Difference between revisions of "Lesker PVD75 E-beam Evaporator"

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(Created page with "Category:Deposition {{EquipmentInfo | name = Lesker PVD75 E-Beam/Thermal Evaporator | Tool_Name = Lesker PVD75 E-Beam/Thermal Evaporator | image = Image:PVD-04.jpeg|300...")
 
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| image = [[Image:PVD-04.jpeg|300px]]
 
| image = [[Image:PVD-04.jpeg|300px]]
 
| imagecaption =  
 
| imagecaption =  
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| Instrument_Type = Deposition
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| Instrument_Type = Physical vapor deposition
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| Staff_Manager = David Barth
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| Staff_Manager = [[David Barth | David Barth]]
 
| Lab_Location = Bay 2
 
| Lab_Location = Bay 2
 
| Tool_Manufacturer = Kurt J. Lesker
 
| Tool_Manufacturer = Kurt J. Lesker
 
| Tool_Model = PVD75
 
| Tool_Model = PVD75
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| Iris_Designation = PVD-04
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| NEMO_Designation = PVD-04
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| Lab_Phone = XXXXX
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| Lab_Phone = 215-898-9748
 
| SOP Link = [https://www.seas.upenn.edu/~nanosop/PVD75_e-beam_SOP.htm SOP]
 
| SOP Link = [https://www.seas.upenn.edu/~nanosop/PVD75_e-beam_SOP.htm SOP]
 
}}
 
}}
  
 
== Description ==
 
== Description ==
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The Kurt J. Lesker PVD 75 thin film deposition system is equipped for electron-beam (4 pockets) and thermal evaporation (2 sources). The evaporator is used to deposit metals and semiconductor materials. E-beam is the preferred evaporation technique for the high melting point materials. Evaporation provides directionality in depositions, which is beneficial when doing liftoff metallization (as opposed to conformal coating with sputtering deposition). Crystal oscillators are used to monitor deposition rates and thickness.
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===== The tool =====
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The Kurt J. Lesker PVD75 E-beam Evaporator is an electron-beam (e-beam) evaporation tool. The tool is a fully automated system for depositing Ti, Cr, Au, and/or Pd. The tool also comes with a load-lock, allowing for fast and easy transfer of samples in and out of the system. While less flexible than the [[Lesker PVD75 E-Beam/Thermal Evaporator | PVD-02]] deposition system in terms of available materials, the PVD-04 is a much faster tool.
  
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The system can accommodate pieces through wafers up to 150 mm in diameter and is configured with platen rotation and a cooling stage.
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===== Available materials =====
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The tool contains the following materials:
  
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* Au - Gold
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* Cr - Chromium
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* Pd - Palladium
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* Ti - Titanium
  
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===== Films =====
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Deposition is limited to thin-film thicknesses of ~100 nm.
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* ADD MATERIALS HERE
 
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== Resources ==
 
== Resources ==
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[https://www.youtube.com/watch?v=OxkmP7Lr9Lo PVD-4 Training Video]
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===== Training video =====
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Link: [https://www.youtube.com/watch?v=OxkmP7Lr9Lo PVD-4 Training Video]
  
 
===== SOPs & Troubleshooting =====
 
===== SOPs & Troubleshooting =====
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* [https://www.seas.upenn.edu/~nanosop/PVD75_e-beam_SOP.htm QNF SOP]
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Link: [https://repository.upenn.edu/scn_sop/23/ SOP]

Latest revision as of 12:48, 4 April 2024


Lesker PVD75 E-Beam/Thermal Evaporator
PVD-04.jpeg
Tool Name Lesker PVD75 E-Beam/Thermal Evaporator
Instrument Type Physical vapor deposition
Staff Manager David Barth
Lab Location Bay 2
Tool Manufacturer Kurt J. Lesker
Tool Model PVD75
NEMO Designation PVD-04
Lab Phone 215-898-9748
SOP Link SOP

Description

The tool

The Kurt J. Lesker PVD75 E-beam Evaporator is an electron-beam (e-beam) evaporation tool. The tool is a fully automated system for depositing Ti, Cr, Au, and/or Pd. The tool also comes with a load-lock, allowing for fast and easy transfer of samples in and out of the system. While less flexible than the PVD-02 deposition system in terms of available materials, the PVD-04 is a much faster tool.

Available materials

The tool contains the following materials:

  • Au - Gold
  • Cr - Chromium
  • Pd - Palladium
  • Ti - Titanium

Deposition is limited to thin-film thicknesses of ~100 nm.

Resources

Training video

Link: PVD-4 Training Video

SOPs & Troubleshooting

Link: SOP

Retrieved from "https://wiki.nano.upenn.edu/wiki/index.php?title=Lesker_PVD75_E-beam_Evaporator&oldid=1497"