Difference between revisions of "Intlvac E-beam Evaporator"

From Quattrone Nanofabrication Facility
Jump to navigation Jump to search
 
(3 intermediate revisions by the same user not shown)
Line 13: Line 13:
 
| NEMO_Designation = PVD-09
 
| NEMO_Designation = PVD-09
 
| Lab_Phone = 215-898-9748
 
| Lab_Phone = 215-898-9748
| SOP Link = [https://www.seas.upenn.edu/~nanosop/PVD75_e-beam_SOP.htm SOP]
+
| SOP Link = [https://nemo.nano.upenn.edu/media/tool_documents/pvd-09-intlvac-evap/PVD09_SOP_v01.docx.pdf SOP]
 
}}
 
}}
  
Line 19: Line 19:
 
===== The tool =====
 
===== The tool =====
  
The IntlVac Electron Beam Evaporator has a base process chamber pressure in the e-8 Torr range with substrate heating and ozone purging capabilities. Deposition rates are monitored by an automated magazine of 6MHz crystals. The tool can be used to process a single 4 inch wafer at a time or a selection of small chips/pieces.
+
The IntlVac Electron Beam Evaporator has a base process chamber pressure in the low e-8 Torr range with substrate heating and ozone purging capabilities. Deposition rates are monitored by an automated magazine of 6MHz crystals. The tool can be used to process a single 4 inch wafer at a time or a selection of small chips/pieces.
  
 
===== Available materials =====
 
===== Available materials =====
Line 31: Line 31:
 
===== SOPs & Troubleshooting =====
 
===== SOPs & Troubleshooting =====
  
* [https://upenn.box.com/s/ql6qfjqn6xu3vojqk8ykf6crivodgv3f PVD-09 SOP]
+
* [https://nemo.nano.upenn.edu/media/tool_documents/pvd-09-intlvac-evap/PVD09_SOP_v01.docx.pdf PVD-09 SOP]

Latest revision as of 15:46, 20 September 2024


Intlvac E-Beam Evaporator
PVD-09.jpg
Tool Name Intlvac E-Beam Evaporator
Instrument Type Physical vapor deposition
Staff Manager David Barth
Lab Location Bay 2
Tool Manufacturer Intlvac
Tool Model Nanochrome
NEMO Designation PVD-09
Lab Phone 215-898-9748
SOP Link SOP

Description

The tool

The IntlVac Electron Beam Evaporator has a base process chamber pressure in the low e-8 Torr range with substrate heating and ozone purging capabilities. Deposition rates are monitored by an automated magazine of 6MHz crystals. The tool can be used to process a single 4 inch wafer at a time or a selection of small chips/pieces.

Available materials

The tool contains the following materials:

  • Al - Aluminum
  • Ti - Titanium

Resources

SOPs & Troubleshooting