Difference between revisions of "Resists at QNF"

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(Reorganized and updated to include tool compatibility along with composition, developer and remover chemistries)
(Including dedicated tool information)
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|  [https://upenn.box.com/s/1nocyldqmocrqmz1gjcwry8n86m9khtu APOL-LO 3202] || - || PGMEA || Liftoff || || 0.26N TMAH || NMP, DMSO ||
 
|  [https://upenn.box.com/s/1nocyldqmocrqmz1gjcwry8n86m9khtu APOL-LO 3202] || - || PGMEA || Liftoff || || 0.26N TMAH || NMP, DMSO ||
 
|-
 
|-
−
| IP-Dip || - || Ethoxylated acrylates || Nanoscribe, Epoxy || || PGMEA, IPA || ||  
+
| IP-Dip || - || Ethoxylated acrylates || Nanoscribe, Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Nanoscribe_Photonic_Professional_GT LW-02] || PGMEA, IPA || ||  
 
|-
 
|-
−
| [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 2] || - || Cyclopentanone, gamma butyro lactone|| Epoxy || || PGMEA || || SU-8 2005
+
| [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 2] || - || Cyclopentanone, gamma butyro lactone|| Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07] || PGMEA || || SU-8 2005
 
|-
 
|-
−
| [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 50] || - || Cyclopentanone, gamma butyro lactone || Epoxy || || PGMEA || || SU-8 2050
+
| [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 50] || - || Cyclopentanone, gamma butyro lactone || Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07] || PGMEA || || SU-8 2050
 
|}
 
|}
  
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! Name / Datasheet !! Tone !! Composition !! Use / Thickness !! Tool Compatibility !! Developer !! Remover !! Alternative Resists
 
! Name / Datasheet !! Tone !! Composition !! Use / Thickness !! Tool Compatibility !! Developer !! Remover !! Alternative Resists
 
|-
 
|-
−
| [https://upenn.box.com/s/f9oi75p3p84rdtpqq5unp0j1c3mqxjrd SU-8 2005] || - || Cyclopentanone || Epoxy || || SU-8 Developer (PGMEA) || || HARE SQ 2
+
| [https://upenn.box.com/s/f9oi75p3p84rdtpqq5unp0j1c3mqxjrd SU-8 2005] || - || Cyclopentanone || Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07] || SU-8 Developer (PGMEA) || || HARE SQ 2
 
|-
 
|-
−
| [https://upenn.box.com/s/s4noknbqlyh8inq3gqycw115b7ufdibu SU-8 2050] || - || Cyclopentanone || Epoxy || || SU-8 Developer (PGMEA) || || HARE SQ 50  
+
| [https://upenn.box.com/s/s4noknbqlyh8inq3gqycw115b7ufdibu SU-8 2050] || - || Cyclopentanone || Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07] || SU-8 Developer (PGMEA) || || HARE SQ 50  
 
|-
 
|-
−
| [https://upenn.box.com/s/va40gxhk7ghwl8p9hhsyvr0rairc9v1e SU-8 2100] || - || Cyclopentanone || Epoxy || || SU-8 Developer (PGMEA) || || HARE SQ 50
+
| [https://upenn.box.com/s/va40gxhk7ghwl8p9hhsyvr0rairc9v1e SU-8 2100] || - || Cyclopentanone || Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07] || SU-8 Developer (PGMEA) || || HARE SQ 50
 
|-
 
|-
−
| [https://upenn.box.com/s/f9oi75p3p84rdtpqq5unp0j1c3mqxjrd SU-8 3050] || - || Cyclopentanone || Epoxy || || SU-8 Developer (PGMEA) || || HARE SQ 50
+
| [https://upenn.box.com/s/f9oi75p3p84rdtpqq5unp0j1c3mqxjrd SU-8 3050] || - || Cyclopentanone || Epoxy || [https://wiki.nano.upenn.edu/wiki/index.php?title=Spinner_-_SU-8/PDMS SPN-07] || SU-8 Developer (PGMEA) || || HARE SQ 50
 
|}
 
|}
  

Revision as of 14:54, 30 June 2023

The QNF provides a variety of standard resists to meet demands for most applications. Some specialty resists are also sold through the QNF Stockroom. A summary of stocked resists along with some processing information can be found in the table below. Click on the resist name to access the datasheet. Other similar options that may be available in QNF are also listed.

