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- 08:09, 18 June 2024 diff hist 0 PECVD SiO2 via CF4 →Etch
- 08:09, 18 June 2024 diff hist +3 PECVD SiO2 via CF4 →Etch
- 08:09, 18 June 2024 diff hist +1 PECVD SiO2 via CF4 →Etch
- 08:08, 18 June 2024 diff hist 0 PECVD SiO2 via CF4 →Etch
- 08:08, 18 June 2024 diff hist -30 PECVD SiO2 via CF4
- 08:07, 18 June 2024 diff hist +59 PECVD SiO2 via CF4
- 08:05, 18 June 2024 diff hist +1,408 N PECVD SiO2 via CF4 Created page with "== Goal == The purpose of this document is to examine the etch properties of the Oxford 80 Plus RIE system and to find the etch rate of SiO2 and S1818 MicroChem positive resi..."
- 15:01, 17 June 2024 diff hist -2 Oxford 80 Plus RIE →Standard Process Information
- 15:01, 17 June 2024 diff hist +3 Oxford 80 Plus RIE →Standard Process Information
- 15:00, 17 June 2024 diff hist -26 Oxford 80 Plus RIE →Standard Process Information
- 14:54, 17 June 2024 diff hist +2 Oxford 80 Plus RIE →Etch Rate
- 14:54, 17 June 2024 diff hist -8 Oxford 80 Plus RIE →Etch Rate
- 14:53, 17 June 2024 diff hist -35 Oxford 80 Plus RIE →Standard Process Information
- 14:53, 17 June 2024 diff hist +159 Oxford 80 Plus RIE →Standard Process Information
- 14:36, 17 June 2024 diff hist +631 Oxford 80 Plus RIE
- 14:35, 17 June 2024 diff hist -94 Oxford 80 Plus RIE →Protocols and Reports
- 14:34, 17 June 2024 diff hist +3 Oxford 80 Plus RIE
- 14:34, 17 June 2024 diff hist 0 Oxford 80 Plus RIE
- 12:28, 11 June 2024 diff hist +4 SPTS Si DRIE →Etch masks allowed (and selectivity values) current
- 12:26, 11 June 2024 diff hist +25 SPTS Si DRIE →Etch masks allowed
- 12:26, 11 June 2024 diff hist +194 SPTS Si DRIE →Etch masks allowed
- 10:03, 22 May 2024 diff hist -54 SPTS/Xactix XeF2 Isotropic Etcher current
- 10:03, 22 May 2024 diff hist +48 SPTS/Xactix XeF2 Isotropic Etcher
- 10:00, 22 May 2024 diff hist 0 N File:DE06 SOP v03.pdf current
- 13:16, 15 May 2024 diff hist -66 Oxford PlasmaLab 100 PECVD
- 13:15, 15 May 2024 diff hist +66 Oxford PlasmaLab 100 PECVD
- 09:36, 9 April 2024 diff hist +34 SPTS Si DRIE →Post etch sample cleaning procedure
- 12:12, 4 April 2024 diff hist 0 Equipment →Etching
- 08:01, 26 March 2024 diff hist -13 How plasma etch works →Basics of Plasma Etching current
- 08:00, 26 March 2024 diff hist +1 How plasma etch works →How Bosch Process (a.k.a DRIE) works
- 07:57, 26 March 2024 diff hist -28 How plasma etch works
- 15:56, 25 March 2024 diff hist +2 How plasma etch works
- 15:56, 25 March 2024 diff hist -2 How plasma etch works
- 15:56, 25 March 2024 diff hist +8 How plasma etch works
- 15:55, 25 March 2024 diff hist +207 How plasma etch works
- 15:53, 25 March 2024 diff hist +8 How plasma etch works
- 15:53, 25 March 2024 diff hist -2 How plasma etch works
- 15:52, 25 March 2024 diff hist +134 How plasma etch works
- 15:46, 25 March 2024 diff hist +15 How plasma etch works →How Bosch Process (a.k.a DRIE) works
- 15:25, 25 March 2024 diff hist +2 Quattrone Nanofabrication Facility
- 15:24, 25 March 2024 diff hist +11 Quattrone Nanofabrication Facility
- 15:08, 25 March 2024 diff hist -46 Equipment
- 15:07, 25 March 2024 diff hist -2 How plasma etch works
- 15:07, 25 March 2024 diff hist +32 How plasma etch works
- 15:05, 25 March 2024 diff hist -299 How plasma etch works →How Bosch Process (a.k.a DRIE) works
- 15:05, 25 March 2024 diff hist +8 How plasma etch works
- 15:03, 25 March 2024 diff hist -13 How plasma etch works →How Bosch Process (a.k.a DRIE) works
- 15:02, 25 March 2024 diff hist +2,702 How plasma etch works
- 14:56, 25 March 2024 diff hist +16 How plasma etch works
- 14:55, 25 March 2024 diff hist +2,370 How plasma etch works →The difference between RIE and ICP-RIE