Difference between revisions of "ADT 7100 Dicing Saw"

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(update area name from Soft Lithography)
 
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| imagecaption =  
 
| imagecaption =  
 
| Instrument_Type = Back End
 
| Instrument_Type = Back End
| Staff_Manager = Dave Jones
+
| Staff_Manager = [[Eric Johnston | Eric Johnston]]
| Lab_Location = Bay 2
+
| Lab_Location = Singh 124
 
| Tool_Manufacturer = Advanced Dicing Technologies (ADT)  
 
| Tool_Manufacturer = Advanced Dicing Technologies (ADT)  
| Tool_Model = 7100
+
| Tool_Model = 7122
| Iris_Designation = BE-04
+
| NEMO_Designation = BE-04
 
| Lab_Phone = none
 
| Lab_Phone = none
 
| SOP Link = [https://repository.upenn.edu/scn_sop/17/ SOP]
 
| SOP Link = [https://repository.upenn.edu/scn_sop/17/ SOP]
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* Dicing of sapphire wafers
 
* Dicing of sapphire wafers
  
 +
===== Important Considerations =====
 +
* Main cause of broken blades is having the saw descend directly onto the sample. The solution to this is to make sure your sample is centered as much as possible, and to have 10mm of over travel.
  
 
== Resources ==
 
== Resources ==
 +
ADT Contacts:
 +
* Bob McCort (semi-retired): rmccort@adt-co.com
 +
* Bob Smith, process specialist: rhsmith@adt-co.com
  
 
===== SOPs & Troubleshooting =====
 
===== SOPs & Troubleshooting =====
 
* [https://repository.upenn.edu/scn_sop/17/ QNF SOP]
 
* [https://repository.upenn.edu/scn_sop/17/ QNF SOP]
* [https://alliance.seas.upenn.edu/~qnf/wiki/index.php?title=File:DicingSelection.png | Dicing Blade Selection]
+
* [https://upenn.box.com/s/dixnkv9cdqksmqy67eg3rdk7tzw1d1go Operational Manual]
 +
* [https://urldefense.com/v3/__https://lnf-wiki.eecs.umich.edu/wiki/ADT_7100_Dicing_Saw__;!!IBzWLUs!CxAen2043kyzzuVvC2TIklv-FS-rzC3b7KXgT_PfrFmrvE1Yxcqru6MgJTXBi5GMrvk$  Lurie SOP]
 +
* [https://drive.google.com/file/d/1OaMUS65IQB3LxHb5uDhZkGpUV1rOP8GU/view?usp=sharing Wafer Mounting Video (Lurie Lab, University of Michigan)]
 +
* [https://alliance.seas.upenn.edu/~qnf/wiki/index.php?title=File:DicingSelection.png Dicing Blade Selection - No blade part numbers]
 +
* [https://upenn.box.com/s/72vdy8fglkagye8pc1at2fdlg9bvpfqc  Material Dicing Guide]
 +
* [https://upenn.box.com/s/azdfq2hkroqw0br0razra1kktig7qx4w  Dicing Troubleshooting Guide]
 +
* [https://upenn.box.com/s/z7bg2lto5jf1pgb58cc1eh5t260p6uhg  Applications Dicing Guide]
 +
* [https://upenn.box.com/s/0ze3lfcdozajmu9nlyo1qdsitmcn8cbc  Detailed Material Dicing Guide]
 +
* [https://upenn.box.com/s/tfoculmc6kzo1bnoldtjwcgyryl4vr6c  Maintenance Manual]
 +
* [https://upenn.box.com/s/r66re7no7zadltzveigyokcq603ovp0x  ADT Resin Blades]

Latest revision as of 15:00, 12 March 2024


ADT 7100 Dicing Saw
BE-04.jpeg
Tool Name ADT 7100 Dicing Saw
Instrument Type Back End
Staff Manager Eric Johnston
Lab Location Singh 124
Tool Manufacturer Advanced Dicing Technologies (ADT)
Tool Model 7122
NEMO Designation BE-04
Lab Phone none
SOP Link SOP

Description

Workhorse dicing saw with precision dicing and alignment system. This is an automated tool with a 2″, DC-brushless, 1.2 kW, Front-mounted, Air-bearing Spindle (60 krpm Max.), with closed-loop turntable, and is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.

Applications
  • Dicing of Si wafers
  • Dicing of glass wafers
  • Dicing of sapphire wafers
Important Considerations
  • Main cause of broken blades is having the saw descend directly onto the sample. The solution to this is to make sure your sample is centered as much as possible, and to have 10mm of over travel.

Resources

ADT Contacts:

  • Bob McCort (semi-retired): rmccort@adt-co.com
  • Bob Smith, process specialist: rhsmith@adt-co.com
SOPs & Troubleshooting