Difference between revisions of "Anatech SCE-106 Barrel Asher"
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m (Changed protection level for "Anatech SCE-106 Barrel Asher" ([Edit=Allow only autoconfirmed users] (indefinite) [Move=Allow only autoconfirmed users] (indefinite))) |
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| Line 7: | Line 7: | ||
| imagecaption = | | imagecaption = | ||
| Instrument_Type = Soft Lithography | | Instrument_Type = Soft Lithography | ||
| − | | Staff_Manager = | + | | Staff_Manager = [[Ana Cohen | Ana Cohen]] |
| − | | Lab_Location = Bay | + | | Lab_Location = Bay 6 |
| Tool_Manufacturer = Anatech | | Tool_Manufacturer = Anatech | ||
| Tool_Model = SCE-106 | | Tool_Model = SCE-106 | ||
| − | | | + | | NEMO_Designation = DE-07 |
| Lab_Phone = XXXXX | | Lab_Phone = XXXXX | ||
| SOP Link = [https://www.seas.upenn.edu/~nanosop/Anatech106_SOP.htm SOP] | | SOP Link = [https://www.seas.upenn.edu/~nanosop/Anatech106_SOP.htm SOP] | ||
| Line 17: | Line 17: | ||
== Description == | == Description == | ||
| − | Anatech USA’s SCE-100 Series Inductively Coupled (ICP) Plasma systems are extremely effective for a Plasma Ashing process to remove organics prior to | + | Anatech USA’s SCE-100 Series Inductively Coupled (ICP) Plasma systems are extremely effective for a Plasma Ashing process to remove organics and improve adhesion prior to negative resist processing, as well as priming PDMS and glass substrates for adhesion. |
| − | Process | + | Process gas is O2. Sample sizes are pieces to 100 mm round wafers. |
===== Applications ===== | ===== Applications ===== | ||
| − | |||
* Removal of organic materials | * Removal of organic materials | ||
| + | * Activation of PDMS and glass surfaces | ||
Latest revision as of 16:26, 12 March 2024
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| Tool Name | Anatech SCE-106 Barrel Asher |
|---|---|
| Instrument Type | Soft Lithography |
| Staff Manager | Ana Cohen |
| Lab Location | Bay 6 |
| Tool Manufacturer | Anatech |
| Tool Model | SCE-106 |
| NEMO Designation | DE-07 |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
Anatech USA’s SCE-100 Series Inductively Coupled (ICP) Plasma systems are extremely effective for a Plasma Ashing process to remove organics and improve adhesion prior to negative resist processing, as well as priming PDMS and glass substrates for adhesion.
Process gas is O2. Sample sizes are pieces to 100 mm round wafers.
Applications
- Removal of organic materials
- Activation of PDMS and glass surfaces