Difference between revisions of "Photolithography"
Jump to navigation
Jump to search
| Line 16: | Line 16: | ||
** [https://www.microchemicals.com/dokumente/application_notes/softbake_photoresist.pdf Softbake] | ** [https://www.microchemicals.com/dokumente/application_notes/softbake_photoresist.pdf Softbake] | ||
** [https://www.microchemicals.com/dokumente/application_notes/photoresist_rehydration.pdf Rehydration] | ** [https://www.microchemicals.com/dokumente/application_notes/photoresist_rehydration.pdf Rehydration] | ||
| + | **[https://www.microchemicals.com/dokumente/application_notes/development_photoresist.pdf Development] | ||
* '''[https://www.imicromaterials.com/technical IMM Technical Resources]''' | * '''[https://www.imicromaterials.com/technical IMM Technical Resources]''' | ||
**[https://www.imicromaterials.com/index.php/technical/lithography-process-overview Lithography Process Overview] | **[https://www.imicromaterials.com/index.php/technical/lithography-process-overview Lithography Process Overview] | ||
**[https://www.imicromaterials.com/index.php/products/ig-line-photoresists/humidity-control Effect of Ambient Humidity on Photoresists] | **[https://www.imicromaterials.com/index.php/products/ig-line-photoresists/humidity-control Effect of Ambient Humidity on Photoresists] | ||
Revision as of 16:16, 25 July 2025
THIS PAGE IS UNDER CONSTRUCTION
- How to Make a Mask
- Resists at QNF
- Developers at QNF -- Under Construction
- Ancillary Process Chemicals at QNF -- Under Construction
- KemLab Resist Presentation