Difference between revisions of "Resists at QNF"
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(Reorganized and updated to include tool compatibility along with composition, developer and remover chemistries) |
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=== QNF Supplied Standard Photoresists === | === QNF Supplied Standard Photoresists === | ||
{| class="wikitable sortable" | {| class="wikitable sortable" | ||
− | ! Name | + | ! Name / Datasheet !! Tone !! Composition !! Use / Thickness !! Tool Compatibility !! Developer !! Remover !! Alternative Resists |
|- | |- | ||
− | | [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1805] || + || General || | + | | [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1805] || + || PGMEA || General || || MF-319 (0.24N TMAH) || MP 1165 (NMP) || KL5305 |
|- | |- | ||
− | | [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1813] || + || General || | + | | [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1813] || + || PGMEA || General || || MF-319 (0.24N TMAH) || MP 1165 (NMP) || KL5315 |
|- | |- | ||
− | | [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1818] || + || General || | + | | [https://amolf.nl/wp-content/uploads/2016/09/datasheets_S1800.pdf S1818] || + || PGMEA || General || || MF-319 (0.24N TMAH) || MP 1165 (NMP) || |
|- | |- | ||
− | | [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-3] || + | + | | [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-3] || + || Ethyl lactate, anisole, n-amyl acetate || Etch || || 0.24N TMAH || MP 1165 (NMP) || KPRO-3, KL6003, AZ3330F |
|- | |- | ||
− | | [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-4.5] || + | + | | [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-4.5] || + || Ethyl lactate, anisole, n-amyl acetate || Etch || || 0.24N TMAH || MP 1165 (NMP) || KPRO-3, KL6003, AZ3330F |
|- | |- | ||
− | | [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-7] || + | + | | [https://upenn.box.com/s/lpd3ev35603w582la2317tkubb36ylzt SPR 220-7] || + || Ethyl lactate, anisole, n-amyl acetate || Etch || || 0.24N TMAH or 0.26N TMAH || MP 1165 (NMP) || AZ 12XT, AZ P4620 |
|- | |- | ||
− | | [https://upenn.box.com/s/xb5pfl6zbb1eynl6oyerrub0lw3xh3n7 AZ 3330F] || + || General, Metal RIE, Plating || | + | | [https://upenn.box.com/s/xb5pfl6zbb1eynl6oyerrub0lw3xh3n7 AZ 3330F] || + || PGMEA || General, Metal RIE, Plating || || AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts) || || SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003 |
|- | |- | ||
− | | [https://upenn.box.com/s/lff7qf7wq9cn1ny8bytf0e8d87ddjit0 NR7-3000P] || - || Etch, General || | + | | [https://upenn.box.com/s/lff7qf7wq9cn1ny8bytf0e8d87ddjit0 NR7-3000P] || - || Cyclohexanone || Etch, General || || RD6 (0.24N or 0.26N TMAH) || RR4 (DMSO), Acetone || |
|- | |- | ||
− | | [https://upenn.box.com/s/1nocyldqmocrqmz1gjcwry8n86m9khtu APOL-LO 3202] || - || Liftoff || | + | | [https://upenn.box.com/s/1nocyldqmocrqmz1gjcwry8n86m9khtu APOL-LO 3202] || - || PGMEA || Liftoff || || 0.26N TMAH || NMP, DMSO || |
|- | |- | ||
