #REDIRECT [[ALD-02: Titanium Dioxide Deposition]]49 bytes (5 words) - 16:41, 7 June 2024
- Determine the a-Si deposition rate on CVD-01171 bytes (19 words) - 14:54, 14 October 2024
- '''Atomic Layer Deposition (ALD)''' is a thin-film deposition technique used in the fabrication of semiconductor devices, microelectronic ALD offers several advantages over other thin-film deposition techniques, including precise thickness control at the atomic level, unifor2 KB (261 words) - 11:22, 5 April 2024
- Chemical Vapor Deposition (CVD) is a thin-film deposition technique in which thin films are deposited onto a substrate surface throug ...face or with other reactive species present in the chamber, leading to the deposition of a thin film of material on the substrate.1 KB (186 words) - 13:14, 9 April 2024
Page text matches
- #REDIRECT [[ALD-02: Titanium Dioxide Deposition]]49 bytes (5 words) - 16:41, 7 June 2024
- Step T006 is the deposition step. Note the extra long cool-down time in step T012. Reducing the cool-do3 KB (238 words) - 12:27, 31 January 2023
- Step T004 is the deposition step and step T005 is the cool-down step (300 s).2 KB (199 words) - 15:02, 30 January 2023
- Determine the a-Si deposition rate on CVD-01171 bytes (19 words) - 14:54, 14 October 2024
- ...charge H2O || DisChem || Proprietary || || Anti-charging for EBL || Metal Deposition (Au)917 bytes (100 words) - 15:44, 3 July 2023
- ===Deposition Equipment=== ===Sputter Deposition Rates===4 KB (394 words) - 15:00, 9 May 2024
- Step T006 is the deposition step.3 KB (213 words) - 12:31, 31 January 2023
- [[Category:Deposition]] | Instrument_Type = Deposition4 KB (486 words) - 14:13, 31 March 2025
- Step T004 is the deposition step and step T005 is the cool-down step (300 s).2 KB (199 words) - 15:02, 30 January 2023
- ...ing with process troubleshooting. His main area of focus is physical vapor deposition, including sputtering, and thermal and electron-beam evaporation. He also t1 KB (143 words) - 16:50, 25 April 2024
- [[Category:Deposition]] | Instrument_Type = Deposition5 KB (786 words) - 17:17, 3 February 2025
- ==Deposition== === [[How PVD works|Physical Vapor Deposition (PVD)]] ===6 KB (840 words) - 15:04, 31 January 2025
- [[Category:Deposition]] | Instrument_Type = Deposition1 KB (147 words) - 14:52, 15 January 2025
- Physical vapor deposition (PVD) is a thin film deposition technique used to create coatings or thin films on substrates in a variety ...process, which uses a magnetic field to enhance efficiency and control the deposition.11 KB (1,676 words) - 11:23, 10 April 2024
- [[Category:Deposition]] | Instrument_Type = Physical vapor deposition1 KB (156 words) - 16:46, 20 September 2024
- ...niversity of Pennsylvania (Penn). He is responsible for the Physical Vapor Deposition (PVD) and electrical characterization tools within the QNF. Prior to joinin1 KB (160 words) - 14:52, 24 August 2022
- [[Category:Deposition]] | Instrument_Type = Deposition1 KB (187 words) - 13:54, 3 January 2024
- [[Category:Deposition]] | Instrument_Type = Deposition10 KB (1,469 words) - 15:48, 20 March 2025
- [[Category:Deposition]] | Instrument_Type = Deposition2 KB (314 words) - 15:27, 8 January 2025
- [[Category:Deposition]] | Instrument_Type = Physical vapor deposition1 KB (202 words) - 10:46, 16 May 2024