Difference between revisions of "Ti (titanium)"

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===Deposition Equipment===
 
===Deposition Equipment===
 
* '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]  
 
* '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]  
 +
* '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]]
 
* '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]]
 
* '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]]
−
* '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]]
 
 
* '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
 
* '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
  
 
===Etching===
 
===Etching===
  
−
==Application==
+
==Applications==
  
 
==Processes==
 
==Processes==
 +
 +
Titanium is NOT allowed in the following tools: [[Oxford PlasmaLab 100 PECVD | CVD-01]], [[Cambridge Nanotech S200 ALD | ALD-01]], [[SPTS Si DRIE | DE-03]], [[Oxford Cobra ICP Etcher | DE-05]],
  
 
===Sputter Deposition Rates===
 
===Sputter Deposition Rates===
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! Pressure || Power || Rate || Pressure || Power || Rate || Pressure || Power || Rate
 
! Pressure || Power || Rate || Pressure || Power || Rate || Pressure || Power || Rate
 
|-  
 
|-  
−
| PVD-03 || 6 mTorr || 300 W || 1.8 Å s<sup>-1</sup> ||   || 5 mTorr || 300 W || 0.98 Å s<sup>-1</sup> || 03/06/23  || 6 mTorr || 300 W || 0.8 Å s<sup>-1</sup> ||  
+
| PVD-03 || 6 mTorr || 300 W || 3.7 Å s<sup>-1</sup> || 08/12/24  || 5 mTorr || 300 W || 0.98 Å s<sup>-1</sup> || 03/06/23  || 6 mTorr || 300 W || 0.8 Å s<sup>-1</sup> ||  
 
|-
 
|-
 
|}
 
|}
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| PVD-05 || 3 mTorr || 350 W || 2.0 Å s<sup>-1</sup>  
 
| PVD-05 || 3 mTorr || 350 W || 2.0 Å s<sup>-1</sup>  
 
|-
 
|-
 +
|}
 +
 +
'''PVD-05 Master Recipe:'''
 +
 +
Step T004 is the deposition step and step T005 is the cool-down step (60 s).
 +
 +
{| class="wikitable"
 +
! Step Number || T000 || T001 || T002 || T003 || T004 || T005 || T006
 +
|-
 +
|-
 +
| Step Time (sec) || 5 || 120 || 60 || 60 || [dep] || 60 || 5
 +
|-style="background-color:#FFFFFF"
 +
| Min Vacuum Setpoint (Torr) ||  ||  ||  ||  ||  ||  ||
 +
|-
 +
|  ||  ||  ||  ||  ||  ||  ||
 +
|-style="background-color:#DBFEFF"
 +
| Gas - (PID or Fixed) ||  || PID || PID || PID || PID ||  ||
 +
|-style="background-color:#FFFFFF"
 +
| Gas - PID Master Gas Select ||  || 1 || 1 || 1 || 1 ||  ||
 +
|-
 +
| Gas1 - Setpoint (sccm) ||  ||  10 || 10 || 10 || 10 ||  ||
 +
|-style="background-color:#FFFFFF"
 +
| Gas2 - Setpoint (sccm) ||  ||  ||  ||  ||  ||  ||
 +
|-
 +
|  ||  ||  ||  ||  ||  ||  ||
 +
|-style="background-color:#DEB4DC"
 +
|Gas PID Pressure (mTorr) ||  || 10 || 5 || 3 || 3 ||  ||
 +
|-style="background-color:#DCF5E9"
 +
| RF Source - Sputter (Watts) || ||  ||  ||  ||  ||  ||
 +
|-style="background-color:#DCF5E9"
 +
| RF Source - Cathode Select ||  ||  ||  ||  ||  ||  ||
 +
|-style="background-color:#DCF5E9"
 +
| RF Source - Shutter ||  ||  ||  ||  ||  ||  ||
 +
|-style="background-color:#ECFA6F"
 +
| DC 1 Source - Sputter (Watts) ||  || 100 || 200 || 300 || 350 ||  ||
 +
|-style="background-color:#ECFA6F"
 +
| DC 1 Source - Cathode Select ||  || 2 || 2 || 2 || 2 ||  ||
 +
|-style="background-color:#ECFA6F"
 +
| DC 1 Source - Shutter ||  ||  ||  ||  || Open ||  ||
 +
|-style="background-color:#FAD86F"
 +
| DC 2 Source - Sputter (Watts) ||  ||  ||  ||  ||  ||  ||
 +
|-style="background-color:#FAD86F"
 +
|  ||  ||  ||  ||  ||  ||  ||
 +
|-style="background-color:#FAD86F"
 +
| DC 2 Source - Shutter ||  ||  ||  ||  ||  ||  ||
 +
|-style="background-color:#6FD2FA"
 +
| Pressure Control (Throttle) || Yes || Yes || Yes || Yes || Yes ||  ||
 +
|-style="background-color:#FFFFFF"
 +
| Ignition Pressure (mTorr) ||  ||  ||  || ||  || ||
 +
|-
 +
|  ||  ||  ||  ||  ||  ||  ||
 +
|-style="background-color:#E8F213"
 +
| Rotation Speed (0-100%) || 50 || 50 || 50 || 50 || 50 ||  ||
 +
|-
 +
| End Process (Yes) ||  ||  ||  ||  ||  ||  || Yes
 
|}
 
|}

Latest revision as of 12:53, 23 September 2024

Titanium is a transition metal with atomic number 22 and symbol Ti. Titanium has a low density, high strength and is resistant to corrosion by water. It has relatively poor electrical and thermal conduction compared to most metals.

Equipment

Deposition Equipment

Etching

Applications

Processes

Titanium is NOT allowed in the following tools: CVD-01, ALD-01, DE-03, DE-05,

Sputter Deposition Rates

PVD Tool Cathode 2 (DC; high mag) Recorded Cathode 3 (DC) Recorded Cathode 4 (DC; high mag) Recorded
Pressure Power Rate Pressure Power Rate Pressure Power Rate
PVD-03 6 mTorr 300 W 3.7 Å s-1 08/12/24 5 mTorr 300 W 0.98 Å s-1 03/06/23 6 mTorr 300 W 0.8 Å s-1
PVD Tool Cathode 2 (DC) Recorded
Pressure Power Rate
PVD-05 3 mTorr 350 W 2.0 Å s-1

PVD-05 Master Recipe:

Step T004 is the deposition step and step T005 is the cool-down step (60 s).

Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) 5 120 60 60 [dep] 60 5
Min Vacuum Setpoint (Torr)
Gas - (PID or Fixed) PID PID PID PID
Gas - PID Master Gas Select 1 1 1 1
Gas1 - Setpoint (sccm) 10 10 10 10
Gas2 - Setpoint (sccm)
Gas PID Pressure (mTorr) 10 5 3 3
RF Source - Sputter (Watts)
RF Source - Cathode Select
RF Source - Shutter
DC 1 Source - Sputter (Watts) 100 200 300 350
DC 1 Source - Cathode Select 2 2 2 2
DC 1 Source - Shutter Open
DC 2 Source - Sputter (Watts)
DC 2 Source - Shutter
Pressure Control (Throttle) Yes Yes Yes Yes Yes
Ignition Pressure (mTorr)
Rotation Speed (0-100%) 50 50 50 50 50
End Process (Yes) Yes
Retrieved from "https://wiki.nano.upenn.edu/wiki/index.php?title=Ti_(titanium)&oldid=2018"