Difference between revisions of "Ti (titanium)"
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==Processes== | ==Processes== | ||
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| + | Titanium is NOT allowed in the following tools: [[Oxford PlasmaLab 100 PECVD | CVD-01]], [[Cambridge Nanotech S200 ALD | ALD-01]], [[SPTS Si DRIE | DE-03]], [[Oxford Cobra ICP Etcher | DE-05]], | ||
===Sputter Deposition Rates=== | ===Sputter Deposition Rates=== | ||
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! Pressure || Power || Rate || Pressure || Power || Rate || Pressure || Power || Rate | ! Pressure || Power || Rate || Pressure || Power || Rate || Pressure || Power || Rate | ||
|- | |- | ||
| − | | PVD-03 || 6 mTorr || 300 W || | + | | PVD-03 || 6 mTorr || 300 W || 3.7 Å s<sup>-1</sup> || 08/12/24 || 5 mTorr || 300 W || 0.98 Å s<sup>-1</sup> || 03/06/23 || 6 mTorr || 300 W || 0.8 Å s<sup>-1</sup> || |
|- | |- | ||
|} | |} | ||
Latest revision as of 12:53, 23 September 2024
Titanium is a transition metal with atomic number 22 and symbol Ti. Titanium has a low density, high strength and is resistant to corrosion by water. It has relatively poor electrical and thermal conduction compared to most metals.
Equipment
Deposition Equipment
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-04: Lesker PVD75 E-beam Evaporator
- PVD-05: Denton Explorer14 Magnetron Sputterer
Etching
Applications
Processes
Titanium is NOT allowed in the following tools: CVD-01, ALD-01, DE-03, DE-05,
Sputter Deposition Rates
| PVD Tool | Cathode 2 (DC; high mag) | Recorded | Cathode 3 (DC) | Recorded | Cathode 4 (DC; high mag) | Recorded | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Pressure | Power | Rate | Pressure | Power | Rate | Pressure | Power | Rate | ||||
| PVD-03 | 6 mTorr | 300 W | 3.7 Å s-1 | 08/12/24 | 5 mTorr | 300 W | 0.98 Å s-1 | 03/06/23 | 6 mTorr | 300 W | 0.8 Å s-1 | |
| PVD Tool | Cathode 2 (DC) | Recorded | ||
|---|---|---|---|---|
| Pressure | Power | Rate | ||
| PVD-05 | 3 mTorr | 350 W | 2.0 Å s-1 | |
PVD-05 Master Recipe:
Step T004 is the deposition step and step T005 is the cool-down step (60 s).
| Step Number | T000 | T001 | T002 | T003 | T004 | T005 | T006 |
|---|---|---|---|---|---|---|---|
| Step Time (sec) | 5 | 120 | 60 | 60 | [dep] | 60 | 5 |
| Min Vacuum Setpoint (Torr) | |||||||
| Gas - (PID or Fixed) | PID | PID | PID | PID | |||
| Gas - PID Master Gas Select | 1 | 1 | 1 | 1 | |||
| Gas1 - Setpoint (sccm) | 10 | 10 | 10 | 10 | |||
| Gas2 - Setpoint (sccm) | |||||||
| Gas PID Pressure (mTorr) | 10 | 5 | 3 | 3 | |||
| RF Source - Sputter (Watts) | |||||||
| RF Source - Cathode Select | |||||||
| RF Source - Shutter | |||||||
| DC 1 Source - Sputter (Watts) | 100 | 200 | 300 | 350 | |||
| DC 1 Source - Cathode Select | 2 | 2 | 2 | 2 | |||
| DC 1 Source - Shutter | Open | ||||||
| DC 2 Source - Sputter (Watts) | |||||||
| DC 2 Source - Shutter | |||||||
| Pressure Control (Throttle) | Yes | Yes | Yes | Yes | Yes | ||
| Ignition Pressure (mTorr) | |||||||
| Rotation Speed (0-100%) | 50 | 50 | 50 | 50 | 50 | ||
| End Process (Yes) | Yes |