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| | | [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-7] || + || Ethyl lactate, anisole, n-amyl acetate || Etch, 6um-12um || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-03 || 0.24N TMAH or 0.26N TMAH || NMP || AZ 12XT, AZ P4620 | | | [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-7] || + || Ethyl lactate, anisole, n-amyl acetate || Etch, 6um-12um || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-03 || 0.24N TMAH or 0.26N TMAH || NMP || AZ 12XT, AZ P4620 |
| | |- | | |- |
| − | | [https://upenn.box.com/s/xb5pfl6zbb1eynl6oyerrub0lw3xh3n7 AZ 3330F] || + || PGMEA || General, Metal RIE, Plating || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-03 || 0.26N TMAH (AZ300MIF) or AZ400K 1:4 (potassium salts) || || SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003 | + | | [https://upenn.box.com/s/xb5pfl6zbb1eynl6oyerrub0lw3xh3n7 AZ 3330F] || + || PGMEA || General, Metal RIE, Plating || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-03 || 0.26N TMAH (AZ300MIF) or alkaline salts (AZ400K 1:4) || || SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003 |
| | |- | | |- |
| | | [https://upenn.box.com/s/lff7qf7wq9cn1ny8bytf0e8d87ddjit0 NR7-3000P] || - || Cyclohexanone || Etch, General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01] || 0.24N or 0.26N TMAH || || | | | [https://upenn.box.com/s/lff7qf7wq9cn1ny8bytf0e8d87ddjit0 NR7-3000P] || - || Cyclohexanone || Etch, General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01] || 0.24N or 0.26N TMAH || || |
Revision as of 12:47, 3 July 2023
The QNF provides a variety of standard resists to meet demands for most applications. Some specialty resists are also sold through the QNF Stockroom. A summary of stocked resists along with some processing information can be found in the table below. Click on the resist name to access the datasheet. Other similar options that may be available in QNF are also listed.
QNF Supplied Standard Photoresists
| Name / Datasheet |
Tone |
Composition |
Use / Thickness |
Tool Compatibility |
Developer |
Remover |
Alternative Resists
|
| S1805 |
+ |
PGMEA |
General |
MA-01, LW-01, SPN-03 |
0.24N TMAH |
NMP |
KL5305
|
| S1813 |
+ |
PGMEA |
General, 1um-1.3um |
MA-01, LW-01, SPN-03 |
0.24N TMAH |
NMP |
KL5315
|
| S1818 |
+ |
PGMEA |
General |
MA-01, LW-01, SPN-03 |
0.24N TMAH |
NMP |
|
| SPR 220-3 |
+ |
Ethyl lactate, anisole, n-amyl acetate |
Etch, 2um-5um |
MA-01, SPN-03 |
0.24N TMAH |
NMP |
KPRO-3, KL6003, AZ3330F
|
| SPR 220-4.5 |
+ |
Ethyl lactate, anisole, n-amyl acetate |
Etch |
MA-01, SPN-03 |
0.24N TMAH |
NMP |
KPRO-3, KL6003, AZ3330F
|
| SPR 220-7 |
+ |
Ethyl lactate, anisole, n-amyl acetate |
Etch, 6um-12um |
MA-01, SPN-03 |
0.24N TMAH or 0.26N TMAH |
NMP |
AZ 12XT, AZ P4620
|
| AZ 3330F |
+ |
PGMEA |
General, Metal RIE, Plating |
MA-01, SPN-03 |
0.26N TMAH (AZ300MIF) or alkaline salts (AZ400K 1:4) |
|
SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003
|
| NR7-3000P |
- |
Cyclohexanone |
Etch, General |
MA-01 |
0.24N or 0.26N TMAH |
|
|
| APOL-LO 3202 |
- |
PGMEA |
Liftoff |
MA-01 |
0.26N TMAH |
NMP |
|
| IP-Dip |
- |
Ethoxylated acrylates |
Nanoscribe, Epoxy |
LW-02 |
PGMEA, IPA |
|
|
| HARE SQ 2 |
- |
Cyclopentanone, gamma butyro lactone |
Epoxy |
SPN-07, MA-03 |
PGMEA (SQ Developer) |
N/A |
SU-8 2005
|
| HARE SQ 50 |
- |
Cyclopentanone, gamma butyro lactone |
