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- [[Category:Wet Processing]][[Category:Safety]] ...ng for benches in Bays 2, 4, 5, 6 and Packaging. See other pages for Bay 3 processing352 bytes (43 words) - 12:56, 28 July 2025
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- ...shooting. Her primary focuses are lithography, metrology, and wet chemical processing, with a specialization in photolithography/laser writing. She also is passi986 bytes (125 words) - 13:30, 3 January 2024
- == Thermal Processing == == Wet Processing ==7 KB (837 words) - 14:11, 26 August 2025
- * Pictures taken at chemical wet benches should be taken at a safe distance with a zoom lens to avoid contac * Bay 3 (Wet Processing) is off-limits as it contains the most dangerous chemicals in the lab and r11 KB (1,899 words) - 16:55, 9 December 2025
- [[Category:Wet Processing]][[Category:Safety]] ...ng for benches in Bays 2, 4, 5, 6 and Packaging. See other pages for Bay 3 processing352 bytes (43 words) - 12:56, 28 July 2025
- | MRL Wet/Dry Thermal Oxide || CVD-02 A || Thermal Processing || [[Lucas Barreto | Lucas Barreto]] | MRL LPCVD Silicon Nitride || CVD-02 B || Thermal Processing || [[Lucas Barreto | Lucas Barreto]]7 KB (864 words) - 10:40, 25 July 2025
- ...sical and chemical vapor deposition]], [[Equipment#Etch | dry and wet etch processing]], [[Equipment#Metrology_.26_characterization | metrology, and device chara3 KB (409 words) - 15:04, 28 July 2025
- [[Category:Wet Processing]][[Category:Equipment]] | Instrument_Type = Wet Processing860 bytes (106 words) - 12:55, 28 July 2025
- [[General Wet Bench Processing | Wet Bench Training for QNF]]2 KB (218 words) - 12:06, 7 November 2025
- ...egory:Deposition]][[Category:Chemical Vapor Deposition]][[Category:Thermal Processing]][[Category:Equipment]] '''Tube 1:''' Wet/Dry Silicon Oxide growth.2 KB (336 words) - 13:06, 28 July 2025
- [[Category:Wet Processing]][[Category:Equipment]] | Instrument_Type = Wet Processing1,000 bytes (126 words) - 12:55, 28 July 2025