Difference between revisions of "Resists at QNF"
Jump to navigation
Jump to search
m |
(Including information for e-beam resist development and removal) |
||
Line 66: | Line 66: | ||
! Name / Datasheet !! Tone !! Composition !! Use / Thickness !! Tool Compatibility !! Developer !! Remover | ! Name / Datasheet !! Tone !! Composition !! Use / Thickness !! Tool Compatibility !! Developer !! Remover | ||
|- | |- | ||
− | | [https://upenn.box.com/s/7ek7ccxq3c8xsp8jhe2lhdoi1e0keamt ZEP 520A] || + || Anisole || Thicker formulation || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || Xylenes, n-amyl acetate or MIBK || | + | | [https://upenn.box.com/s/7ek7ccxq3c8xsp8jhe2lhdoi1e0keamt ZEP 520A] || + || Anisole || Thicker formulation || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || Xylenes, n-amyl acetate or MIBK || NMP |
|- | |- | ||
− | | [https://upenn.box.com/s/7ek7ccxq3c8xsp8jhe2lhdoi1e0keamt ZEP 520A-7] || + || Anisole || Thinner formulation || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || Xylenes, n-amyl acetate or MIBK || | + | | [https://upenn.box.com/s/7ek7ccxq3c8xsp8jhe2lhdoi1e0keamt ZEP 520A-7] || + || Anisole || Thinner formulation || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || Xylenes, n-amyl acetate or MIBK || NMP |
|- | |- | ||
− | | [https://upenn.box.com/s/bv53alommdr2en6s6byrlm4psxdjohzp H-SiQ 6%] || - || MIBK || HSQ Equivalent || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || | + | | [https://upenn.box.com/s/bv53alommdr2en6s6byrlm4psxdjohzp H-SiQ 6%] || - || MIBK || HSQ Equivalent || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || TMAH || |
|} | |} | ||
Revision as of 15:34, 30 June 2023
The QNF provides a variety of standard resists to meet demands for most applications. Some specialty resists are also sold through the QNF Stockroom. A summary of stocked resists along with some processing information can be found in the table below. Click on the resist name to access the datasheet. Other similar options that may be available in QNF are also listed.
QNF Supplied Standard Photoresists
Name / Datasheet | Tone | Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
S1805 | + | PGMEA | General | MA-01, LW-01, SPN-03 | MF-319 (0.24N TMAH) | MP 1165 (NMP) | KL5305 |
S1813 | + | PGMEA | General | MA-01, LW-01, SPN-03 | MF-319 (0.24N TMAH) | MP 1165 (NMP) | KL5315 |
S1818 | + | PGMEA | General | MA-01, LW-01, SPN-03 | MF-319 (0.24N TMAH) | MP 1165 (NMP) | |
SPR 220-3 | + | Ethyl lactate, anisole, n-amyl acetate | Etch | MA-01, SPN-03 | 0.24N TMAH | MP 1165 (NMP) | KPRO-3, KL6003, AZ3330F |
SPR 220-4.5 | + | Ethyl lactate, anisole, n-amyl acetate | Etch | MA-01, SPN-03 | 0.24N TMAH | MP 1165 (NMP) | KPRO-3, KL6003, AZ3330F |
SPR 220-7 | + | Ethyl lactate, anisole, n-amyl acetate | Etch | MA-01, SPN-03 | 0.24N TMAH or 0.26N TMAH | MP 1165 (NMP) | AZ 12XT, AZ P4620 |
AZ 3330F | + | PGMEA | General, Metal RIE, Plating | MA-01, SPN-03 | AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts) | SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003 | |
NR7-3000P | - | Cyclohexanone | Etch, General | MA-01 | RD6 (0.24N or 0.26N TMAH) | RR4 (DMSO), Acetone | |
APOL-LO 3202 | - | PGMEA | Liftoff | MA-01 | 0.26N TMAH | NMP, DMSO | |
