Au (gold)

Equipment

Deposition Equipment

• PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
• PVD-03: Lesker PVD75 DC/RF Sputterer
• PVD-04: Lesker PVD75 E-beam Evaporator
• PVD-05: Denton Explorer14 Magnetron Sputterer

Processes

Sputter Deposition Rates

PVD Tool	Cathode 2 (DC; high mag)			Recorded	Cathode 3 (DC)			Recorded	Cathode 4 (DC; high mag)			Recorded
	Pressure	Power	Rate		Pressure	Power	Rate		Pressure	Power	Rate
PVD-03	4 mTorr	140 W	3.1 Å s-1		3 mTorr	140 W	2.5 Å s-1	03/06/23	5 mTorr	140 W	3.1 Å s-1

PVD Tool	Cathodes 1 & 3 (DC)			Recorded
	Pressure	Power	Rate
PVD-05	3 mTorr	140 W	4.6 Å s-1

PVD-05 Master Recipe:

Step T006 is the deposition step.

Step Number	T000	T001	T002	T003	T004	T005	T006	T007	T008	T009	T010	T011	T012	T013
Step Time (sec)	5	30	30	30	30	30	[dep]	30	30	30	30	30	300	5
Min Vacuum Setpoint (Torr)
Gas - (PID or Fixed)		PID	PID	PID	PID	PID	PID	PID	PID	PID	PID	PID
Gas - PID Master Gas Select		1	1	1	1	1	1	1	1	1	1	1
Gas1 - Setpoint (sccm)		10	10	10	10	10	10	10	10	10	10	10
Gas2 - Setpoint (sccm)
Gas PID Pressure (mTorr)		3	3	3	3	3	3	3	3	3	3	3
RF Source - Sputter (Watts)
RF Source - Cathode Select
RF Source - Shutter
DC 1 Source - Sputter (Watts)		25	50	75	100	125	140	120	100	80	60	25
DC 1 Source - Cathode Select		1	1	1	1	1	1	1	1	1	1	1
DC 1 Source - Shutter							Open
DC 2 Source - Sputter (Watts)
DC 2 Source - Shutter
Pressure Control (Throttle)	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Ignition Pressure (mTorr)
Rotation Speed (0-100%)	50	50	50	50	50	50	50	50	50	50	50	50	50
End Process (Yes)														Yes