SUSS MicroTec MA6 Gen3 Mask Aligner
Revision as of 14:50, 29 March 2022 by Trevinoj (talk | contribs) (Created page with "Category:Lithography {{EquipmentInfo | name = SUSS MicroTec MA6 Gen3 Mask Aligner | Tool_Name = SUSS MicroTec MA6 Gen3 Mask Aligner | image = 300px |...")
 |
|
| Tool Name | SUSS MicroTec MA6 Gen3 Mask Aligner |
|---|---|
| Instrument Type | Lithography |
| Staff Manager | David Jones |
| Lab Location | Bay 2 |
| Tool Manufacturer | SUSS MicroTec |
| Tool Model | MA6 Gen3 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
This system is a dual-use mask aligner and wafer-bond aligner. Mask alignment is used for contact and proximity exposure processes. Exposures can be performed with gaps programmable from 10 um to 300 um in 1 um increments. Automatic wedge error compensation (WEC) is used to ensure that the mask and wafer are parallel. The lamp is a 1000 W Hg-Arc lamp. Integrated light level sensing ensures proper exposure doses as the lamp degrades.
Applications
- Photomask exposure of resist-coated samples