Difference between revisions of "Process Resources"
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| + | = General Process Documents= | ||
| + | * [https://upenn.box.com/s/ol48q2o2pq7it1kn7spai87c9ene9cvs KemLab Resist Presentation] | ||
| + | |||
| + | = Lithography = | ||
| + | * [[Resists at QNF]] | ||
| + | * [[Developers at QNF]] -- Under Construction] | ||
| + | * [[Ancillary Process Chemicals at QNF]] -- Under Construction | ||
| + | |||
= Film Characterization= | = Film Characterization= | ||
| + | * [https://upenn.app.box.com/file/1004242723681 Deposition and Etch Characterization of LPCVD SiNx thin films] | ||
| + | * [https://upenn.app.box.com/file/1004880785762 ALD deposition of SiO2 using BDEAS and Ozone precursors] | ||
= Soft Lithography = | = Soft Lithography = | ||
Latest revision as of 15:23, 3 July 2023
General Process Documents
Lithography
- Resists at QNF
- Developers at QNF -- Under Construction]
- Ancillary Process Chemicals at QNF -- Under Construction
Film Characterization
- Deposition and Etch Characterization of LPCVD SiNx thin films
- ALD deposition of SiO2 using BDEAS and Ozone precursors