Difference between revisions of "Anatech SCE-106 Barrel Asher"

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| Instrument_Type = Soft Lithography
 
| Instrument_Type = Soft Lithography
 
| Staff_Manager = [[Ana Cohen | Ana Cohen]]
 
| Staff_Manager = [[Ana Cohen | Ana Cohen]]
| Lab_Location = Bay 2
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| Lab_Location = Bay 6
 
| Tool_Manufacturer = Anatech
 
| Tool_Manufacturer = Anatech
 
| Tool_Model = SCE-106
 
| Tool_Model = SCE-106
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== Description ==
 
== Description ==
Anatech USA’s SCE-100 Series Inductively Coupled (ICP) Plasma systems are extremely effective for a Plasma Ashing process to remove organics prior to thin film deposition and/or chemical analysis of remaining inorganics.
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Anatech USA’s SCE-100 Series Inductively Coupled (ICP) Plasma systems are extremely effective for a Plasma Ashing process to remove organics and improve adhesion prior to negative resist processing, as well as priming PDMS and glass substrates for adhesion.
  
Process gases are CF4, O2, Ar and N2. Sample sizes are pieces to 150 mm round wafers.
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Process gas is O2. Sample sizes are pieces to 100 mm round wafers.
  
 
===== Applications =====
 
===== Applications =====
* Removal of photoresist
 
 
* Removal of organic materials
 
* Removal of organic materials
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* Activation of PDMS and glass surfaces
  
  

Latest revision as of 15:26, 12 March 2024


Anatech SCE-106 Barrel Asher
DE-07.jpeg
Tool Name Anatech SCE-106 Barrel Asher
Instrument Type Soft Lithography
Staff Manager Ana Cohen
Lab Location Bay 6
Tool Manufacturer Anatech
Tool Model SCE-106
NEMO Designation DE-07
Lab Phone XXXXX
SOP Link SOP

Description

Anatech USA’s SCE-100 Series Inductively Coupled (ICP) Plasma systems are extremely effective for a Plasma Ashing process to remove organics and improve adhesion prior to negative resist processing, as well as priming PDMS and glass substrates for adhesion.

Process gas is O2. Sample sizes are pieces to 100 mm round wafers.

Applications
  • Removal of organic materials
  • Activation of PDMS and glass surfaces


Resources

SOPs & Troubleshooting