Developers at QNF

The following are developers you may encounter in the QNF wet benches.

Name	Manufacturer	Chemical Composition	Hazards	Use	Alternatives
TMAH 0.26N	KemLab	0.26N TMAH (Metal Ion Free)	Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas)	Photoresists, Liftoff Resists	CD-26, AZ300MIF
CD-26	Microposit/Dupont	0.26N TMAH (Metal Ion Free)	Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas)	Photoresists, Liftoff Resists	TMAH 0.26N (preferred), AZ300MIF
AZ300 MIF	AZ Materials/Merck	0.26N TMAH (Metal Ion Free)	Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas)	Photoresists, Liftoff Resists	TMAH 0.26N (preferred), CD-26
CD-26A	Microposit/Dupont	0.26N TMAH (Metal Ion Free) w/ Surfactant	Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas)		AZ917MIF, TMAH 0.26N, CD-26, AZ300MIF
AZ917 MIF	AZ Materials/Merck	0.26N TMAH (Metal Ion Free) w/ Surfactant	Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas)		CD-26A, TMAH 0.26N, CD-26, AZ300MIF
MF321	Microposit/Dupont	0.21N TMAH (Metal Ion Free) w/ Surfactant	Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas)		AZ422 MIF, TMAH 0.26N
AZ422 MIF	AZ Materials/Merck	0.21N TMAH (Metal Ion Free) w/ Surfactant	Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas)		MF321, TMAH 0.26N
AZ400K	AZ Materials/Merck	Potassium Borates (Metal Ion Bearing)	Strong Base -- Irritant, Corrosive	Dilute 1:4 with DI water for thick Photoresists (AZP4620), Mask Plates (AZ1500)
SU-8 Developer	MicroChem/Kayaku	PGMEA (1-methoxy-2-propanol acetate)	Organic Solvent -- Flammable	SU-8, HARE SQ, IP-Dip	SQ Developer
SQ Developer	KemLab	PGMEA (1-methoxy-2-propanol acetate)	Organic Solvent -- Flammable	HARE SQ, SU-8, IP-Dip	SU-8 Developer
O-Xylene	N/A	O-Xylene	Organic Solvent -- Flammable, Irritant	ZEP520	Amyl Acetate (preferred)