Difference between revisions of "Denton Explorer14 Magnetron Sputterer"

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| imagecaption =  
 
| imagecaption =  
 
| Instrument_Type = Deposition
 
| Instrument_Type = Deposition
−
| Staff_Manager = Sam Azadi
+
| Staff_Manager = [[Sam Azadi | Sam Azadi]]
 
| Lab_Location = Bay 2
 
| Lab_Location = Bay 2
 
| Tool_Manufacturer = Denton
 
| Tool_Manufacturer = Denton
 
| Tool_Model = Explorer14
 
| Tool_Model = Explorer14
−
| Iris_Designation = PVD-05
+
| NEMO_Designation = PVD-05
−
| Lab_Phone = XXXXX
+
| Lab_Phone = 215-898-9748
 
| SOP Link = [https://repository.upenn.edu/scn_sop/8 SOP]
 
| SOP Link = [https://repository.upenn.edu/scn_sop/8 SOP]
 
}}
 
}}
  
 
== Description ==
 
== Description ==
−
The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs.
 
  
−
The tool is an open load system in sputter-down configuration with one dedicated DC gun and two guns that can use either a DC or RF power supply. Codeposition from two DC sources or one DC and one RF source is possible. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.
+
==== Tool overview ====
  
−
Maximum DC Power is 600 W.
+
The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films (such as oxides). Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. The tool is an open load system in sputter-down configuration with one dedicated DC source and two sources that can use either a DC or RF power supply. Co-deposition from two DC sources or one DC and one RF source is possible, but it is recommended to run co-deposition on PVD-03 as the sources in this tool are not in confocal mode per default. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.
  
−
Maximum RF Power is 200 W.
+
==== Maximum power ====
  
 +
*Maximum DC Power: 600 W.
  
−
===== Deposition Sources =====
+
*Maximum RF Power: 200 W.
−
* ITO
 
−
* Cr
 
−
* Ti
 
−
* Ni
 
−
* Cu
 
−
* Al
 
−
* SiO2
 
−
* Ge
 
−
* Pt
 
−
* Au
 
−
* Ag
 
−
* Pd
 
−
* Si
 
−
* Al2O3
 
−
* Mo
 
−
* Various others - please contact staff
 
  
 +
You can inflict serious damage to the power supplies if these values are exceeded.
  
−
===== Maximum Allowed Deposition Power =====
+
==== Main differences between PVD-05 (this tool) and PVD-03 ====
  
−
{| class="wikitable" style="width: 90%;"
+
There are several differences between our two sputtering tools. Think carefully about what your needs are before deciding what tool to get trained on. If you're ever in doubt, consult with staff.
 +
 
 +
===== PVD-05 =====
 +
 
 +
*Large substrate platen that can hold several 4" wafers
 +
*Water-cooled platen
 +
*Three sputter sources (sputter down)
 +
*This tool cannot sputter magnetic materials
 +
*Open-load tool; requires at least one hour of pump-down
 +
*Co-deposition can be done, but is not recommended (sources not in confocal mode per default)
 +
 
 +
===== PVD-03 =====
 +
 
 +
*Small substrate platen that can hold one wafer up to 6"
 +
*Four sputter sources (sputter up)
 +
*This tool can sputter magnetic materials in source 2 and 4
 +
*Load-lock tool; it takes approximately 7 min to load your sample
 +
*This is our recommended tool for co-deposition as the sources are always confocal mode
 +
 
 +
'''For more information on PVD Equipment capabilities click [[PVD Equipment Overview|here]].'''
 +
 
 +
== Process data & master recipes ==
 +
 
 +
All process data were recorded at a base pressure lower than 5 x 10-6 Torr; you can never exceed 200 W on RF and 600 W on DC.
 +
 
