Difference between revisions of "Photolithography"
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* [[Ancillary Process Chemicals at QNF]] -- Under Construction | * [[Ancillary Process Chemicals at QNF]] -- Under Construction | ||
* [https://upenn.box.com/s/ol48q2o2pq7it1kn7spai87c9ene9cvs KemLab Resist Presentation] | * [https://upenn.box.com/s/ol48q2o2pq7it1kn7spai87c9ene9cvs KemLab Resist Presentation] | ||
| + | |||
| + | =====Internal Reports===== | ||
| + | *[https://repository.upenn.edu/entities/publication/36e58b7d-2254-4e6b-b9b4-f1d247b98352 Effect of Developer Temperature on Photoresist Contrast in Grayscale Lithography] ''LW-01, SPR 220-3'' | ||
| + | *[https://repository.upenn.edu/entities/publication/2dc6357c-2974-47d6-b875-bfba1a5b59f5 Optimization of Bilayer Lift-Off Process to Enable the Gap Size of 1μm Using LOR 3A and S1813] | ||
| + | *[https://repository.upenn.edu/entities/publication/86c27bd3-abdc-42cf-836a-671b350465fc Influence of flow rate, nozzle speed, pitch and the number of passes on the thickness of S1805 photoresist in SUSS MicroTec AS8 spray coater] ''RC-01, S1805'' | ||
| + | *[https://repository.upenn.edu/entities/publication/f6608537-5d05-4c9f-8d9f-9bf9cc333b36 MicroChem S1818 Contrast Curve Optimization] ''MA-01'' | ||
| + | *[https://repository.upenn.edu/entities/publication/c1f5aa27-e2be-4eb2-93ea-bf8a7efd35da Correction of pattern size deviations in the fabrication of photomasks made with a laser direct-writer] | ||
| + | *[https://repository.upenn.edu/entities/publication/1956d081-da9f-497f-b6f1-82f3d7c72196 Surface Treatment and Adhesion Study] | ||
| + | *[https://repository.upenn.edu/entities/publication/7ee1b740-1ff8-4ada-a5eb-81be1a090117 Heidelberg DWL66+ S1805 Contrast Curves] | ||
| + | *[https://repository.upenn.edu/entities/publication/5bd0136f-e116-4721-9c84-164f17f04393 Heidelberg DWL66+ S1813 Contrast Curves] | ||
| + | *[https://repository.upenn.edu/entities/publication/1a9111e9-7e53-4e47-a11d-3fd34ce7de12 MicroChem S1800 Series Resist Application onto Si] | ||
=====External Resources===== | =====External Resources===== | ||
Revision as of 13:26, 28 July 2025
THIS PAGE IS UNDER CONSTRUCTION
- How to Make a Mask
- Resists at QNF
- Developers at QNF -- Under Construction
- Ancillary Process Chemicals at QNF -- Under Construction
- KemLab Resist Presentation
Internal Reports
- Effect of Developer Temperature on Photoresist Contrast in Grayscale Lithography LW-01, SPR 220-3
- Optimization of Bilayer Lift-Off Process to Enable the Gap Size of 1μm Using LOR 3A and S1813
- Influence of flow rate, nozzle speed, pitch and the number of passes on the thickness of S1805 photoresist in SUSS MicroTec AS8 spray coater RC-01, S1805
- MicroChem S1818 Contrast Curve Optimization MA-01
- Correction of pattern size deviations in the fabrication of photomasks made with a laser direct-writer
- Surface Treatment and Adhesion Study
- Heidelberg DWL66+ S1805 Contrast Curves
- Heidelberg DWL66+ S1813 Contrast Curves
- MicroChem S1800 Series Resist Application onto Si