IP-Dip | - | Ethoxylated acrylates | Nanoscribe, Epoxy | LW-02 | PGMEA, IPA | ||
HARE SQ 2 | - | Cyclopentanone, gamma butyro lactone | Epoxy | SPN-07, MA-03 | PGMEA | SU-8 2005 | |
HARE SQ 50 | - | Cyclopentanone, gamma butyro lactone | Epoxy | SPN-07, MA-03 | PGMEA | SU-8 2050 |
Stockroom Photoresists
Name / Datasheet | Tone | Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
SU-8 2005 | - | Cyclopentanone | Epoxy | SPN-07, MA-03 | SU-8 Developer (PGMEA) | HARE SQ 2 | |
SU-8 2050 | - | Cyclopentanone | Epoxy | SPN-07, MA-03 | SU-8 Developer (PGMEA) | HARE SQ 50 | |
SU-8 2100 | - | Cyclopentanone | Epoxy | SPN-07, MA-03 | SU-8 Developer (PGMEA) | HARE SQ 50 | |
SU-8 3050 | - | Cyclopentanone | Epoxy | SPN-07, MA-03 | SU-8 Developer (PGMEA) | HARE SQ 50 |
Standard e-beam Resists
Name / Datasheet | Tone | Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
495 PMMA A8 | + | Anisole | Lower Resolution | EBL-01, SPN-06 | MIBK | NMP | |
495 PMMA A4 | + | Anisole | Lower Resolution | EBL-01, SPN-06 | MIBK | NMP | |
495 PMMA A2 | + | Anisole | Lower Resolution | EBL-01, SPN-06 | MIBK | NMP | |
950 PMMA A4 | + | Anisole | High Resolution | EBL-01, SPN-06 | MIBK | NMP | |
950 PMMA A2 | + | Anisole | High Resolution | EBL-01, SPN-06 | MIBK | NMP | 1000 HARP 0.1 |
1000 HARP 1.3 | + | Anisole | High Resolution | EBL-01, SPN-06 | MIBK | NMP | |
1000 HARP 0.1 | + | Anisole | High Resolution | EBL-01, SPN-06 | MIBK | NMP | 950 PMMA A2 |
Stockroom e-beam Resists
Name / Datasheet | Tone | Composition | Use / Thickness | Tool Compatibility | Developer | Remover |
---|---|---|---|---|---|---|
ZEP 520A | + | Anisole | Thicker formulation | EBL-01, SPN-06 | Xylenes, n-amyl acetate or MIBK | NMP |
ZEP 520A-7 | + | Anisole | Thinner formulation | EBL-01, SPN-06 | Xylenes, n-amyl acetate or MIBK | NMP |
H-SiQ 6% | - | MIBK | HSQ Equivalent | EBL-01, SPN-06 | TMAH |
Other Resists
Name / Datasheet | Tone | Composition | Use / Thickness | Tool Compatibility | Developer | Remover |
---|---|---|---|---|---|---|
LOR 3A | N/A | Cyclopentanone, PGME | Liftoff, Non-imaging | Keep away from acetone & PGMEA | 0.24N TMAH, 0.26N TMAH | 1165 or Remover PG (NMP) |
PMGI SF 5S | N/A | Cyclopentanone, PGME | Liftoff, Non-imaging | Keep away from acetone & PGMEA | 0.24N TMAH, 0.26N TMAH | 1165 or Remover PG (NMP) |
PMGI SF 2S | N/A | Cyclopentanone, PGME | Liftoff, Non-imaging | Keep away from acetone & PGMEA | 0.24N TMAH, 0.26N TMAH | 1165 or Remover PG (NMP) |
NXR-1025 | N/A | Stockroom, Nanoimprint | MA-02 |
Miscellaneous
These may be available but are not guaranteed to be stocked
Name / Datasheet | Tone | Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
KL5305 | + | PGMEA | General | 0.26N TMAH | NMP, DMSO | S1805 | |
KL5315 | + | PGMEA | General | 0.26N TMAH | NMP, DMSO | S1813 | |
KL6003 | + | PGMEA | 0.26N TMAH | NMP, DMSO | SPR 220-3, SPR 220-4.5 | ||
K-PRO 3 | + | PGMEA | Plating, Etching | 0.26N TMAH or alkaline salts | NMP, DMSO | SPR 220-3, SPR 220-4.5 | |
AZ 12XT-20PL-15 | + | PGMEA | CAR (i-line), Plating, Packaging, Deep Etch | AZ300 (0.26N TMAH) | SPR 220-7, AZ P4620 | ||
AZ P4620 | + | PGMEA | Thick Resist, Plating, Packaging | AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts) | SPR 220-7, AZ 12XT-20PL-15 | ||
ma-N 2403 | - | e-beam/DUV Mix and Match |