 +
Clicking on the material's name will take you to the master recipe.
 +
 
 +
{| class="wikitable"
 +
! rowspan=2 | Material name/link to master recipe
 +
! rowspan=2 | Max power
 +
! colspan=3 | Process data
 +
! rowspan=2 | Recorded
 +
! rowspan=2 | Link to specs
 
|-
 
|-
−
!scope="col" style="text-align:left; width: 15%"| Material Name
+
! Pressure || Power || Rate
−
!scope="col" style="text-align:left; width: 16%" | Target
+
|-
−
!scope="col" style="text-align:left; width: 18%"| Maximum Allowed Power [W]
+
| [[Ag_master_recipe | Ag (silver)]] || 450 W ||  3 mTorr || 140 W || 7.3 Å s<sup>-1</sup> ||
 +
|-
 +
| [[Al_master_recipe | Al (aluminum)]] || 450 W ||  3 mTorr || 200 W || 3.0 Å s<sup>-1</sup> ||
 +
|-
 +
| [[Au (gold) | Au (gold)]] || 140 W ||  3 mTorr || 140 W || 4.6 Å s<sup>-1</sup> ||
 +
|-
 +
| Cr (chromium) || 450 W ||  3 mTorr || 450 W || 3.9 Å s<sup>-1</sup> ||
 +
|-
 +
| [[Cu_master_recipe | Cu (copper)]]  || 450 W || 3 mTorr || 400 W || 6.4 Å s<sup>-1</sup> || Aug 18, 2023
 +
|-
 +
| Ge (germanium) || 140 W ||  - || - || - ||
 +
|-
 +
| ITO (Indium tin oxide) || 140 W ||  - || - || - ||
 +
|-
 +
| Mn (manganese) || 140 W ||  - || - || - ||
 +
|-
 +
| [[Mo_master_recipe | Mo (molybdenum)]] || 450 W || 3 mTorr || 140 W || 1.9 Å s<sup>-1</sup> ||
 +
|-
 +
| Pd (palladium) || 140 W ||  - || - || - ||
 +
|-
 +
| [[Pt_master_recipe | Pt (platinum)]] || 140 W || 3 mTorr || 140 W || 2.6 Å s<sup>-1</sup> ||
 +
|-
 +
| i-Si (intrinsic silicon) || 140 W ||  - || - || - ||
 +
|-
 +
| n-Si (n-type silicon) || 280 W ||  - || - || - ||
 +
|-
 +
| p-Si (p-type silicon) || 280 W ||  - || - || - ||
 +
|-
 +
| [[Ti (titanium) | Ti (titanium)]] || 350 W || 3 mTorr || 350 W || 2.0 Å s<sup>-1</sup> ||
 +
|-
 +
| TiO<sub>2</sub> (titanium dioxide) || 140 W ||  - || - || - ||
 +
|-
 +
| [[W_master_recipe | W (tungsten)]] || 450 W ||  - || - || - ||
 +
|-
 +
| YSZ (yttria-stabilized zirconia) || 140 W ||  - || - || - ||
 
|-
 
|-
−
 
−
{{TargetTableItem|
 
−
|MaterialName = Silver
 
−
|Target = Ag
 
−
|MaxiumAllowedPower[W] = 450
 
−
}}
 
−
 
 
|}
 
|}
  
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===== SOPs & Troubleshooting =====
 
===== SOPs & Troubleshooting =====
−
* [https://repository.upenn.edu/scn_sop/8 SOP]
+
* [https://repository.upenn.edu/scn_sop/24/ SOP]
 +
* [https://upenn.box.com/s/xxo5dt2991cahd3wo71lq8cpzivpslid PVD-05 Target Lighting in Manual Mode]
 +
 
 +
<pdf height="800">File:PVD_05_SOP.pdf</pdf>
 +
 
 +
===== Target request form =====
 
* [https://docs.google.com/forms/d/e/1FAIpQLScwWE1RvqXfH9hwqrQcYDLpgN6L9uNGdaZlq5Hw3NjqXng30g/viewform Target Request Form]
 
* [https://docs.google.com/forms/d/e/1FAIpQLScwWE1RvqXfH9hwqrQcYDLpgN6L9uNGdaZlq5Hw3NjqXng30g/viewform Target Request Form]
 +
 +
== Master recipes ==
 +
 +
The listed master recipes are what we used to obtain the process data listed above. We highly recommend our users to use these recipes. However, since they are free to edit, please always double check that the recipe is correct by consulting the charts below.
 +
 +
Note that some recipes have both ramp-up and ramp-down steps. The deposition step can always be found by locating when the shutter is open. The post-deposition cool-down time will vary for different materials depending on their propensity for oxidation. For example, Ag has a long cool-down time of 15 minutes.
 +
 +
All recipes should not be run at base pressures higher than 5e-6 Torr.

