Difference between revisions of "Resists at QNF"

Revision as of 15:58, 30 June 2023

The QNF provides a variety of standard resists to meet demands for most applications. Some specialty resists are also sold through the QNF Stockroom. A summary of stocked resists along with some processing information can be found in the table below. Click on the resist name to access the datasheet. Other similar options that may be available in QNF are also listed.

QNF Supplied Standard Photoresists

Name / Datasheet	Tone	Composition	Use / Thickness	Tool Compatibility	Developer	Remover	Alternative Resists
S1805	+	PGMEA	General	MA-01, LW-01, SPN-03	MF-319 (0.24N TMAH)	MP 1165 (NMP)	KL5305
S1813	+	PGMEA	General, 1um-1.3um	MA-01, LW-01, SPN-03	MF-319 (0.24N TMAH)	MP 1165 (NMP)	KL5315
S1818	+	PGMEA	General	MA-01, LW-01, SPN-03	MF-319 (0.24N TMAH)	MP 1165 (NMP)
SPR 220-3	+	Ethyl lactate, anisole, n-amyl acetate	Etch, 2um-5um	MA-01, SPN-03	0.24N TMAH	MP 1165 (NMP)	KPRO-3, KL6003, AZ3330F
SPR 220-4.5	+	Ethyl lactate, anisole, n-amyl acetate	Etch	MA-01, SPN-03	0.24N TMAH	MP 1165 (NMP)	KPRO-3, KL6003, AZ3330F
SPR 220-7	+	Ethyl lactate, anisole, n-amyl acetate	Etch, 6um-12um	MA-01, SPN-03	0.24N TMAH or 0.26N TMAH	MP 1165 (NMP)	AZ 12XT, AZ P4620
AZ 3330F	+	PGMEA	General, Metal RIE, Plating	MA-01, SPN-03	AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts)		SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003
NR7-3000P	-	Cyclohexanone	Etch, General	MA-01	RD6 (0.24N or 0.26N TMAH)	RR4 (DMSO), Acetone
APOL-LO 3202	-	PGMEA	Liftoff	MA-01	0.26N TMAH	NMP, DMSO
IP-Dip	-	Ethoxylated acrylates	Nanoscribe, Epoxy	LW-02	PGMEA, IPA
HARE SQ 2	-	Cyclopentanone, gamma butyro lactone	Epoxy	SPN-07, MA-03	PGMEA	N/A	SU-8 2005
HARE SQ 50	-	Cyclopentanone, gamma butyro lactone	Epoxy	SPN-07, MA-03	PGMEA	N/A	SU-8 2050

Stockroom Photoresists

Name / Datasheet	Tone	Composition	Use / Thickness	Tool Compatibility	Developer	Remover	Alternative Resists
SU-8 2005	-	Cyclopentanone	Epoxy, 4um-7um	SPN-07, MA-03	SU-8 Developer (PGMEA)	N/A	HARE SQ 2
SU-8 2050	-	Cyclopentanone	Epoxy, 40um-170um	SPN-07, MA-03	SU-8 Developer (PGMEA)	N/A	HARE SQ 50
SU-8 2100	-	Cyclopentanone	Epoxy	SPN-07, MA-03	SU-8 Developer (PGMEA)	N/A	HARE SQ 50
SU-8 3050	-	Cyclopentanone	Epoxy	SPN-07, MA-03	SU-8 Developer (PGMEA)	N/A	HARE SQ 50

Standard e-beam Resists

Name / Datasheet	Tone	Composition	Use / Thickness	Tool Compatibility	Developer	Remover	Alternative Resists
495 PMMA A8	+	Anisole	Lower Resolution	EBL-01, SPN-06	MIBK	NMP
495 PMMA A4	+	Anisole	Lower Resolution, 180nm-300nm	EBL-01, SPN-06	MIBK	NMP
495 PMMA A2	+	Anisole	Lower Resolution, 50nm-100nm	EBL-01, SPN-06	MIBK	NMP
950 PMMA A4	+	Anisole	High Resolution, 200nm-400nm	EBL-01, SPN-06	MIBK	NMP
950 PMMA A2	+	Anisole	High Resolution, 50nm-100nm	EBL-01, SPN-06	MIBK	NMP	1000 HARP 0.1
1000 HARP 1.3	+	Anisole	High Resolution	EBL-01, SPN-06	MIBK	NMP
1000 HARP 0.1	+	Anisole	High Resolution	EBL-01, SPN-06	MIBK	NMP	950 PMMA A2