− | | IP-Dip || - || Nanoscribe, Epoxy || | + | | IP-Dip || - || Ethoxylated acrylates || Nanoscribe, Epoxy || || PGMEA, IPA || || |
|- | |- | ||
− | | [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 2] || - | + | | [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 2] || - || Cyclopentanone, gamma butyro lactone|| Epoxy || || PGMEA || || SU-8 2005 |
|- | |- | ||
− | | [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 50] || - | + | | [https://upenn.box.com/s/4ilkowm17lowx3aod1pt8fwcrf1a8wvc HARE SQ 50] || - || Cyclopentanone, gamma butyro lactone || Epoxy || || PGMEA || || SU-8 2050 |
|} | |} | ||
=== Stockroom Photoresists === | === Stockroom Photoresists === | ||
{| class="wikitable sortable" | {| class="wikitable sortable" | ||
− | ! | + | ! Name / Datasheet !! Tone !! Composition !! Use / Thickness !! Tool Compatibility !! Developer !! Remover !! Alternative Resists |
|- | |- | ||
− | | SU-8 2005|| - || Epoxy || HARE SQ 2 | + | | [https://upenn.box.com/s/f9oi75p3p84rdtpqq5unp0j1c3mqxjrd SU-8 2005] || - || Cyclopentanone || Epoxy || || SU-8 Developer (PGMEA) || || HARE SQ 2 |
|- | |- | ||
− | | SU-8 2050|| - || Epoxy || HARE SQ 50 | + | | [https://upenn.box.com/s/s4noknbqlyh8inq3gqycw115b7ufdibu SU-8 2050] || - || Cyclopentanone || Epoxy || || SU-8 Developer (PGMEA) || || HARE SQ 50 |
|- | |- | ||
− | | SU-8 2100|| - || Epoxy || HARE SQ 50 | + | | [https://upenn.box.com/s/va40gxhk7ghwl8p9hhsyvr0rairc9v1e SU-8 2100] || - || Cyclopentanone || Epoxy || || SU-8 Developer (PGMEA) || || HARE SQ 50 |
|- | |- | ||
− | | SU-8 3050|| - || Epoxy || HARE SQ 50 | + | | [https://upenn.box.com/s/f9oi75p3p84rdtpqq5unp0j1c3mqxjrd SU-8 3050] || - || Cyclopentanone || Epoxy || || SU-8 Developer (PGMEA) || || HARE SQ 50 |
|} | |} | ||
=== Standard e-beam Resists === | === Standard e-beam Resists === | ||
{| class="wikitable sortable" | {| class="wikitable sortable" | ||
− | ! | + | ! Name / Datasheet !! Tone !! Composition !! Use / Thickness !! Tool Compatibility !! Developer !! Remover !! Alternative Resists |
|- | |- | ||
− | | 495 PMMA A8|| + || Lower Resolution | + | | [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 495 PMMA A8] || + || Anisole || Lower Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP || |
|- | |- | ||
− | | 495 PMMA A4|| + || Lower Resolution | + | | [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 495 PMMA A4] || + || Anisole || Lower Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP || |
|- | |- | ||
− | | 495 PMMA A2|| + || Lower Resolution | + | | [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 495 PMMA A2] || + || Anisole || Lower Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP || |
|- | |- | ||
− | | 950 PMMA A4|| + || High Resolution | + | | [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 950 PMMA A4] || + || Anisole || High Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP || |
|- | |- | ||
− | | 950 PMMA A2|| + || High Resolution | + | | [https://upenn.box.com/s/ff9s9dhl52tqagc0vbtflwf64odcwtw7 950 PMMA A2] || + || Anisole || High Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP || 1000 HARP 0.1 |
