Difference between revisions of "CEE 200X Spinner"
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m (Coana moved page Spinner - SU-8/PDMS to CEE 200X Spinner: No longer used for Soft Lithography, being kept for surface protection/coating at 'Cut & Connect') |
(→Description: Update description) |
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== Description == | == Description == | ||
| − | Spinner for coating substrates with | + | Spinner for coating substrates with resists and protective coverings for laser-cutting and dicing. Can also be used to apply PDMS. Control of ramp rate and speed. Includes wafer centering step. |
== Resources == | == Resources == | ||
Revision as of 14:58, 12 March 2024
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| Tool Name | Spinner - SU8/PDMS |
|---|---|
| Instrument Type | Lithography |
| Staff Manager | Ana Cohen |
| Lab Location | Soft Lithography |
| Tool Manufacturer | CEE |
| Tool Model | 200X |
| NEMO Designation | SPN-07 |
| Lab Phone | 3-9639 |
| SOP Link | SOP |
Description
Spinner for coating substrates with resists and protective coverings for laser-cutting and dicing. Can also be used to apply PDMS. Control of ramp rate and speed. Includes wafer centering step.