Difference between revisions of "Resists at QNF"

From Quattrone Nanofabrication Facility
Jump to navigation Jump to search
Line 19: Line 19:
 
| [https://upenn.box.com/s/xb5pfl6zbb1eynl6oyerrub0lw3xh3n7 AZ 3330F] || + || PGMEA || General, Metal RIE, Plating  || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-03 || AZ300MIF (0.26N TMAH) or AZ400K 1:4 (potassium salts) || || SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003
 
| [https://upenn.box.com/s/xb5pfl6zbb1eynl6oyerrub0lw3xh3n7 AZ 3330F] || + || PGMEA || General, Metal RIE, Plating  || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01], SPN-03 || AZ300MIF (0.26N TMAH) or AZ400K 1:4 (potassium salts) || || SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003
 
|-
 
|-
−
| [https://upenn.box.com/s/lff7qf7wq9cn1ny8bytf0e8d87ddjit0 NR7-3000P] || - || Cyclohexanone || Etch, General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01] || 0.24N or 0.26N TMAH || Acetone ||  
+
| [https://upenn.box.com/s/lff7qf7wq9cn1ny8bytf0e8d87ddjit0 NR7-3000P] || - || Cyclohexanone || Etch, General || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01] || 0.24N or 0.26N TMAH || ||  
 
|-
 
|-
 
|  [https://upenn.box.com/s/1nocyldqmocrqmz1gjcwry8n86m9khtu APOL-LO 3202] || - || PGMEA || Liftoff || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01] || 0.26N TMAH || NMP ||
 
|  [https://upenn.box.com/s/1nocyldqmocrqmz1gjcwry8n86m9khtu APOL-LO 3202] || - || PGMEA || Liftoff || [https://wiki.nano.upenn.edu/wiki/index.php?title=SUSS_MicroTec_MA6_Gen3_Mask_Aligner MA-01] || 0.26N TMAH || NMP ||
Line 25: Line 25:
 
| IP-Dip || - || Ethoxylated acrylates || Nanoscribe, Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Nanoscribe_Photonic_Professional_GT LW-02] || PGMEA, IPA || ||  
 
| IP-Dip || - || Ethoxylated acrylates || Nanoscribe, Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Nanoscribe_Photonic_Professional_GT LW-02] || PGMEA, IPA || ||  
 
|-
 
|-
−
| [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 2] || - || Cyclopentanone, gamma butyro lactone|| Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07], [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03] || PGMEA || N/A || SU-8 2005
+
| [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 2] || - || Cyclopentanone, gamma butyro lactone|| Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07], [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03] || PGMEA (SQ Developer) || N/A || SU-8 2005
 
|-
 
|-
−
| [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 50] || - || Cyclopentanone, gamma butyro lactone || Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07], [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03] || PGMEA || N/A || SU-8 2050
+
| [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 50] || - || Cyclopentanone, gamma butyro lactone || Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07], [https://wiki.nano.upenn.edu/wiki/index.php?title=ABM3000HR_Mask_Aligner MA-03] || PGMEA (SQ Developer) || N/A || SU-8 2050
 
|}
 
|}
  

Revision as of 12:39, 3 July 2023

The QNF provides a variety of standard resists to meet demands for most applications. Some specialty resists are also sold through the QNF Stockroom. A summary of stocked resists along with some processing information can be found in the table below. Click on the resist name to access the datasheet. Other similar options that may be available in QNF are also listed.

QNF Supplied Standard Photoresists

Name / Datasheet Tone Composition Use / Thickness Tool Compatibility Developer Remover Alternative Resists
S1805 + PGMEA General MA-01, LW-01, SPN-03 0.24N TMAH NMP KL5305
S1813 + PGMEA General, 1um-1.3um MA-01, LW-01, SPN-03 0.24N TMAH NMP KL5315
S1818 + PGMEA General MA-01, LW-01, SPN-03 0.24N TMAH NMP
SPR 220-3 + Ethyl lactate, anisole, n-amyl acetate Etch, 2um-5um MA-01, SPN-03 0.24N TMAH NMP KPRO-3, KL6003, AZ3330F
SPR 220-4.5 + Ethyl lactate, anisole, n-amyl acetate Etch MA-01, SPN-03 0.24N TMAH NMP KPRO-3, KL6003, AZ3330F
SPR 220-7 + Ethyl lactate, anisole, n-amyl acetate Etch, 6um-12um MA-01, SPN-03 0.24N TMAH or 0.26N TMAH NMP AZ 12XT, AZ P4620
AZ 3330F + PGMEA General, Metal RIE, Plating MA-01, SPN-03 AZ300MIF (0.26N TMAH) or AZ400K 1:4 (potassium salts) SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003
NR7-3000P - Cyclohexanone Etch, General MA-01 0.24N or 0.26N TMAH
APOL-LO 3202 - PGMEA Liftoff MA-01 0.26N TMAH NMP
IP-Dip - Ethoxylated acrylates Nanoscribe, Epoxy LW-02 PGMEA, IPA
HARE SQ 2 - Cyclopentanone, gamma butyro lactone Epoxy SPN-07, MA-03 PGMEA (SQ Developer) N/A SU-8 2005
HARE SQ 50 - Cyclopentanone, gamma butyro lactone Epoxy SPN-07, MA-03 PGMEA (SQ Developer) N/A SU-8 2050