|- | |- | ||
− | | 1000 HARP 1.3|| + || High Resolution | + | | [https://upenn.box.com/s/re1sz5cil83m99yv3ug2p9p8ghk3a3vm 1000 HARP 1.3] || + || Anisole || High Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP || |
|- | |- | ||
− | | 1000 HARP 0.1|| + || High Resolution | + | | [https://upenn.box.com/s/re1sz5cil83m99yv3ug2p9p8ghk3a3vm 1000 HARP 0.1] || + || Anisole || High Resolution|| [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || MIBK || NMP || 950 PMMA A2 |
|} | |} | ||
=== Stockroom e-beam Resists === | === Stockroom e-beam Resists === | ||
{| class="wikitable sortable" | {| class="wikitable sortable" | ||
− | ! | + | ! Name / Datasheet !! Tone !! Composition !! Use / Thickness !! Tool Compatibility !! Developer !! Remover !! Alternative Resists |
|- | |- | ||
− | | ZEP 520A|| + || Thicker formulation | + | | [https://upenn.box.com/s/7ek7ccxq3c8xsp8jhe2lhdoi1e0keamt ZEP 520A] || + || Anisole || Thicker formulation || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || Xylenes, n-amyl acetate or MIBK || || |
|- | |- | ||
− | | ZEP 520A-7|| + || Thinner formulation || | + | | [https://upenn.box.com/s/7ek7ccxq3c8xsp8jhe2lhdoi1e0keamt ZEP 520A-7] || + || Anisole || Thinner formulation || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || Xylenes, n-amyl acetate or MIBK || || |
|- | |- | ||
− | | H-SiQ 6%|| - || HSQ Equivalent | + | | [https://upenn.box.com/s/bv53alommdr2en6s6byrlm4psxdjohzp H-SiQ 6%] || - || MIBK || HSQ Equivalent || [https://wiki.nano.upenn.edu/wiki/index.php?title=Elionix_ELS-7500EX_E-Beam_Lithography_System EBL-01], SPN-06 || 0.24N TMAH or 0.26N TMAH || || |
|} | |} | ||
=== Other Resists === | === Other Resists === | ||
{| class="wikitable sortable" | {| class="wikitable sortable" | ||
− | ! | + | ! Name / Datasheet !! Tone !! Composition !! Use / Thickness !! Tool Compatibility !! Developer !! Remover !! Alternative Resists |
|- | |- | ||
− | | LOR 3A|| N/A || Liftoff, Non-imaging || || | + | | [https://upenn.box.com/s/ugfgv8xix7vda56ddaodqv3za44m6syk LOR 3A] || N/A || Cyclopentanone, PGME || Liftoff, Non-imaging || || 0.24N TMAH, 0.26N TMAH || EBR PG (ethylene glycol, PGME) || |
|- | |- | ||
− | | PMGI SF 5S|| N/A || Liftoff, Non-imaging || || | + | | [https://upenn.box.com/s/ugfgv8xix7vda56ddaodqv3za44m6syk PMGI SF 5S] || N/A || Cyclopentanone, PGME || Liftoff, Non-imaging || || 0.24N TMAH, 0.26N TMAH || EBR PG (ethylene glycol, PGME) || |
|- | |- | ||
− | | PMGI SF 2S|| N/A || Liftoff, Non-imaging || || | + | | [https://upenn.box.com/s/ugfgv8xix7vda56ddaodqv3za44m6syk PMGI SF 2S] || N/A || Cyclopentanone, PGME || Liftoff, Non-imaging || || 0.24N TMAH, 0.26N TMAH || EBR PG (ethylene glycol, PGME) || |
|- | |- | ||
− | | NXR-1025|| N/A || Stockroom, Nanoimprint | + | | [https://upenn.box.com/s/wmal2jasuw6m9nqjykz6p8i2ijdn61fm NXR-1025] || N/A || || Stockroom, Nanoimprint || || || |
|} | |} | ||
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{| class="wikitable sortable" | {| class="wikitable sortable" | ||
− | ! | + | ! Name / Datasheet !! Tone !! Composition !! Use / Thickness !! Tool Compatibility !! Developer !! Remover !! Alternative Resists |
