Difference between revisions of "Photolithography"
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(adding equipment list, reformatting to match Soft Lithography page) |
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* '''LW-03:''' [[DMO MicroWriter ML3 Pro | DMO MicroWriter ML3 Pro ]] | * '''LW-03:''' [[DMO MicroWriter ML3 Pro | DMO MicroWriter ML3 Pro ]] | ||
* '''MA-01:''' [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]] | * '''MA-01:''' [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]] | ||
| − | * '''MA-03:''' [[ABM Mask Aligner | ABM Mask Aligner]] | + | * '''MA-03:''' [[ABM Mask Aligner | ABM Mask Aligner]] |
===== Resist Coating ===== | ===== Resist Coating ===== | ||
* '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]] | * '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]] | ||
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* '''SPN-03:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - LOR/PMGI]] | * '''SPN-03:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - LOR/PMGI]] | ||
* '''SPN-06:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - E-Beam Resist]] | * '''SPN-06:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - E-Beam Resist]] | ||
| − | * '''SPN-08:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Negative Epoxy]] | + | * '''SPN-08:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Negative Epoxy]] |
===Additional Information=== | ===Additional Information=== | ||
Revision as of 14:25, 26 August 2025
THIS PAGE IS UNDER CONSTRUCTION
About
Process Flow
QNF Example Protocols
Videos
Equipment at QNF
Patterning
- LW-01: Heidelberg DWL 66+ Laser Writer
- LW-02: Nanoscribe Photonic Professional GT
- LW-03: DMO MicroWriter ML3 Pro
- MA-01: SUSS MicroTec MA6 Gen3 Mask Aligner
- MA-03: ABM Mask Aligner
Resist Coating
- RC-01: SUSS MicroTec AS8 AltaSpray
- SPN-01: CEE Apogee Spinner - Acetone Soluble Photoresist
- SPN-03: CEE Apogee Spinner - LOR/PMGI
- SPN-06: CEE Apogee Spinner - E-Beam Resist
- SPN-08: CEE Apogee Spinner - Negative Epoxy
Additional Information
Related Wiki Pages
- How to Make a Mask
- Resists at QNF
- Developers at QNF -- Under Construction
- Ancillary Process Chemicals at QNF -- Under Construction
Internal Reports & Presentations
- Effect of Developer Temperature on Photoresist Contrast in Grayscale Lithography LW-01, SPR 220-3
- Optimization of Bilayer Lift-Off Process to Enable the Gap Size of 1μm Using LOR 3A and S1813
- Influence of flow rate, nozzle speed, pitch and the number of passes on the thickness of S1805 photoresist in SUSS MicroTec AS8 spray coater RC-01, S1805
- MicroChem S1818 Contrast Curve Optimization MA-01
- Correction of pattern size deviations in the fabrication of photomasks made with a laser direct-writer
- Surface Treatment and Adhesion Study
- Heidelberg DWL66+ S1805 Contrast Curves
- Heidelberg DWL66+ S1813 Contrast Curves
- MicroChem S1800 Series Resist Application onto Si