Stockroom Photoresists

Name / Datasheet Tone Composition Use / Thickness Tool Compatibility Developer Remover Alternative Resists
SU-8 2005 - Cyclopentanone Epoxy, 4um-7um SPN-07, MA-03 SU-8 Developer (PGMEA) N/A HARE SQ 2
SU-8 2050 - Cyclopentanone Epoxy, 40um-170um SPN-07, MA-03 SU-8 Developer (PGMEA) N/A HARE SQ 50
SU-8 2100 - Cyclopentanone Epoxy, 100um-270um SPN-07, MA-03 SU-8 Developer (PGMEA) N/A HARE SQ 50
SU-8 3050 - Cyclopentanone Epoxy, 40um-100um SPN-07, MA-03 SU-8 Developer (PGMEA) N/A HARE SQ 50

Standard e-beam Resists

Name / Datasheet Tone Composition Use / Thickness Tool Compatibility Developer Remover Alternative Resists
495 PMMA A8 + Anisole Lower Resolution EBL-01, SPN-06 MIBK NMP
495 PMMA A4 + Anisole Lower Resolution, 180nm-300nm EBL-01, SPN-06 MIBK NMP
495 PMMA A2 + Anisole Lower Resolution, 50nm-100nm EBL-01, SPN-06 MIBK NMP
950 PMMA A4 + Anisole High Resolution, 200nm-400nm EBL-01, SPN-06 MIBK NMP
950 PMMA A2 + Anisole High Resolution, 50nm-100nm EBL-01, SPN-06 MIBK NMP 1000 HARP 0.1
1000 HARP 1.3 + Anisole High Resolution EBL-01, SPN-06 MIBK NMP
1000 HARP 0.1 + Anisole High Resolution EBL-01, SPN-06 MIBK NMP 950 PMMA A2

Stockroom e-beam Resists

Name / Datasheet Tone Composition Use / Thickness Tool Compatibility Developer Remover
ZEP 520A + Anisole Thicker formulation EBL-01, SPN-06 Xylenes, n-amyl acetate or MIBK NMP
ZEP 520A-7 + Anisole Thinner formulation EBL-01, SPN-06 Xylenes, n-amyl acetate or MIBK NMP
H-SiQ 6% - MIBK HSQ Equivalent EBL-01, SPN-06 TMAH

Other Resists

Name / Datasheet Tone Composition Use / Thickness Tool Compatibility Developer Remover
LOR 3A N/A Cyclopentanone, PGME Liftoff, Non-imaging Keep away from acetone & PGMEA 0.24N TMAH, 0.26N TMAH 1165 or Remover PG (NMP)
PMGI SF 5S N/A Cyclopentanone, PGME Liftoff, Non-imaging Keep away from acetone & PGMEA 0.24N TMAH, 0.26N TMAH 1165 or Remover PG (NMP)
PMGI SF 2S N/A Cyclopentanone, PGME Liftoff, Non-imaging Keep away from acetone & PGMEA 0.24N TMAH, 0.26N TMAH 1165 or Remover PG (NMP)
NXR-1025 N/A Stockroom, Nanoimprint MA-02

Miscellaneous

These may be available but are not guaranteed to be stocked

Name / Datasheet Tone Composition Use / Thickness Tool Compatibility Developer Remover Alternative Resists
KL5305 + PGMEA General 0.26N TMAH NMP, DMSO S1805
KL5315 + PGMEA General 0.26N TMAH NMP, DMSO S1813
KL6003 + PGMEA 0.26N TMAH NMP, DMSO SPR 220-3, SPR 220-4.5
K-PRO 3 + PGMEA Plating, Etching 0.26N TMAH or alkaline salts NMP, DMSO SPR 220-3, SPR 220-4.5
AZ 12XT-20PL-15 + PGMEA CAR (i-line), Plating, Packaging, Deep Etch, 10um-25um AZ300 (0.26N TMAH) SPR 220-7, AZ P4620
AZ P4620 + PGMEA Thick Resist, Plating, Packaging AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts) SPR 220-7, AZ 12XT-20PL-15
ma-N 2403 - e-beam/DUV Mix and Match
Retrieved from "https://wiki.nano.upenn.edu/wiki/index.php?title=Resists_at_QNF&oldid=1122"