Difference between revisions of "Resists at QNF"
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| [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1805] || + || PGMEA || General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], [https://wiki.nano.upenn.edu/wiki/index.php?title=Heidelberg_DWL_66%2B_Laser_Writer LW-01], SPN-01, SPN-03 || TMAH || NMP || KL5305 | | [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1805] || + || PGMEA || General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], [https://wiki.nano.upenn.edu/wiki/index.php?title=Heidelberg_DWL_66%2B_Laser_Writer LW-01], SPN-01, SPN-03 || TMAH || NMP || KL5305 | ||
|- | |- | ||
− | | [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1813] || + || PGMEA || General, 1um-1.3um || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], [https://wiki.nano.upenn.edu/wiki/index.php?title=Heidelberg_DWL_66%2B_Laser_Writer LW-01], SPN-01, SPN-03 || TMAH || NMP || KL5315 | + | | [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1813] || + || PGMEA || General, 1um-1.3um || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], [https://wiki.nano.upenn.edu/wiki/index.php?title=Heidelberg_DWL_66%2B_Laser_Writer LW-01], SPN-01, SPN-03, RC-01 || TMAH || NMP || KL5315 |
|- | |- | ||
| [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1818] || + || PGMEA || General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], [https://wiki.nano.upenn.edu/wiki/index.php?title=Heidelberg_DWL_66%2B_Laser_Writer LW-01], SPN-01, SPN-03 || TMAH || NMP || | | [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1818] || + || PGMEA || General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], [https://wiki.nano.upenn.edu/wiki/index.php?title=Heidelberg_DWL_66%2B_Laser_Writer LW-01], SPN-01, SPN-03 || TMAH || NMP || | ||
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| [https://upenn.box.com/s/xb5pfl6zbb1eynl6oyerrub0lw3xh3n7 AZ 3330F] || + || PGMEA || General, Metal RIE, Plating || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-01, SPN-03 || TMAH or AZ400K 1:4 || || SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003 | | [https://upenn.box.com/s/xb5pfl6zbb1eynl6oyerrub0lw3xh3n7 AZ 3330F] || + || PGMEA || General, Metal RIE, Plating || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-01, SPN-03 || TMAH or AZ400K 1:4 || || SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003 | ||
|- | |- | ||
− | | [https://upenn.box.com/s/lff7qf7wq9cn1ny8bytf0e8d87ddjit0 NR7-3000P] || - || Cyclohexanone || Etch, General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-04 || TMAH || || | + | | [https://upenn.box.com/s/lff7qf7wq9cn1ny8bytf0e8d87ddjit0 NR7-3000P] || - || Cyclohexanone || Etch, General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-01, SPN-03, SPN-04 || TMAH || || |
|- | |- | ||
− | | [https://upenn.box.com/s/1nocyldqmocrqmz1gjcwry8n86m9khtu APOL-LO 3202] || - || PGMEA || Liftoff || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01] || TMAH || NMP || | + | | [https://upenn.box.com/s/1nocyldqmocrqmz1gjcwry8n86m9khtu APOL-LO 3202] || - || PGMEA || Liftoff || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-01, SPN-03, SPN-04, RC-01 || TMAH || NMP || |
|- | |- | ||
− | | IP-Dip || - || Ethoxylated acrylates || Nanoscribe, Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Nanoscribe_Photonic_Professional_GT LW-02] || PGMEA, IPA || N/A || | + | | IP-Dip || - || Ethoxylated acrylates || Nanoscribe, Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Nanoscribe_Photonic_Professional_GT LW-02] || PGMEA (SU-8 or HARE SQ Developer), IPA || N/A || |
|- | |- | ||
− | | [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 2] || - || Cyclopentanone, gamma butyro lactone|| Epoxy, 2um-5um || [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03], SPN-04, [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07] || PGMEA (SU-8 or SQ Developer) || N/A || SU-8 2005 | + | | [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 2] || - || Cyclopentanone, gamma butyro lactone|| Epoxy, 2um-5um || [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03], SPN-04, SPN-08 [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07] || PGMEA (SU-8 or HARE SQ Developer), IPA || N/A || SU-8 2005 |
|- | |- | ||
− | | [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 50] || - || Cyclopentanone, gamma butyro lactone || Epoxy, 25um-100um || [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03], SPN-04, [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07] || PGMEA (SU-8 or SQ Developer) || N/A || SU-8 2050 | + | | [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 50] || - || Cyclopentanone, gamma butyro lactone || Epoxy, 25um-100um || [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03], SPN-04, SPN-08, [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07] || PGMEA (SU-8 or HARE SQ Developer), IPA || N/A || SU-8 2050 |
|} | |} | ||
Revision as of 12:57, 28 March 2024
The QNF provides a variety of standard resists to meet demands for most applications. Some specialty resists are also sold through the QNF Stockroom. A summary of stocked resists along with some processing information can be found in the table below. Click on the resist name to access the datasheet. Other similar options that may be available in QNF are also listed.
