Difference between revisions of "Lesker Nano-36 Thermal Evaporator"
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===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
| − | + | Link: [https://nemo.nano.upenn.edu/media/tool_documents/pvd-01-nano-36-thermal/PVD-01_SOP_New_V1.docx.pdf SOP] | |
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| + | <pdf height="800">File:PVD-01_SOP_New_V1.pdf</pdf> | ||
===== Materials vapor-pressure ===== | ===== Materials vapor-pressure ===== | ||
* [https://www.powerstream.com/vapor-pressure.htm PowerStream website] | * [https://www.powerstream.com/vapor-pressure.htm PowerStream website] | ||
Latest revision as of 11:39, 12 November 2025
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| Tool Name | Lesker Nano-36 Thermal Evaporator |
|---|---|
| Instrument Type | Deposition |
| Staff Manager | David Barth |
| Lab Location | Bay 2 |
| Tool Manufacturer | Kurt J. Lesker |
| Tool Model | Nano-36 |
| NEMO Designation | PVD-01 |
| Nearest Phone | 215-898-9748 |
| SOP Link | SOP |
Description
The Kurt J. Lesker Nano36 will evaporate a metal film under high vacuum while measuring the thickness in-situ by a thickness monitor. Up to three different materials can be loaded in one batch, and the evaporation sources are sufficiently isolated from each other by shields to prevent cross contamination. The wafer platen can accommodate sizes up to 150 mm.
Deposition Sources
The tool is primarily used for deposition of indium and other materials whose vapor pressure or other properties make them unsuitable for other chambers (such as tin). Most materials are allowed in this tool. Please discuss with staff before beginning any new process in the tool.
Resources
SOPs & Troubleshooting
Link: SOP