Oxford PlasmaLab 100 PECVD

Oxford PlasmaLab 100 PECVD

Tool Name	Oxford PlasmaLab 100 PECVD
Instrument Type	Deposition
Staff Manager	Sam Azadi
Lab Location	Bay 1
Tool Manufacturer	Oxford
Tool Model	PlasmaLab 100
NEMO Designation	{{{NEMO_Designation}}}
Lab Phone	215-898-9736
SOP Link	QNF SOP

Description

The QNF Oxford Instruments PlasmaLab System 100 Plasma Enhanced Chemical Vapor Deposition (PECVD) tool is used to deposit a variety of thin-film materials at relatively modest temperatures on a variety of substrate materials. The tool utilizes an RF generator to deposit thin films at temperatures lower than traditional chemical vapor deposition systems.

Applications

• Silicon dioxide deposition
• Silicon nitride deposition
• Amorphous silicon deposition

Allowed material in PECVD System

• Si, Si_xN_y, SiO₂, SOI
• Hard masks compatible with process temperature

Resources

SOPs & Troubleshooting

• QNF SOP

Protocols and reports

• SiN_x deposition process parameters
• SiO₂ deposition process parameters
• Optimization of a-Si deposition on Oxford PlasmaLab 100 PECVD using Taguchi L9 based DOE