Difference between revisions of "Developers at QNF"
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{| class="wikitable sortable" | {| class="wikitable sortable" | ||
| − | ! Name !! Manufacturer !! Chemical Composition !! Hazards !! | + | ! Name !! Manufacturer !! Chemical Composition !! Hazards !! Use !! Alternatives |
|- | |- | ||
| TMAH 0.26N || KemLab || 0.26N TMAH (Metal Ion Free) || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresists, Liftoff Resists || CD-26, AZ300MIF | | TMAH 0.26N || KemLab || 0.26N TMAH (Metal Ion Free) || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresists, Liftoff Resists || CD-26, AZ300MIF | ||
|- | |- | ||
| − | | CD-26 || Microposit/Dupont || 0.26N TMAH (Metal Ion Free) || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresists, Liftoff Resists || TMAH 0.26N, AZ300MIF | + | | CD-26 || Microposit/Dupont || 0.26N TMAH (Metal Ion Free) || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresists, Liftoff Resists || TMAH 0.26N (preferred), AZ300MIF |
|- | |- | ||
| − | | AZ300 MIF || AZ Materials/Merck || 0.26N TMAH (Metal Ion Free) || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresists, Liftoff Resists || TMAH 0.26N, CD-26 | + | | AZ300 MIF || AZ Materials/Merck || 0.26N TMAH (Metal Ion Free) || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || Photoresists, Liftoff Resists || TMAH 0.26N (preferred), CD-26 |
|- | |- | ||
| CD-26A || Microposit/Dupont || 0.26N TMAH (Metal Ion Free) w/ Surfactant || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || || AZ917MIF, TMAH 0.26N, CD-26, AZ300MIF | | CD-26A || Microposit/Dupont || 0.26N TMAH (Metal Ion Free) w/ Surfactant || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || || AZ917MIF, TMAH 0.26N, CD-26, AZ300MIF | ||
| Line 18: | Line 18: | ||
|AZ422 MIF || AZ Materials/Merck || 0.21N TMAH (Metal Ion Free) w/ Surfactant || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || || MF321, TMAH 0.26N | |AZ422 MIF || AZ Materials/Merck || 0.21N TMAH (Metal Ion Free) w/ Surfactant || Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) || || MF321, TMAH 0.26N | ||
|- | |- | ||
| − | | AZ400K | + | | AZ400K|| AZ Materials/Merck || Potassium Borates (Metal Ion Bearing) || Strong Base -- Irritant, Corrosive || Thick Photoresists (AZP4620), Mask Plates (AZ1500) -- Manually dilute 1:3 or 1:4 with DI water || |
|- | |- | ||
| SU-8 Developer || MicroChem/Kayaku || PGMEA (1-methoxy-2-propanol acetate) || Organic Solvent -- Flammable || SU-8, HARE SQ, IP-Dip || SQ Developer | | SU-8 Developer || MicroChem/Kayaku || PGMEA (1-methoxy-2-propanol acetate) || Organic Solvent -- Flammable || SU-8, HARE SQ, IP-Dip || SQ Developer | ||
| Line 24: | Line 24: | ||
| SQ Developer || KemLab || PGMEA (1-methoxy-2-propanol acetate) || Organic Solvent -- Flammable || HARE SQ, SU-8, IP-Dip || SU-8 Developer | | SQ Developer || KemLab || PGMEA (1-methoxy-2-propanol acetate) || Organic Solvent -- Flammable || HARE SQ, SU-8, IP-Dip || SU-8 Developer | ||
|- | |- | ||
| − | |O-Xylene || || O-Xylene || Organic Solvent -- Flammable, Irritant || ZEP520 || Amyl Acetate | + | |O-Xylene || N/A || O-Xylene || Organic Solvent -- Flammable, Irritant || ZEP520 || Amyl Acetate (preferred) |
|} | |} | ||
Latest revision as of 13:08, 24 October 2023
The following are developers you may encounter in the QNF wet benches.
| Name | Manufacturer | Chemical Composition | Hazards | Use | Alternatives |
|---|---|---|---|---|---|
| TMAH 0.26N | KemLab | 0.26N TMAH (Metal Ion Free) | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | Photoresists, Liftoff Resists | CD-26, AZ300MIF |
| CD-26 | Microposit/Dupont | 0.26N TMAH (Metal Ion Free) | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | Photoresists, Liftoff Resists | TMAH 0.26N (preferred), AZ300MIF |
| AZ300 MIF | AZ Materials/Merck | 0.26N TMAH (Metal Ion Free) | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | Photoresists, Liftoff Resists | TMAH 0.26N (preferred), CD-26 |
| CD-26A | Microposit/Dupont | 0.26N TMAH (Metal Ion Free) w/ Surfactant | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | AZ917MIF, TMAH 0.26N, CD-26, AZ300MIF | |
| AZ917 MIF | AZ Materials/Merck | 0.26N TMAH (Metal Ion Free) w/ Surfactant | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | CD-26A, TMAH 0.26N, CD-26, AZ300MIF | |
| MF321 | Microposit/Dupont | 0.21N TMAH (Metal Ion Free) w/ Surfactant | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | AZ422 MIF, TMAH 0.26N | |
| AZ422 MIF | AZ Materials/Merck | 0.21N TMAH (Metal Ion Free) w/ Surfactant | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | MF321, TMAH 0.26N | |
| AZ400K | AZ Materials/Merck | Potassium Borates (Metal Ion Bearing) | Strong Base -- Irritant, Corrosive | Thick Photoresists (AZP4620), Mask Plates (AZ1500) -- Manually dilute 1:3 or 1:4 with DI water | |
| SU-8 Developer | MicroChem/Kayaku | PGMEA (1-methoxy-2-propanol acetate) | Organic Solvent -- Flammable | SU-8, HARE SQ, IP-Dip | SQ Developer |
| SQ Developer | KemLab | PGMEA (1-methoxy-2-propanol acetate) | Organic Solvent -- Flammable | HARE SQ, SU-8, IP-Dip | SU-8 Developer |
| O-Xylene | N/A | O-Xylene | Organic Solvent -- Flammable, Irritant | ZEP520 | Amyl Acetate (preferred) |