QNF Supplied Standard Photoresists

Name / Datasheet Tone Composition Use / Thickness Tool Compatibility Developer Remover Alternative Resists
S1805 + PGMEA General MF-319 (0.24N TMAH) MP 1165 (NMP) KL5305
S1813 + PGMEA General MF-319 (0.24N TMAH) MP 1165 (NMP) KL5315
S1818 + PGMEA General MF-319 (0.24N TMAH) MP 1165 (NMP)
SPR 220-3 + Ethyl lactate, anisole, n-amyl acetate Etch 0.24N TMAH MP 1165 (NMP) KPRO-3, KL6003, AZ3330F
SPR 220-4.5 + Ethyl lactate, anisole, n-amyl acetate Etch 0.24N TMAH MP 1165 (NMP) KPRO-3, KL6003, AZ3330F
SPR 220-7 + Ethyl lactate, anisole, n-amyl acetate Etch 0.24N TMAH or 0.26N TMAH MP 1165 (NMP) AZ 12XT, AZ P4620
AZ 3330F + PGMEA General, Metal RIE, Plating AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts) SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003
NR7-3000P - Cyclohexanone Etch, General RD6 (0.24N or 0.26N TMAH) RR4 (DMSO), Acetone
APOL-LO 3202 - PGMEA Liftoff 0.26N TMAH NMP, DMSO
IP-Dip - Ethoxylated acrylates Nanoscribe, Epoxy LW-02 PGMEA, IPA
HARE SQ 2 - Cyclopentanone, gamma butyro lactone Epoxy SPN-07 PGMEA SU-8 2005
HARE SQ 50 - Cyclopentanone, gamma butyro lactone Epoxy SPN-07 PGMEA SU-8 2050

Stockroom Photoresists

Name / Datasheet Tone Composition Use / Thickness Tool Compatibility Developer Remover Alternative Resists
SU-8 2005 - Cyclopentanone Epoxy SPN-07 SU-8 Developer (PGMEA) HARE SQ 2
SU-8 2050 - Cyclopentanone Epoxy SPN-07 SU-8 Developer (PGMEA) HARE SQ 50
SU-8 2100 - Cyclopentanone Epoxy SPN-07 SU-8 Developer (PGMEA) HARE SQ 50
SU-8 3050 - Cyclopentanone Epoxy SPN-07 SU-8 Developer (PGMEA) HARE SQ 50

Standard e-beam Resists

Name / Datasheet Tone Composition Use / Thickness Tool Compatibility Developer Remover Alternative Resists
495 PMMA A8 + Anisole Lower Resolution EBL-01, SPN-06 MIBK NMP
495 PMMA A4 + Anisole Lower Resolution EBL-01, SPN-06 MIBK NMP
495 PMMA A2 + Anisole Lower Resolution EBL-01, SPN-06 MIBK NMP
950 PMMA A4 + Anisole High Resolution EBL-01, SPN-06 MIBK NMP
950 PMMA A2 + Anisole High Resolution EBL-01, SPN-06 MIBK NMP 1000 HARP 0.1
1000 HARP 1.3 + Anisole High Resolution EBL-01, SPN-06 MIBK NMP
1000 HARP 0.1 + Anisole High Resolution EBL-01, SPN-06 MIBK NMP 950 PMMA A2

Stockroom e-beam Resists

Name / Datasheet Tone Composition Use / Thickness Tool Compatibility Developer Remover Alternative Resists
ZEP 520A + Anisole Thicker formulation EBL-01, SPN-06 Xylenes, n-amyl acetate or MIBK
ZEP 520A-7 + Anisole Thinner formulation EBL-01, SPN-06 Xylenes, n-amyl acetate or MIBK
H-SiQ 6% - MIBK HSQ Equivalent EBL-01, SPN-06 0.24N TMAH or 0.26N TMAH

Other Resists

Name / Datasheet Tone Composition Use / Thickness Tool Compatibility Developer Remover Alternative Resists
LOR 3A N/A Cyclopentanone, PGME Liftoff, Non-imaging 0.24N TMAH, 0.26N TMAH EBR PG (ethylene glycol, PGME)
PMGI SF 5S N/A Cyclopentanone, PGME Liftoff, Non-imaging 0.24N TMAH, 0.26N TMAH EBR PG (ethylene glycol, PGME)
PMGI SF 2S N/A Cyclopentanone, PGME Liftoff, Non-imaging 0.24N TMAH, 0.26N TMAH EBR PG (ethylene glycol, PGME)
NXR-1025 N/A Stockroom, Nanoimprint

Miscellaneous

These may be available but are not guaranteed to be stocked

Name / Datasheet Tone Composition Use / Thickness Tool Compatibility Developer Remover Alternative Resists
KL5305 + PGMEA General 0.26N TMAH NMP, DMSO S1805
KL5315 + PGMEA General 0.26N TMAH NMP, DMSO S1813
KL6003 + PGMEA 0.26N TMAH NMP, DMSO SPR 220-3, SPR 220-4.5
K-PRO 3 + PGMEA Plating, Etching 0.26N TMAH or alkaline salts NMP, DMSO SPR 220-3, SPR 220-4.5
AZ 12XT-20PL-15 + PGMEA CAR (i-line), Plating, Packaging, Deep Etch AZ300 (0.26N TMAH) SPR 220-7, AZ P4620
AZ P4620 + PGMEA Thick Resist, Plating, Packaging AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts) SPR 220-7, AZ 12XT-20PL-15
ma-N 2403 - e-beam/DUV Mix and Match
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