Difference between revisions of "Veeco Savannah 200"
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{{EquipmentInfo | {{EquipmentInfo | ||
| − | | name = | + | | name = Veeco Savannah 200 |
| − | | Tool_Name = | + | | Tool_Name = Veeco Savannah 200 |
| image = [[Image:ALD-03.jpeg|300px]] | | image = [[Image:ALD-03.jpeg|300px]] | ||
| imagecaption = | | imagecaption = | ||
| Instrument_Type = Deposition | | Instrument_Type = Deposition | ||
| − | | Staff_Manager = Sam Azadi | + | | Staff_Manager = [[Sam Azadi | Sam Azadi]] |
| Lab_Location = Bay 2 | | Lab_Location = Bay 2 | ||
| Tool_Manufacturer = Veeco | | Tool_Manufacturer = Veeco | ||
| Tool_Model = Savannah 200 | | Tool_Model = Savannah 200 | ||
| − | | | + | | NEMO_Designation = ALD-03 |
| Lab_Phone = 215-898-9736 | | Lab_Phone = 215-898-9736 | ||
| SOP Link = [https://repository.upenn.edu/scn_sop/6/ SOP] | | SOP Link = [https://repository.upenn.edu/scn_sop/6/ SOP] | ||
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* Al2O3 | * Al2O3 | ||
* Pd | * Pd | ||
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== Resources == | == Resources == | ||
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===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://repository.upenn.edu/scn_sop/6/ QNF SOP] | * [https://repository.upenn.edu/scn_sop/6/ QNF SOP] | ||
| − | + | * [https://upenn.box.com/s/3hq8iik8jeb1385mrwgs16i6vfpvxt6f ALD KOH Cleaning Procedure] | |
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| − | * [https:// | ||
Latest revision as of 09:57, 20 March 2024
 |
|
| Tool Name | Veeco Savannah 200 |
|---|---|
| Instrument Type | Deposition |
| Staff Manager | Sam Azadi |
| Lab Location | Bay 2 |
| Tool Manufacturer | Veeco |
| Tool Model | Savannah 200 |
| NEMO Designation | ALD-03 |
| Lab Phone | 215-898-9736 |
| SOP Link | SOP |
Description
Savannah is equipped with high-speed pneumatic pulse valves to enable our unique Exposure Mode for thin film deposition on Ultra High Aspect Ratio substrates. This proven precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than > 2000:1. Savannah is capable of holding substrates of different sizes up to 200mm. The Savannah thin film deposition systems are equipped with Pd, Pt precursors, TMA, HfCl4, BDEAS and Ozone.
Films
- Pt
- Al2O3
- Pd
Resources
Most Recent Deposition Rates
| Material Name | Precursor 1 | Precursor 2 | Dep. temperature [C] | Carrier flow [sccm] | Dep. rate [A/cyc] | Date [MM/DD/YY] | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Name | Pulse time [s] | Wait time [s] | Name | Pulse time [s] | Wait time [s] | |||||
| Al2O3 | TMA | 0.015 | 5 | O3 | 0.05 | 5 | 200 | 20 | 1.1 | 10/17/22 |
| Pt | MeCpPtMe3 | 0.6 | 5 | O3 | 0.05 | 5 | 200 | 20 | 0.7 | 10/18/22 |
-Note that Pt deposition saturates at ~ 10 nm and the deposition rate only applies to thicknesses of ~ 5 - 10nm.
-Thin film sheet resistance of Pt deposited using the process parameters above at ~ 10 nm is: ~ 30 Ohm/Sq