Difference between revisions of "Au (gold)"
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==Processes== | ==Processes== | ||
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| + | Gold is NOT allowed in the following tools: [[Oxford PlasmaLab 100 PECVD | CVD-01]], [[Cambridge Nanotech S200 ALD | ALD-01]], [[SPTS Si DRIE | DE-03]], [[Oxford 80 Plus RIE | DE-04]], [[Oxford Cobra ICP Etcher | DE-05]], | ||
===Sputter Deposition Rates=== | ===Sputter Deposition Rates=== | ||
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! Pressure || Power || Rate || Pressure || Power || Rate || Pressure || Power || Rate | ! Pressure || Power || Rate || Pressure || Power || Rate || Pressure || Power || Rate | ||
|- | |- | ||
| − | | PVD-03 || 4 mTorr || 140 W || 3.1 Å s<sup>-1</sup> || | + | | PVD-03 || 4 mTorr || 140 W || 3.1 Å s<sup>-1</sup> || 02/24/23 || 3 mTorr || 140 W || 2.5 Å s<sup>-1</sup> || || 5 mTorr || 140 W || 3.1 Å s<sup>-1</sup> || 03/01/24 |
|- | |- | ||
|} | |} | ||
Latest revision as of 14:00, 9 May 2024
Gold is noble transition metal with atomic number 79 and symbol Au. Gold has a very high density and very low reactivity. It also has excellent thermal and electrical conductivity.
Equipment
Deposition Equipment
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-04: Lesker PVD75 E-beam Evaporator
- PVD-05: Denton Explorer14 Magnetron Sputterer
Etching Equipment
Applications
Processes
Gold is NOT allowed in the following tools: CVD-01, ALD-01, DE-03, DE-04, DE-05,
Sputter Deposition Rates
| PVD Tool | Cathode 2 (DC; high mag) | Recorded | Cathode 3 (DC) | Recorded | Cathode 4 (DC; high mag) | Recorded | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Pressure | Power | Rate | Pressure | Power | Rate | Pressure | Power | Rate | ||||
| PVD-03 | 4 mTorr | 140 W | 3.1 Å s-1 | 02/24/23 | 3 mTorr | 140 W | 2.5 Å s-1 | 5 mTorr | 140 W | 3.1 Å s-1 | 03/01/24 | |
| PVD Tool | Cathodes 1 & 3 (DC) | Recorded | ||
|---|---|---|---|---|
| Pressure | Power | Rate | ||
| PVD-05 | 3 mTorr | 140 W | 4.6 Å s-1 | |
PVD-05 Master Recipe:
Step T006 is the deposition step.
| Step Number | T000 | T001 | T002 | T003 | T004 | T005 | T006 | T007 | T008 | T009 | T010 | T011 | T012 | T013 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Step Time (sec) | 5 | 30 | 30 | 30 | 30 | 30 | [dep] | 30 | 30 | 30 | 30 | 30 | 300 | 5 |
| Min Vacuum Setpoint (Torr) | ||||||||||||||
| Gas - (PID or Fixed) | PID | PID | PID | PID | PID | PID | PID | PID | PID | PID | PID | |||
| Gas - PID Master Gas Select | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | |||
| Gas1 - Setpoint (sccm) | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | |||
| Gas2 - Setpoint (sccm) | ||||||||||||||
| Gas PID Pressure (mTorr) | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | |||
| RF Source - Sputter (Watts) | ||||||||||||||
| RF Source - Cathode Select | ||||||||||||||
| RF Source - Shutter | ||||||||||||||
| DC 1 Source - Sputter (Watts) | 25 | 50 | 75 | 100 | 125 | 140 | 120 | 100 | 80 | 60 | 25 | |||
| DC 1 Source - Cathode Select | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | |||
| DC 1 Source - Shutter | Open | |||||||||||||
| DC 2 Source - Sputter (Watts) | ||||||||||||||
| DC 2 Source - Shutter | ||||||||||||||
| Pressure Control (Throttle) | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | ||
| Ignition Pressure (mTorr) | ||||||||||||||
| Rotation Speed (0-100%) | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | |
| End Process (Yes) | Yes |