Difference between revisions of "Developers at QNF"

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The following are developers you may encounter in the QNF wet benches.
 
The following are developers you may encounter in the QNF wet benches.
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'' '''Please note:''' Cross contaminating inorganic developer baths with TMAH-based metal ion free developers, even at parts per million levels, will degrade or completely neutralize the performance of the inorganic developer. Use extreme caution when sharing dishes between a TMAH based developer and an inorganic process. ''
  
 
{| class="wikitable sortable"
 
{| class="wikitable sortable"
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! Name !! Manufacturer !! Chemical Composition !! Hazards !! Resist Compatibility !! Alternatives
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! Name !! Manufacturer !! Chemical Composition !! Hazards !! Use !! Alternatives
 
|-
 
|-
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| TMAH 0.26N || KemLab || 0.26N TMAH (Metal Ion Free) || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresists, Liftoff Resists || CD-26, AZ300MIF
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| TMAH 0.26N || KemLab || 0.26N TMAH (Metal Ion Free) || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresist Development (e.g. S1800 series, IP3500), Liftoff Resists, HMDS Removal, Aluminum Etchant || CD-26, AZ300MIF
 
|-
 
|-
−
| CD-26 || Microposit/Dupont || 0.26N TMAH (Metal Ion Free) || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresists, Liftoff Resists || TMAH 0.26N (preferred), AZ300MIF
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| CD-26 || Microposit/Dupont || 0.26N TMAH (Metal Ion Free) || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant || TMAH 0.26N (preferred), AZ300MIF
 
|-
 
|-
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| AZ300 MIF || AZ Materials/Merck || 0.26N TMAH (Metal Ion Free) || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresists, Liftoff Resists || TMAH 0.26N (preferred), CD-26
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| AZ300 MIF || AZ Materials/Merck || 0.26N TMAH (Metal Ion Free) || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant || TMAH 0.26N (preferred), CD-26
 
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|-
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| CD-26A || Microposit/Dupont || 0.26N TMAH (Metal Ion Free) w/ Surfactant || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || || AZ917MIF, TMAH 0.26N, CD-26, AZ300MIF
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| CD-26A || Microposit/Dupont || 0.26N TMAH (Metal Ion Free) w/ Surfactant || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant || AZ917MIF, TMAH 0.26N, CD-26, AZ300MIF
 
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|-
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| AZ917 MIF || AZ Materials/Merck || 0.26N TMAH (Metal Ion Free) w/ Surfactant || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || || CD-26A, TMAH 0.26N, CD-26, AZ300MIF
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| AZ917 MIF || AZ Materials/Merck || 0.26N TMAH (Metal Ion Free) w/ Surfactant || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant || CD-26A, TMAH 0.26N, CD-26, AZ300MIF
 
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|-
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| MF321 || Microposit/Dupont || 0.21N TMAH (Metal Ion Free) w/ Surfactant || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || || AZ422 MIF, TMAH 0.26N
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| MF321 || Microposit/Dupont || 0.21N TMAH (Metal Ion Free) w/ Surfactant || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant || AZ422 MIF, TMAH 0.26N
 
|-
 
|-
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|AZ422 MIF || AZ Materials/Merck || 0.21N TMAH (Metal Ion Free) w/ Surfactant || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || || MF321, TMAH 0.26N
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|AZ422 MIF || AZ Materials/Merck || 0.21N TMAH (Metal Ion Free) w/ Surfactant || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant || MF321, TMAH 0.26N
 
|-
 
|-
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| AZ400K 1:4 || AZ Materials/Merck || Dilute Potassium Borates (Metal Ion Bearing) || Strong Base -- Irritant, Corrosive || Thick Photoresists (AZP4620), Mask Plates (AZ1500) ||  
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| AZ400K|| AZ Materials/Merck || Potassium Borates (Metal Ion Bearing) || Strong Base -- Irritant, Corrosive || Development of Thick Photoresists (AZP4620), Mask Plates (AZ1500) -- Manually dilute 1:3 or 1:4 with DI water ||  
 
