Developers at QNF

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The following are developers you may encounter in the QNF wet benches.

Name Manufacturer Chemical Composition Hazards Use Alternatives
TMAH 0.26N KemLab 0.26N TMAH (Metal Ion Free) Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) Photoresists, Liftoff Resists CD-26, AZ300MIF
CD-26 Microposit/Dupont 0.26N TMAH (Metal Ion Free) Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) Photoresists, Liftoff Resists TMAH 0.26N (preferred), AZ300MIF
AZ300 MIF AZ Materials/Merck 0.26N TMAH (Metal Ion Free) Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) Photoresists, Liftoff Resists TMAH 0.26N (preferred), CD-26
CD-26A Microposit/Dupont 0.26N TMAH (Metal Ion Free) w/ Surfactant Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) AZ917MIF, TMAH 0.26N, CD-26, AZ300MIF
AZ917 MIF AZ Materials/Merck 0.26N TMAH (Metal Ion Free) w/ Surfactant Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) CD-26A, TMAH 0.26N, CD-26, AZ300MIF
MF321 Microposit/Dupont 0.21N TMAH (Metal Ion Free) w/ Surfactant Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) AZ422 MIF, TMAH 0.26N
AZ422 MIF AZ Materials/Merck 0.21N TMAH (Metal Ion Free) w/ Surfactant Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) MF321, TMAH 0.26N
AZ400K AZ Materials/Merck Potassium Borates (Metal Ion Bearing) Strong Base -- Irritant, Corrosive Thick Photoresists (AZP4620), Mask Plates (AZ1500) -- Manually dilute 1:3 or 1:4 with DI water
SU-8 Developer MicroChem/Kayaku PGMEA (1-methoxy-2-propanol acetate) Organic Solvent -- Flammable SU-8, HARE SQ, IP-S, IP-Dip SQ Developer
SQ Developer KemLab PGMEA (1-methoxy-2-propanol acetate) Organic Solvent -- Flammable HARE SQ, SU-8, IP-S, IP-Dip SU-8 Developer
O-Xylene N/A O-Xylene Organic Solvent -- Flammable, Irritant ZEP520 Amyl Acetate (preferred)