Latest revision as of 08:56, 25 September 2024


Denton Explorer14 Magnetron Sputterer
PVD-05.jpeg
Tool Name Denton Explorer14 Magnetron Sputterer
Instrument Type Deposition
Staff Manager Sam Azadi
Lab Location Bay 2
Tool Manufacturer Denton
Tool Model Explorer14
NEMO Designation PVD-05
Lab Phone 215-898-9748
SOP Link SOP

Description

Tool overview

The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films (such as oxides). Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. The tool is an open load system in sputter-down configuration with one dedicated DC source and two sources that can use either a DC or RF power supply. Co-deposition from two DC sources or one DC and one RF source is possible, but it is recommended to run co-deposition on PVD-03 as the sources in this tool are not in confocal mode per default. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.

Maximum power

  • Maximum DC Power: 600 W.
  • Maximum RF Power: 200 W.

You can inflict serious damage to the power supplies if these values are exceeded.

Main differences between PVD-05 (this tool) and PVD-03

There are several differences between our two sputtering tools. Think carefully about what your needs are before deciding what tool to get trained on. If you're ever in doubt, consult with staff.

PVD-05
  • Large substrate platen that can hold several 4" wafers
  • Water-cooled platen
  • Three sputter sources (sputter down)
  • This tool cannot sputter magnetic materials
  • Open-load tool; requires at least one hour of pump-down
  • Co-deposition can be done, but is not recommended (sources not in confocal mode per default)
PVD-03
  • Small substrate platen that can hold one wafer up to 6"
  • Four sputter sources (sputter up)
  • This tool can sputter magnetic materials in source 2 and 4
  • Load-lock tool; it takes approximately 7 min to load your sample
  • This is our recommended tool for co-deposition as the sources are always confocal mode

For more information on PVD Equipment capabilities click here.

Process data & master recipes

All process data were recorded at a base pressure lower than 5 x 10-6 Torr; you can never exceed 200 W on RF and 600 W on DC.

Clicking on the material's name will take you to the master recipe.

Material name/link to master recipe Max power Process data Recorded Link to specs
Pressure Power Rate
Ag (silver) 450 W 3 mTorr 140 W 7.3 Å s-1
Al (aluminum) 450 W 3 mTorr 200 W 3.0 Å s-1
Au (gold) 140 W 3 mTorr 140 W 4.6 Å s-1
Cr (chromium) 450 W 3 mTorr 450 W 3.9 Å s-1
Cu (copper) 450 W 3 mTorr 400 W 6.4 Å s-1 Aug 18, 2023
Ge (germanium) 140 W - - -
ITO (Indium tin oxide) 140 W - - -
Mn (manganese) 140 W - - -
Mo (molybdenum) 450 W 3 mTorr 140 W 1.9 Å s-1
Pd (palladium) 140 W - - -
Pt (platinum) 140 W 3 mTorr 140 W 2.6 Å s-1
i-Si (intrinsic silicon) 140 W - - -
n-Si (n-type silicon) 280 W - - -
p-Si (p-type silicon) 280 W - - -
Ti (titanium) 350 W 3 mTorr 350 W 2.0 Å s-1
TiO2 (titanium dioxide) 140 W - - -
W (tungsten) 450 W - - -
YSZ (yttria-stabilized zirconia) 140 W - - -

Resources

SOPs & Troubleshooting

Target request form

Master recipes

The listed master recipes are what we used to obtain the process data listed above. We highly recommend our users to use these recipes. However, since they are free to edit, please always double check that the recipe is correct by consulting the charts below.

Note that some recipes have both ramp-up and ramp-down steps. The deposition step can always be found by locating when the shutter is open. The post-deposition cool-down time will vary for different materials depending on their propensity for oxidation. For example, Ag has a long cool-down time of 15 minutes.

All recipes should not be run at base pressures higher than 5e-6 Torr.

Retrieved from "https://wiki.nano.upenn.edu/wiki/index.php?title=Denton_Explorer14_Magnetron_Sputterer&oldid=2029"