Epoxy |
SPN-07, MA-03 |
PGMEA (SQ Developer) |
N/A |
SU-8 2050
|
Stockroom Photoresists
| Name / Datasheet |
Tone |
Composition |
Use / Thickness |
Tool Compatibility |
Developer |
Remover |
Alternative Resists
|
| SU-8 2005 |
- |
Cyclopentanone |
Epoxy, 4um-7um |
SPN-07, MA-03 |
PGMEA (SU-8 Developer) |
N/A |
HARE SQ 2
|
| SU-8 2050 |
- |
Cyclopentanone |
Epoxy, 40um-170um |
SPN-07, MA-03 |
PGMEA (SU-8 Developer) |
N/A |
HARE SQ 50
|
| SU-8 2100 |
- |
Cyclopentanone |
Epoxy, 100um-270um |
SPN-07, MA-03 |
PGMEA (SU-8 Developer) |
N/A |
HARE SQ 50
|
| SU-8 3050 |
- |
Cyclopentanone |
Epoxy, 40um-100um |
SPN-07, MA-03 |
PGMEA (SU-8 Developer) |
N/A |
HARE SQ 50
|
Standard e-beam Resists
| Name / Datasheet |
Tone |
Composition |
Use / Thickness |
Tool Compatibility |
Developer |
Remover |
Alternative Resists
|
| 495 PMMA A8 |
+ |
Anisole |
Lower Resolution |
EBL-01, SPN-06 |
1:3 MIBK/IPA |
NMP |
|
| 495 PMMA A4 |
+ |
Anisole |
Lower Resolution, 180nm-300nm |
EBL-01, SPN-06 |
1:3 MIBK/IPA |
NMP |
|
| 495 PMMA A2 |
+ |
Anisole |
Lower Resolution, 50nm-100nm |
EBL-01, SPN-06 |
1:3 MIBK/IPA |
NMP |
|
| 950 PMMA A4 |
+ |
Anisole |
High Resolution, 200nm-400nm |
EBL-01, SPN-06 |
1:3 MIBK/IPA |
NMP |
|
| 950 PMMA A2 |
+ |
Anisole |
High Resolution, 50nm-100nm |
EBL-01, SPN-06 |
1:3 MIBK/IPA |
NMP |
1000 HARP 0.1
|
| 1000 HARP 1.3 |
+ |
Anisole |
High Resolution |
EBL-01, SPN-06 |
1:3 MIBK/IPA |
NMP |
|
| 1000 HARP 0.1 |
+ |
Anisole |
High Resolution |
EBL-01, SPN-06 |
1:3 MIBK/IPA |
NMP |
950 PMMA A2
|
Stockroom e-beam Resists
| Name / Datasheet |
Tone |
Composition |
Use / Thickness |
Tool Compatibility |
Developer |
Remover
|
| ZEP 520A |
+ |
Anisole |
Thicker formulation |
EBL-01, SPN-06 |
Xylenes, Amyl acetate or MIBK |
NMP
|
| ZEP 520A-7 |
+ |
Anisole |
Thinner formulation |
EBL-01, SPN-06 |
Xylenes, Amyl acetate or MIBK |
NMP
|
| H-SiQ 6% |
- |
MIBK |
HSQ Equivalent |
EBL-01, SPN-06 |
0.26N TMAH |
|
Other Resists
| Name / Datasheet |
Tone |
Composition |
Use / Thickness |
Tool Compatibility |
Developer |
Remover
|
| LOR 3A |
N/A |
Cyclopentanone, PGME |
Liftoff, Non-imaging |
Keep away from acetone & PGMEA |
0.24N TMAH, 0.26N TMAH |
1165 or Remover PG (NMP)
|
| PMGI SF 5S |
N/A |
Cyclopentanone, PGME |
Liftoff, Non-imaging |
Keep away from acetone & PGMEA |
0.24N TMAH, 0.26N TMAH |
1165 or Remover PG (NMP)
|
| PMGI SF 2S |
N/A |
Cyclopentanone, PGME |
Liftoff, Non-imaging |
Keep away from acetone & PGMEA |
0.24N TMAH, 0.26N TMAH |
1165 or Remover PG (NMP)
|
| NXR-1025 |
N/A |
|
Stockroom, Nanoimprint |
MA-02 |
|
Miscellaneous
These may be available but are not guaranteed to be stocked
| Name / Datasheet |
Tone |
Composition |
Use / Thickness |
Tool Compatibility |
Developer |
Remover |
Alternative Resists
|
| KL5305 |
+ |
PGMEA |
General |
|
0.26N TMAH |
NMP |
S1805
|
| KL5315 |
+ |
PGMEA |
General |
|
0.26N TMAH |
NMP |
S1813
|
| KL6003 |
+ |
PGMEA |
|
|
0.26N TMAH |
NMP |
SPR 220-3, SPR 220-4.5
|
| K-PRO 3 |
+ |
PGMEA |
Plating, Etching |
|
0.26N TMAH or alkaline salts |
NMP |
SPR 220-3, SPR 220-4.5
|
| AZ 12XT-20PL-15 |
+ |
PGMEA |
CAR (i-line), Plating, Packaging, Deep Etch, 10um-25um |
|
0.26N TMAH (AZ300MIF) |
|
SPR 220-7, AZ P4620
|
| AZ P4620 |
+ |
PGMEA |
Thick Resist, Plating, Packaging |
|
0.26N TMAH (AZ300MIF) or alkaline salts (AZ400K 1:4) |
|
SPR 220-7, AZ 12XT-20PL-15
|
| ma-N 2403 |
- |
|
e-beam/DUV Mix and Match |
|
|
|
|