Difference between revisions of "Lesker Nano-36 Thermal Evaporator"
Jump to navigation
Jump to search
| Line 29: | Line 29: | ||
===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://www.seas.upenn.edu/~nanosop/Nano36_SOP SOP] | * [https://www.seas.upenn.edu/~nanosop/Nano36_SOP SOP] | ||
| + | |||
| + | ===== Materials vapor-pressure ===== | ||
| + | * [https://www.powerstream.com/vapor-pressure.htm PowerStream website] | ||
Revision as of 14:00, 23 December 2022
 |
|
| Tool Name | Lesker Nano-36 Thermal Evaporator |
|---|---|
| Instrument Type | Deposition |
| Staff Manager | Jason (jarohr@seas.upenn.edu) |
| Lab Location | Bay 2 |
| Tool Manufacturer | Kurt J. Lesker |
| Tool Model | Nano-36 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | 215-898-9748 |
| SOP Link | SOP |
Description
The Kurt J. Lesker Nano36 will evaporate a metal film under high vacuum while measuring the thickness in-situ by a thickness monitor. Up to three different materials can be loaded in one batch, and the evaporation sources are sufficiently isolated from each other by shields to prevent cross contamination. The wafer platen can accommodate sizes up to 150 mm.
Deposition Sources
The tool is primarily used for deposition of indium and other materials whose vapor pressure or other properties make them unsuitable for other chambers (such as tin). Most materials are allowed in this tool. Please discuss with staff before beginning any new process in the tool.