|-
 
|-
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| SU-8 Developer || MicroChem/Kayaku || PGMEA (1-methoxy-2-propanol acetate) || Organic Solvent -- Flammable || SU-8, HARE SQ, IP-Dip || SQ Developer
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| SU-8 Developer || MicroChem/Kayaku || PGMEA (1-methoxy-2-propanol acetate) || Organic Solvent -- Flammable || SU-8, HARE SQ, IP-S & IP-Dip Development|| HARE SQ Developer (preferred)
 
|-
 
|-
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| SQ Developer || KemLab || PGMEA (1-methoxy-2-propanol acetate) || Organic Solvent -- Flammable || HARE SQ, SU-8, IP-Dip || SU-8 Developer
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| HARE SQ Developer || KemLab || PGMEA (1-methoxy-2-propanol acetate) || Organic Solvent -- Flammable || HARE SQ, SU-8, IP-S & IP-Dip Development || SU-8 Developer
 
|-
 
|-
 
|O-Xylene || N/A  || O-Xylene || Organic Solvent -- Flammable, Irritant || ZEP520 || Amyl Acetate (preferred)
 
|O-Xylene || N/A  || O-Xylene || Organic Solvent -- Flammable, Irritant || ZEP520 || Amyl Acetate (preferred)
 
|}
 
|}

Latest revision as of 17:32, 25 July 2025

The following are developers you may encounter in the QNF wet benches.

Please note: Cross contaminating inorganic developer baths with TMAH-based metal ion free developers, even at parts per million levels, will degrade or completely neutralize the performance of the inorganic developer. Use extreme caution when sharing dishes between a TMAH based developer and an inorganic process.

Name Manufacturer Chemical Composition Hazards Use Alternatives
TMAH 0.26N KemLab 0.26N TMAH (Metal Ion Free) Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) Photoresist Development (e.g. S1800 series, IP3500), Liftoff Resists, HMDS Removal, Aluminum Etchant CD-26, AZ300MIF
CD-26 Microposit/Dupont 0.26N TMAH (Metal Ion Free) Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant TMAH 0.26N (preferred), AZ300MIF
AZ300 MIF AZ Materials/Merck 0.26N TMAH (Metal Ion Free) Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant TMAH 0.26N (preferred), CD-26
CD-26A Microposit/Dupont 0.26N TMAH (Metal Ion Free) w/ Surfactant Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant AZ917MIF, TMAH 0.26N, CD-26, AZ300MIF
AZ917 MIF AZ Materials/Merck 0.26N TMAH (Metal Ion Free) w/ Surfactant Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant CD-26A, TMAH 0.26N, CD-26, AZ300MIF
MF321 Microposit/Dupont 0.21N TMAH (Metal Ion Free) w/ Surfactant Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant AZ422 MIF, TMAH 0.26N
AZ422 MIF AZ Materials/Merck 0.21N TMAH (Metal Ion Free) w/ Surfactant Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant MF321, TMAH 0.26N
AZ400K AZ Materials/Merck Potassium Borates (Metal Ion Bearing) Strong Base -- Irritant, Corrosive Development of Thick Photoresists (AZP4620), Mask Plates (AZ1500) -- Manually dilute 1:3 or 1:4 with DI water
SU-8 Developer MicroChem/Kayaku PGMEA (1-methoxy-2-propanol acetate) Organic Solvent -- Flammable SU-8, HARE SQ, IP-S & IP-Dip Development HARE SQ Developer (preferred)
HARE SQ Developer KemLab PGMEA (1-methoxy-2-propanol acetate) Organic Solvent -- Flammable HARE SQ, SU-8, IP-S & IP-Dip Development SU-8 Developer
O-Xylene N/A O-Xylene Organic Solvent -- Flammable, Irritant ZEP520 Amyl Acetate (preferred)
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