QNF Supplied Standard Photoresists
Name / Datasheet | Tone | Solvent Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
S1805 | + | PGMEA | General | MA-01, LW-01, SPN-01, SPN-03 | TMAH | NMP | KL5305 |
S1813 | + | PGMEA | General, 1um-1.3um | MA-01, LW-01, SPN-01, SPN-03, RC-01 | TMAH | NMP | KL5315 |
S1818 | + | PGMEA | General | MA-01, LW-01, SPN-01, SPN-03 | TMAH | NMP | |
SPR 220-3 | + | Ethyl lactate, anisole, n-amyl acetate | Etch, 2um-5um | MA-01, SPN-01, SPN-03 | TMAH | NMP | KPRO-3, KL6003, AZ3330F |
SPR 220-4.5 | + | Ethyl lactate, anisole, n-amyl acetate | Etch | MA-01, SPN-01, SPN-03 | TMAH | NMP | KPRO-3, KL6003, AZ3330F |
SPR 220-7 | + | Ethyl lactate, anisole, n-amyl acetate | Etch, 6um-12um | MA-01, SPN-01, SPN-03 | TMAH | NMP | AZ 12XT, AZ P4620 |
AZ 3330F | + | PGMEA | General, Metal RIE, Plating | MA-01, SPN-01, SPN-03 | TMAH or AZ400K 1:4 | SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003 | |
NR7-3000P | - | Cyclohexanone | Etch, General | MA-01, SPN-01, SPN-03, SPN-04 | TMAH | ||
APOL-LO 3202 | - | PGMEA | Liftoff | MA-01, SPN-01, SPN-03, SPN-04, RC-01 | TMAH | NMP | |
IP-Dip | - | Ethoxylated acrylates | Nanoscribe, Epoxy | LW-02 | PGMEA (SU-8 or HARE SQ Developer), IPA | N/A | |
HARE SQ 2 | - | Cyclopentanone, gamma butyro lactone | Epoxy, 2um-5um | MA-03, SPN-04, SPN-08 SPN-07 | PGMEA (SU-8 or HARE SQ Developer), IPA | N/A | SU-8 2005 |
HARE SQ 50 | - | Cyclopentanone, gamma butyro lactone | Epoxy, 25um-100um | MA-03, SPN-04, SPN-08, SPN-07 | PGMEA (SU-8 or HARE SQ Developer), IPA | N/A | SU-8 2050 |
Stockroom Photoresists
Name / Datasheet | Tone | Solvent Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
SU-8 2005 | - | Cyclopentanone | Epoxy, 4um-7um | MA-03, SPN-04, SPN-07 | PGMEA (SU-8 or SQ Developer) | N/A | HARE SQ 2 |
SU-8 2050 | - | Cyclopentanone | Epoxy, 40um-170um | MA-03, SPN-04, SPN-07 | PGMEA (SU-8 or SQ Developer) | N/A | HARE SQ 50 |
SU-8 2100 | - | Cyclopentanone | Epoxy, 100um-270um | MA-03, SPN-04, SPN-07 | PGMEA (SU-8 or SQ Developer) | N/A | HARE SQ 50 |
SU-8 3050 | - | Cyclopentanone | Epoxy, 40um-100um | MA-03, SPN-04, SPN-07, | PGMEA (SU-8 or SQ Developer) | N/A | HARE SQ 50 |
Standard e-beam Resists
Name / Datasheet | Tone | Solvent Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
495 PMMA A8 | + | Anisole | Lower Resolution | EBL-01, SPN-06 | 3:1 IPA/H2O | NMP | |
