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• Pt master recipe
  Step T006 is the deposition step.
  3 KB (213 words) - 12:32, 31 January 2023
• QNF Equipment Owner Matrix
  | Cambridge Nanotech S200 ALD || ALD-01 || Deposition || [[Sam Azadi | Sam Azadi]] | Ultratech Fiji G2 ALD || ALD-02 || Deposition || [[Sam Azadi | Sam Azadi]]
  6 KB (758 words) - 13:58, 18 April 2024
• QNF Staff
  |AreasResponsibility = Etch <br> Deposition
  2 KB (261 words) - 10:00, 10 May 2024
• Quattrone Nanofabrication Facility
  ...able of electron-beam and optical lithography, physical and chemical vapor deposition, dry and wet processing, metrology, and device characterization. The facili
  3 KB (385 words) - 16:25, 25 March 2024
• SCS PDS2010 Parylene Coater
  The SCS Labcoter 2 (PDS 2010) vacuum deposition system is specifically designed to bring Parylene technology to the laborat ...upenn.edu/scn_tooldata/45/ Characterization and Optimization of Parylene-C deposition process using SCS Parylene coater]
  1 KB (175 words) - 16:12, 12 March 2024
• SPTS/Xactix XeF2 Isotropic Etcher
  [[Category:Deposition]]
  1 KB (212 words) - 14:09, 3 January 2024
• SPTS Si DRIE
  ...eactive-ion_etching#Bosch_process Bosch process] consists of two steps: 1) Deposition of a passivation layer, using C4F8 gas. This passivation layer is a polymer
  2 KB (359 words) - 12:52, 29 April 2024
• SUSS MicroTec AS8 AltaSpray
  SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on differen
  2 KB (223 words) - 14:12, 3 January 2024
• Sam Azadi
  |AreasResponsibility = Etch, <br> Deposition
  1 KB (161 words) - 14:53, 29 April 2022
• Sandvik Furnace Stack
  [[Category:Deposition]] | Instrument_Type = Deposition
  2 KB (324 words) - 10:11, 29 January 2024
• TFS Quanta 600 FEG ESEM
  ...nical measurements, and gas injection systems for platinum and gold e-beam deposition.
  2 KB (271 words) - 16:29, 12 February 2024
• Ti (titanium)
  ===Deposition Equipment=== ===Sputter Deposition Rates===
  4 KB (384 words) - 14:54, 9 May 2024
• Ti master recipe
  Step T004 is the deposition step and step T005 is the cool-down step (60 s).
  2 KB (200 words) - 15:03, 30 January 2023
• Veeco Savannah 200
  [[Category:Deposition]] | Instrument_Type = Deposition
  2 KB (260 words) - 10:57, 20 March 2024
• W master recipe
  Step T010 is the deposition step.
  3 KB (210 words) - 13:39, 31 January 2023
• What is ALD?
  '''Atomic Layer Deposition (ALD)''' is a thin-film deposition technique used in the fabrication of semiconductor devices, microelectronic ALD offers several advantages over other thin-film deposition techniques, including precise thickness control at the atomic level, unifor
  2 KB (273 words) - 10:50, 5 April 2024
• What is Atomic Layer Deposition?
  '''Atomic Layer Deposition (ALD)''' is a thin-film deposition technique used in the fabrication of semiconductor devices, microelectronic ALD offers several advantages over other thin-film deposition techniques, including precise thickness control at the atomic level, unifor
  2 KB (261 words) - 11:22, 5 April 2024
• What is Chemical Vapor Deposition (CVD)?
  Chemical Vapor Deposition (CVD) is a thin-film deposition technique in which thin films are deposited onto a substrate surface throug ...face or with other reactive species present in the chamber, leading to the deposition of a thin film of material on the substrate.
  1 KB (186 words) - 13:14, 9 April 2024

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