|- | |- | ||
− | + | | [https://upenn.box.com/s/1ixn9uek8d78y16x3auicmso433glmvv KL5305] || + || PGMEA || General || || 0.26N TMAH|| NMP, DMSO || S1805 | |
|- | |- | ||
− | + | | [https://upenn.box.com/s/1ixn9uek8d78y16x3auicmso433glmvv KL5315] || + || PGMEA || General || || 0.26N TMAH || NMP, DMSO || S1813 | |
|- | |- | ||
− | | KL6003 || + || || SPR 220-3, SPR 220-4.5 | + | | [https://upenn.box.com/s/qv98tqy0ark0l7ppmvphdicgs7udst1f KL6003] || + || PGMEA || || || 0.26N TMAH || NMP, DMSO || SPR 220-3, SPR 220-4.5 |
|- | |- | ||
− | | K-PRO 3 || + || Plating, Etching|| SPR 220-3, SPR 220-4.5 | + | | [https://upenn.box.com/s/v0hwe0p0u3la1oodz3g45qjw0yl54z7f K-PRO 3] || + || PGMEA || Plating, Etching || || 0.26N TMAH or alkaline salts || NMP, DMSO || SPR 220-3, SPR 220-4.5 |
|- | |- | ||
− | | AZ 12XT-20PL-15 || + || CAR (i-line), Plating, Packaging, Deep Etch || SPR 220-7, AZ P4620 | + | | [https://upenn.box.com/s/dj5l9rrsg0k8g8opdegrylhkgypev9w9 AZ 12XT-20PL-15] || + || PGMEA || CAR (i-line), Plating, Packaging, Deep Etch || || AZ300 (0.26N TMAH) || || SPR 220-7, AZ P4620 |
|- | |- | ||
− | | AZ P4620|| + || Thick Resist, Plating, Packaging || SPR 220-7, AZ 12XT-20PL-15 | + | | [https://upenn.box.com/s/0r8meepoyq0b1jux7ubudcpt70clau48 AZ P4620] || + || PGMEA || Thick Resist, Plating, Packaging || || AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts) || || SPR 220-7, AZ 12XT-20PL-15 |
|- | |- | ||
− | | ma-N 2403|| - || e-beam/DUV Mix and Match || || | + | | [https://upenn.box.com/s/7ywdt8x3fqda3p21l4es7fyd98s0fbep ma-N 2403] || - || || e-beam/DUV Mix and Match || || || || |
|} | |} |
Revision as of 14:49, 30 June 2023
The QNF provides a variety of standard resists to meet demands for most applications. Some specialty resists are also sold through the QNF Stockroom. A summary of stocked resists along with some processing information can be found in the table below. Click on the resist name to access the datasheet. Other similar options that may be available in QNF are also listed.
QNF Supplied Standard Photoresists
Name / Datasheet | Tone | Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
S1805 | + | PGMEA | General | MF-319 (0.24N TMAH) | MP 1165 (NMP) | KL5305 | |
S1813 | + | PGMEA | General | MF-319 (0.24N TMAH) | MP 1165 (NMP) | KL5315 | |
S1818 | + | PGMEA | General | MF-319 (0.24N TMAH) | MP 1165 (NMP) | ||
SPR 220-3 | + | Ethyl lactate, anisole, n-amyl acetate | Etch | 0.24N TMAH | MP 1165 (NMP) | KPRO-3, KL6003, AZ3330F | |
SPR 220-4.5 | + | Ethyl lactate, anisole, n-amyl acetate | Etch | 0.24N TMAH | MP 1165 (NMP) | KPRO-3, KL6003, AZ3330F | |
SPR 220-7 | + | Ethyl lactate, anisole, n-amyl acetate | Etch | 0.24N TMAH or 0.26N TMAH | MP 1165 (NMP) | AZ 12XT, AZ P4620 | |
AZ 3330F | + | PGMEA | General, Metal RIE, Plating | AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts) | SPR 220-3, SPR 220-4.5, K-PRO 3, KL6003 | ||
NR7-3000P | - | Cyclohexanone | Etch, General | RD6 (0.24N or 0.26N TMAH) | RR4 (DMSO), Acetone | ||
APOL-LO 3202 | - | PGMEA | Liftoff | 0.26N TMAH | NMP, DMSO | ||
