Difference between revisions of "Process Resources"
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(→Lithography: Ancillary Process Chemicals) |
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| Line 4: | Line 4: | ||
= Lithography = | = Lithography = | ||
* [[Resists at QNF]] | * [[Resists at QNF]] | ||
| − | * [[Developers at QNF]] -- Under Construction | + | * [[Developers at QNF]] -- Under Construction] |
| + | * [[Ancillary Process Chemicals at QNF]] -- Under Construction | ||
= Film Characterization= | = Film Characterization= | ||
Revision as of 14:23, 3 July 2023
General Process Documents
Lithography
- Resists at QNF
- Developers at QNF -- Under Construction]
- Ancillary Process Chemicals at QNF -- Under Construction
Film Characterization
- Deposition and Etch Characterization of LPCVD SiNx thin films
- ALD deposition of SiO2 using BDEAS and Ozone precursors