Difference between revisions of "ADT 7100 Dicing Saw"
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| Instrument_Type = Back End | | Instrument_Type = Back End | ||
| − | | Staff_Manager = Eric Johnston | + | | Staff_Manager = [[Eric Johnston | Eric Johnston]] |
| − | | Lab_Location = Singh | + | | Lab_Location = Singh 124 |
| Tool_Manufacturer = Advanced Dicing Technologies (ADT) | | Tool_Manufacturer = Advanced Dicing Technologies (ADT) | ||
| Tool_Model = 7122 | | Tool_Model = 7122 | ||
| − | | | + | | NEMO_Designation = BE-04 |
| Lab_Phone = none | | Lab_Phone = none | ||
| SOP Link = [https://repository.upenn.edu/scn_sop/17/ SOP] | | SOP Link = [https://repository.upenn.edu/scn_sop/17/ SOP] | ||
Latest revision as of 15:00, 12 March 2024
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| Tool Name | ADT 7100 Dicing Saw |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Eric Johnston |
| Lab Location | Singh 124 |
| Tool Manufacturer | Advanced Dicing Technologies (ADT) |
| Tool Model | 7122 |
| NEMO Designation | BE-04 |
| Lab Phone | none |
| SOP Link | SOP |
Description
Workhorse dicing saw with precision dicing and alignment system. This is an automated tool with a 2″, DC-brushless, 1.2 kW, Front-mounted, Air-bearing Spindle (60 krpm Max.), with closed-loop turntable, and is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.
Applications
- Dicing of Si wafers
- Dicing of glass wafers
- Dicing of sapphire wafers
Important Considerations
- Main cause of broken blades is having the saw descend directly onto the sample. The solution to this is to make sure your sample is centered as much as possible, and to have 10mm of over travel.
Resources
ADT Contacts:
- Bob McCort (semi-retired): rmccort@adt-co.com
- Bob Smith, process specialist: rhsmith@adt-co.com
