Difference between revisions of "Oxford Cobra ICP Etcher"
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===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://repository.upenn.edu/scn_sop/19/ QNF SOP] | * [https://repository.upenn.edu/scn_sop/19/ QNF SOP] | ||
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| + | *[https://upenn.app.box.com/folder/163249152480 Chuck heating and cool down] | ||
Revision as of 09:14, 18 May 2022
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| Tool Name | Oxford Cobra ICP Etcher |
|---|---|
| Instrument Type | Etch |
| Staff Manager | Sam Azadi |
| Lab Location | Bay 2 |
| Tool Manufacturer | Oxford Instruments |
| Tool Model | Cobra PlasmaPro 100 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | 215-898-9748 |
| SOP Link | SOP |
Description
Oxford PlasmaPro 100 is an inductively coupled plasma (ICP) etcher. The tool uses an RF magnetic field to induce an RF electric field and energize the electrons that result in the ionization of gas molecules and atoms at low pressures. The plasma created in the ICP tool is denser, which allows for a wider range of etching.
The tool is connected to the following gases: BCl3, Cl2, Ar, O2, SF6, CF4, and CHF3.
Applications
- Etch of Si
- Etch of SiO2
- Etch of SiNx
- Etch of InP
- Etch of Al, Cr, Ti, hafnia, alumina ....
- for a complete list of materials etched in the tool please refer to the SOP at the bottom off this page
Resources
SOPs & Troubleshooting