Stockroom e-beam Resists

Name / Datasheet	Tone	Composition	Use / Thickness	Tool Compatibility	Developer	Remover
ZEP 520A	+	Anisole	Thicker formulation	EBL-01, SPN-06	Xylenes, n-amyl acetate or MIBK	NMP
ZEP 520A-7	+	Anisole	Thinner formulation	EBL-01, SPN-06	Xylenes, n-amyl acetate or MIBK	NMP
H-SiQ 6%	-	MIBK	HSQ Equivalent	EBL-01, SPN-06	TMAH

Other Resists

Name / Datasheet	Tone	Composition	Use / Thickness	Tool Compatibility	Developer	Remover
LOR 3A	N/A	Cyclopentanone, PGME	Liftoff, Non-imaging	Keep away from acetone & PGMEA	0.24N TMAH, 0.26N TMAH	1165 or Remover PG (NMP)
PMGI SF 5S	N/A	Cyclopentanone, PGME	Liftoff, Non-imaging	Keep away from acetone & PGMEA	0.24N TMAH, 0.26N TMAH	1165 or Remover PG (NMP)
PMGI SF 2S	N/A	Cyclopentanone, PGME	Liftoff, Non-imaging	Keep away from acetone & PGMEA	0.24N TMAH, 0.26N TMAH	1165 or Remover PG (NMP)
NXR-1025	N/A		Stockroom, Nanoimprint	MA-02

Miscellaneous

These may be available but are not guaranteed to be stocked

Name / Datasheet	Tone	Composition	Use / Thickness	Developer	Remover	Alternative Resists
KL5305	+	PGMEA	General	0.26N TMAH	NMP, DMSO	S1805
KL5315	+	PGMEA	General	0.26N TMAH	NMP, DMSO	S1813
KL6003	+	PGMEA		0.26N TMAH	NMP, DMSO	SPR 220-3, SPR 220-4.5
K-PRO 3	+	PGMEA	Plating, Etching	0.26N TMAH or alkaline salts	NMP, DMSO	SPR 220-3, SPR 220-4.5
AZ 12XT-20PL-15	+	PGMEA	CAR (i-line), Plating, Packaging, Deep Etch, 10um-25um	AZ300 (0.26N TMAH)		SPR 220-7, AZ P4620
AZ P4620	+	PGMEA	Thick Resist, Plating, Packaging	AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts)		SPR 220-7, AZ 12XT-20PL-15
ma-N 2403	-		e-beam/DUV Mix and Match