495 PMMA A4 | + | Anisole | Lower Resolution, 180nm-300nm | EBL-01, SPN-06 | 3:1 IPA/H2O | NMP | |
495 PMMA A2 | + | Anisole | Lower Resolution, 50nm-100nm | EBL-01, SPN-06 | 3:1 IPA/H2O | NMP | |
950 PMMA A4 | + | Anisole | High Resolution, 200nm-400nm | EBL-01, SPN-06 | 3:1 IPA/H2O | NMP | |
950 PMMA A2 | + | Anisole | High Resolution, 50nm-100nm | EBL-01, SPN-06 | 3:1 IPA/H2O | NMP | 1000 HARP 0.1 |
1000 HARP 1.3 | + | Anisole | High Resolution | EBL-01, SPN-06 | 3:1 IPA/H2O | NMP | |
1000 HARP 0.1 | + | Anisole | High Resolution | EBL-01, SPN-06 | 3:1 IPA/H2O | NMP | 950 PMMA A2 |
Stockroom e-beam Resists
Name / Datasheet | Tone | Solvent Composition | Use / Thickness | Tool Compatibility | Developer | Remover |
---|---|---|---|---|---|---|
ZEP 520A | + | Anisole | Thicker formulation | EBL-01, SPN-06 | Xylenes or Amyl acetate | NMP |
ZEP 520A-7 | + | Anisole | Thinner formulation | EBL-01, SPN-06 | Xylenes or Amyl acetate | NMP |
H-SiQ 6% | - | MIBK | HSQ Equivalent | EBL-01, SPN-06 | TMAH |
Other Resists
Name / Datasheet | Tone | Solvent Composition | Use / Thickness | Tool Compatibility | Developer | Remover |
---|---|---|---|---|---|---|
LOR 3A | N/A | Cyclopentanone, PGME | Liftoff, Non-imaging | SPN-03, Keep away from acetone & PGMEA! | TMAH | NMP |
PMGI SF 5S | N/A | Cyclopentanone, PGME | Liftoff, Non-imaging | SPN-03, Keep away from acetone & PGMEA! | TMAH | NMP |
PMGI SF 2S | N/A | Cyclopentanone, PGME | Liftoff, Non-imaging | SPN-03, Keep away from acetone & PGMEA! | TMAH | NMP |
NXR-1025 | N/A | Proprietary | Stockroom, Nanoimprint | MA-02 |
Miscellaneous
These may be available but are not guaranteed to be stocked
Name / Datasheet | Tone | Solvent Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
KL5305 | + | PGMEA | General | MA-01, SPN-01, SPN-03 | TMAH | NMP | S1805 |
KL5315 | + | PGMEA | General | MA-01, SPN-01, SPN-03 | TMAH | NMP | S1813 |
KL6003 | + | PGMEA | MA-01, SPN-01, SPN-03 | TMAH | NMP | SPR 220-3, SPR 220-4.5 | |
K-PRO 3 | + | PGMEA | Plating, Etching | MA-01, SPN-01, SPN-03 | TMAH or AZ400K 1:4 | NMP | SPR 220-3, SPR 220-4.5 |
AZ 12XT-20PL-15 | + | PGMEA | CAR (i-line), Plating, Packaging, Deep Etch, 10um-25um | MA-01, SPN-01, SPN-03 | TMAH | SPR 220-7, AZ P4620 | |
AZ P4620 | + | PGMEA | Thick Resist, Plating, Packaging | MA-01, SPN-01, SPN-03 | TMAH or AZ400K 1:4 | SPR 220-7, AZ 12XT-20PL-15 | |
ma-N 2403 | - | NMP, Butyl acetate, Cyclohexanone | e-beam/DUV Mix and Match | EBL-01, SPN-06 |