IP-Dip | - | Ethoxylated acrylates | Nanoscribe, Epoxy | PGMEA, IPA | |||
HARE SQ 2 | - | Cyclopentanone, gamma butyro lactone | Epoxy | PGMEA | SU-8 2005 | ||
HARE SQ 50 | - | Cyclopentanone, gamma butyro lactone | Epoxy | PGMEA | SU-8 2050 |
Stockroom Photoresists
Name / Datasheet | Tone | Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
SU-8 2005 | - | Cyclopentanone | Epoxy | SU-8 Developer (PGMEA) | HARE SQ 2 | ||
SU-8 2050 | - | Cyclopentanone | Epoxy | SU-8 Developer (PGMEA) | HARE SQ 50 | ||
SU-8 2100 | - | Cyclopentanone | Epoxy | SU-8 Developer (PGMEA) | HARE SQ 50 | ||
SU-8 3050 | - | Cyclopentanone | Epoxy | SU-8 Developer (PGMEA) | HARE SQ 50 |
Standard e-beam Resists
Name / Datasheet | Tone | Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
495 PMMA A8 | + | Anisole | Lower Resolution | EBL-01, SPN-06 | MIBK | NMP | |
495 PMMA A4 | + | Anisole | Lower Resolution | EBL-01, SPN-06 | MIBK | NMP | |
495 PMMA A2 | + | Anisole | Lower Resolution | EBL-01, SPN-06 | MIBK | NMP | |
950 PMMA A4 | + | Anisole | High Resolution | EBL-01, SPN-06 | MIBK | NMP | |
950 PMMA A2 | + | Anisole | High Resolution | EBL-01, SPN-06 | MIBK | NMP | 1000 HARP 0.1 |
1000 HARP 1.3 | + | Anisole | High Resolution | EBL-01, SPN-06 | MIBK | NMP | |
1000 HARP 0.1 | + | Anisole | High Resolution | EBL-01, SPN-06 | MIBK | NMP | 950 PMMA A2 |
Stockroom e-beam Resists
Name / Datasheet | Tone | Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
ZEP 520A | + | Anisole | Thicker formulation | EBL-01, SPN-06 | Xylenes, n-amyl acetate or MIBK | ||
ZEP 520A-7 | + | Anisole | Thinner formulation | EBL-01, SPN-06 | Xylenes, n-amyl acetate or MIBK | ||
H-SiQ 6% | - | MIBK | HSQ Equivalent | EBL-01, SPN-06 | 0.24N TMAH or 0.26N TMAH |
Other Resists
Name / Datasheet | Tone | Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
LOR 3A | N/A | Cyclopentanone, PGME | Liftoff, Non-imaging | 0.24N TMAH, 0.26N TMAH | EBR PG (ethylene glycol, PGME) | ||
PMGI SF 5S | N/A | Cyclopentanone, PGME | Liftoff, Non-imaging | 0.24N TMAH, 0.26N TMAH | EBR PG (ethylene glycol, PGME) | ||
PMGI SF 2S | N/A | Cyclopentanone, PGME | Liftoff, Non-imaging | 0.24N TMAH, 0.26N TMAH | EBR PG (ethylene glycol, PGME) | ||
NXR-1025 | N/A | Stockroom, Nanoimprint |
Miscellaneous
These may be available but are not guaranteed to be stocked
Name / Datasheet | Tone | Composition | Use / Thickness | Tool Compatibility | Developer | Remover | Alternative Resists |
---|---|---|---|---|---|---|---|
KL5305 | + | PGMEA | General | 0.26N TMAH | NMP, DMSO | S1805 | |
KL5315 | + | PGMEA | General | 0.26N TMAH | NMP, DMSO | S1813 | |
KL6003 | + | PGMEA | 0.26N TMAH | NMP, DMSO | SPR 220-3, SPR 220-4.5 | ||
K-PRO 3 | + | PGMEA | Plating, Etching | 0.26N TMAH or alkaline salts | NMP, DMSO | SPR 220-3, SPR 220-4.5 | |
AZ 12XT-20PL-15 | + | PGMEA | CAR (i-line), Plating, Packaging, Deep Etch | AZ300 (0.26N TMAH) | SPR 220-7, AZ P4620 | ||
AZ P4620 | + | PGMEA | Thick Resist, Plating, Packaging | AZ300 (0.26N TMAH) or AZ400K 1:4 (potassium salts) | SPR 220-7, AZ 12XT-20PL-15 | ||
ma-N 2403 | - | e-beam/DUV Mix and Match |