Denton Explorer14 Magnetron Sputterer

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Denton Explorer14 Magnetron Sputterer
PVD-05.jpeg
Tool Name Denton Explorer14 Magnetron Sputterer
Instrument Type Deposition
Staff Manager Jason (jarohr@seas.upenn.edu)
Lab Location Bay 2
Tool Manufacturer Denton
Tool Model Explorer14
NEMO Designation {{{NEMO_Designation}}}
Lab Phone 215-898-9748
SOP Link SOP

Description

Tool overview

The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films (such as oxides). Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. The tool is an open load system in sputter-down configuration with one dedicated DC source and two sources that can use either a DC or RF power supply. Co-deposition from two DC sources or one DC and one RF source is possible, but it is recommended to run co-deposition on PVD-03 as the sources in this tool are not in confocal mode per default. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.

Maximum power

  • Maximum DC Power: 600 W.
  • Maximum RF Power: 200 W.

You can inflict serious damage to the power supplies if these values are exceeded.

Main differences between PVD-05 (this tool) and PVD-03

There are several differences between our two sputtering tools. Think carefully about what your needs are before deciding what tool to get trained on. If you're ever in doubt, consult with staff.

PVD-05
  • Large substrate platen that can hold several 4" wafers
  • Water-cooled platen
  • Three sputter sources (sputter down)
  • This tool cannot sputter magnetic materials
  • Open-load tool; requires at least one hour of pump-down
  • Co-deposition can be done, but is not recommended (sources not in confocal mode per default)
PVD-03
  • Small substrate platen that can hold one wafer up to 6"
  • Four sputter sources (sputter up)
  • This tool can sputter magnetic materials in source 2 and 4
  • Load-lock tool; it takes approximately 7 min to load your sample
  • This is out recommended tool for co-deposition as the sources are always confocal mode

Available materials & process data

All process data were recorded at a base pressure lower than 5 x 10-6 Torr; you can never exceed 200 W on RF and 600 W on DC.

Material Name Max power Process data Recorded
Pressure Power Rate
Ag (silver) 450 W 3 mTorr 140 W 7.3 Å s-1
Al (aluminum) 450 W 3 mTorr 200 W 3.0 Å s-1
Au (gold) 140 W 3 mTorr 140 W 4.6 Å s-1
Cr (chromium) 450 W - - -
Cu (copper) 450 W 3 mTorr 400 W 3.4 Å s-1
Fe (iron) 350 W - - -
Ge (germanium) 140 W - - -
ITO (Indium tin oxide) 140 W - - -
Mn (manganese) 140 W - - -
Mo (molybdenum) 450 W 3 mTorr 140 1.9 Å s-1
Ni (nickel) 350 W - - -
Pd (palladium) 140 W - - -
Pt (platinum) 140 W 3 mTorr 140 W 2.6 Å s-1
i-Si (intrinsic silicon) 140 W - - -
n-Si (n-type silicon) 280 W - - -
p-Si (p-type silicon) 280 W - - -
Ti (titanium) 350 W 3 mTorr 350 W 2.0 Å s-1
TiO2 (titanium dioxide) 140 W - - -
W (tungsten) 450 W - - -
YSZ (yttria-stabilized zirconia) 140 W - - -

Resources

SOPs & Troubleshooting
Target request form

Master recipes

The listed master recipes are what we used to obtain the process data listed above. We highly recommend our users to use these recipes. However, since they are free to edit, please always double check that the recipe is correct by consulting the charts below.

Note that some recipes have both ramp-up and ramp-down steps. The deposition step can always be found by locating when the shutter is open. The post-deposition cool-down time will vary for different materials depending on their propensity for oxidation. For example, Ag has a long cool-down time of 15 minutes.

Titanium (Ti)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Aluminum (Al)

Step T004 is the deposition step and step T005 is the cool-down step.

Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) 5 120 60 60 [time] 300 5
Min Vacuum Setpoint (Torr)
Gas - (PID or Fixed) PID PID PID PID
Gas - PID Master Gas Select 1 1 1 1
Gas1 - Setpoint (sccm) 10 10 10 10
Gas2 - Setpoint (sccm)
Gas PID Pressure (mTorr) 10 5 3 3
RF Source - Sputter (Watts)
RF Source - Cathode Select
RF Source - Shutter
DC 1 Source - Sputter (Watts)
DC 1 Source - Cathode Select
DC 1 Source - Shutter
DC 2 Source - Sputter (Watts) 100 150 300 450
DC 2 Source - Shutter Open
Pressure Control (Throttle) Yes Yes Yes Yes
Ignition Pressure (mTorr)
Rotation Speed (0-100%) 50 50 50 50 50
End Process (Yes) Yes
Copper (Cu)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Silver (Ag)

Note the extra long cool-down time. Reducing this time can affect the target.

Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Gold (Au)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Platinum (Pt)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Tungsten (W)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Molybdenum (Mo)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
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