Difference between revisions of "Anatech SCE-106 Barrel Asher"
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m (Changed protection level for "Anatech SCE-106 Barrel Asher" ([Edit=Allow only autoconfirmed users] (indefinite) [Move=Allow only autoconfirmed users] (indefinite))) |
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| imagecaption = | | imagecaption = | ||
| Instrument_Type = Soft Lithography | | Instrument_Type = Soft Lithography | ||
| − | | Staff_Manager = Sam Azadi | + | | Staff_Manager = [[Sam Azadi | Sam Azadi]] |
| Lab_Location = Bay 2 | | Lab_Location = Bay 2 | ||
| Tool_Manufacturer = Anatech | | Tool_Manufacturer = Anatech | ||
| Tool_Model = SCE-106 | | Tool_Model = SCE-106 | ||
| − | | | + | | NEMO_Designation = DE-07 |
| Lab_Phone = XXXXX | | Lab_Phone = XXXXX | ||
| SOP Link = [https://www.seas.upenn.edu/~nanosop/Anatech106_SOP.htm SOP] | | SOP Link = [https://www.seas.upenn.edu/~nanosop/Anatech106_SOP.htm SOP] | ||
Revision as of 14:13, 3 January 2024
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| Tool Name | Anatech SCE-106 Barrel Asher |
|---|---|
| Instrument Type | Soft Lithography |
| Staff Manager | Sam Azadi |
| Lab Location | Bay 2 |
| Tool Manufacturer | Anatech |
| Tool Model | SCE-106 |
| NEMO Designation | DE-07 |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
Anatech USA’s SCE-100 Series Inductively Coupled (ICP) Plasma systems are extremely effective for a Plasma Ashing process to remove organics prior to thin film deposition and/or chemical analysis of remaining inorganics.
Process gases are CF4, O2, Ar and N2. Sample sizes are pieces to 150 mm round wafers.
Applications
- Removal of photoresist
- Removal of organic materials