@@ Line 7: / Line 7: @@
 | [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1805] || + || PGMEA || General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], [https://wiki.nano.upenn.edu/wiki/index.php?title=Heidelberg_DWL_66%2B_Laser_Writer LW-01], SPN-03 || MF-319 (0.24N TMAH) || MP 1165 (NMP) || KL5305
 |-
-| [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1813] || + || PGMEA || General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], [https://wiki.nano.upenn.edu/wiki/index.php?title=Heidelberg_DWL_66%2B_Laser_Writer LW-01], SPN-03 || MF-319 (0.24N TMAH) || MP 1165 (NMP) || KL5315
+| [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1813] || + || PGMEA || General, 1um-1.3um || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], [https://wiki.nano.upenn.edu/wiki/index.php?title=Heidelberg_DWL_66%2B_Laser_Writer LW-01], SPN-03 || MF-319 (0.24N TMAH) || MP 1165 (NMP) || KL5315
 |-
 | [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1818] || + || PGMEA || General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], [https://wiki.nano.upenn.edu/wiki/index.php?title=Heidelberg_DWL_66%2B_Laser_Writer LW-01], SPN-03 || MF-319 (0.24N TMAH) || MP 1165 (NMP) ||
 |-
-| [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-3] || + || Ethyl lactate, anisole, n-amyl acetate || Etch || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-03 || 0.24N TMAH || MP 1165 (NMP) || KPRO-3, KL6003, AZ3330F
+| [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-3] || + || Ethyl lactate, anisole, n-amyl acetate || Etch, 2um-5um || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-03 || 0.24N TMAH || MP 1165 (NMP) || KPRO-3, KL6003, AZ3330F
 |-
 | [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-4.5] || + || Ethyl lactate, anisole, n-amyl acetate || Etch || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-03 || 0.24N TMAH || MP 1165 (NMP) || KPRO-3, KL6003, AZ3330F
 |-
-| [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-7] || + || Ethyl lactate, anisole, n-amyl acetate || Etch || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-03  || 0.24N TMAH or 0.26N TMAH || MP 1165 (NMP) || AZ 12XT, AZ P4620
+| [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-7] || + || Ethyl lactate, anisole, n-amyl acetate || Etch, 6um-12um || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-03  || 0.24N TMAH or 0.26N TMAH || MP 1165 (NMP) || AZ 12XT, AZ P4620
 |-
 | [https://upenn.box.com/s/xb5pfl6zbb1eynl6oyerrub0lw3xh3n7 AZ 3330F] || + || PGMEA || General, Metal RIE, Plating  || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-03 || AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts) || || SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003
@@ Line 34: / Line 34: @@
 ! Name / Datasheet !! Tone !! Composition !! Use / Thickness !! Tool Compatibility !! Developer !! Remover !! Alternative Resists
 |-
-| [https://upenn.box.com/s/f9oi75p3p84rdtpqq5unp0j1c3mqxjrd SU-8 2005] || - || Cyclopentanone || Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07], [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03] || SU-8 Developer (PGMEA) || N/A || HARE SQ 2
+| [https://upenn.box.com/s/f9oi75p3p84rdtpqq5unp0j1c3mqxjrd SU-8 2005] || - || Cyclopentanone || Epoxy, 4um-7um || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07], [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03] || SU-8 Developer (PGMEA) || N/A || HARE SQ 2
 |-
-| [https://upenn.box.com/s/s4noknbqlyh8inq3gqycw115b7ufdibu SU-8 2050] || - || Cyclopentanone || Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07], [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03] || SU-8 Developer (PGMEA) || N/A || HARE SQ 50
+| [https://upenn.box.com/s/s4noknbqlyh8inq3gqycw115b7ufdibu SU-8 2050] || - || Cyclopentanone || Epoxy, 40um-170um || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07], [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03] || SU-8 Developer (PGMEA) || N/A || HARE SQ 50
 |-
 | [https://upenn.box.com/s/va40gxhk7ghwl8p9hhsyvr0rairc9v1e SU-8 2100] || - || Cyclopentanone || Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07], [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03] || SU-8 Developer (PGMEA) || N/A || HARE SQ 50
@@ Line 49: / Line 49: @@
 | [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 495 PMMA A8] || + || Anisole || Lower Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP ||
 |-
-| [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 495 PMMA A4] || + || Anisole || Lower Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP ||
+| [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 495 PMMA A4] || + || Anisole || Lower Resolution, 180nm-300nm || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP ||
 |-
-| [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 495 PMMA A2] || + || Anisole || Lower Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP ||
+| [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 495 PMMA A2] || + || Anisole || Lower Resolution, 50nm-100nm || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP ||
 |-
-| [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 950 PMMA A4] || + || Anisole || High Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP ||
+| [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 950 PMMA A4] || + || Anisole || High Resolution, 200nm-400nm || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP ||
 |-
-| [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 950 PMMA A2] || + || Anisole || High Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP || 1000 HARP 0.1
+| [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 950 PMMA A2] || + || Anisole || High Resolution, 50nm-100nm || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP || 1000 HARP 0.1
 |-
 | [https://upenn.box.com/s/re1sz5cil83m99yv3ug2p9p8ghk3a3vm 1000 HARP 1.3] || + || Anisole || High Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP ||
@@ Line 100: / Line 100: @@
 | [https://upenn.box.com/s/v0hwe0p0u3la1oodz3g45qjw0yl54z7f K-PRO 3] || + || PGMEA || Plating, Etching || || 0.26N TMAH or alkaline salts || NMP, DMSO || SPR 220-3, SPR 220-4.5
 |-
-| [https://upenn.box.com/s/dj5l9rrsg0k8g8opdegrylhkgypev9w9 AZ 12XT-20PL-15] || + || PGMEA || CAR (i-line), Plating, Packaging, Deep Etch  || || AZ300 (0.26N TMAH) || || SPR 220-7, AZ P4620
+| [https://upenn.box.com/s/dj5l9rrsg0k8g8opdegrylhkgypev9w9 AZ 12XT-20PL-15] || + || PGMEA || CAR (i-line), Plating, Packaging, Deep Etch, 10um-25um  || || AZ300 (0.26N TMAH) || || SPR 220-7, AZ P4620
 |-
 | [https://upenn.box.com/s/0r8meepoyq0b1jux7ubudcpt70clau48 AZ P4620] || + || PGMEA || Thick Resist, Plating, Packaging || || AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts) || || SPR 220-7, AZ 12XT-20PL-15