Difference between revisions of "Denton Explorer14 Magnetron Sputterer"
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|- | |- | ||
|- | |- | ||
| − | | Step Time (sec) || | + | | Step Time (sec) || 5 || 60 || 60 || 60 || [dep] || 60 || 5 |
|-style="background-color:#FFFFFF" | |-style="background-color:#FFFFFF" | ||
| − | | Min Vacuum Setpoint (Torr) || | + | | Min Vacuum Setpoint (Torr) || || || || || || || |
|- | |- | ||
| || || || || || || || | | || || || || || || || | ||
|-style="background-color:#DBFEFF" | |-style="background-color:#DBFEFF" | ||
| − | | Gas - (PID or Fixed) || | + | | Gas - (PID or Fixed) || || PID || PID || PID || PID || || |
|-style="background-color:#FFFFFF" | |-style="background-color:#FFFFFF" | ||
| − | | Gas - PID Master Gas Select || | + | | Gas - PID Master Gas Select || || 1 || 1 || 1 || 1 || || |
|- | |- | ||
| − | | Gas1 - Setpoint (sccm) || | + | | Gas1 - Setpoint (sccm) || || 10 || 10 || 10 || 10 || || |
|-style="background-color:#FFFFFF" | |-style="background-color:#FFFFFF" | ||
| − | | Gas2 - Setpoint (sccm) || | + | | Gas2 - Setpoint (sccm) || || || || || || || |
|- | |- | ||
| || || || || || || || | | || || || || || || || | ||
|-style="background-color:#DEB4DC" | |-style="background-color:#DEB4DC" | ||
| − | |Gas PID Pressure (mTorr) || | + | |Gas PID Pressure (mTorr) || || 10 || 5 || 3 || 3 || || |
|-style="background-color:#DCF5E9" | |-style="background-color:#DCF5E9" | ||
| − | | RF Source - Sputter (Watts) || | + | | RF Source - Sputter (Watts) || || || || || || || |
|-style="background-color:#DCF5E9" | |-style="background-color:#DCF5E9" | ||
| − | | RF Source - Cathode Select || | + | | RF Source - Cathode Select || || || || || || || |
|-style="background-color:#DCF5E9" | |-style="background-color:#DCF5E9" | ||
| − | | RF Source - Shutter || | + | | RF Source - Shutter || || || || || || || |
|-style="background-color:#ECFA6F" | |-style="background-color:#ECFA6F" | ||
| − | | DC 1 Source - Sputter (Watts) || | + | | DC 1 Source - Sputter (Watts) || || 100 || 200 || 300 || 350 || || |
|-style="background-color:#ECFA6F" | |-style="background-color:#ECFA6F" | ||
| − | | DC 1 Source - Cathode Select || | + | | DC 1 Source - Cathode Select || || 2 || 2 || 2 || 2 || || |
|-style="background-color:#ECFA6F" | |-style="background-color:#ECFA6F" | ||
| − | | DC 1 Source - Shutter || | + | | DC 1 Source - Shutter || || || || || Open || || |
|-style="background-color:#FAD86F" | |-style="background-color:#FAD86F" | ||
| − | | DC 2 Source - Sputter (Watts) || | + | | DC 2 Source - Sputter (Watts) || || || || || || || |
|-style="background-color:#FAD86F" | |-style="background-color:#FAD86F" | ||
| || || || || || || || | | || || || || || || || | ||
|-style="background-color:#FAD86F" | |-style="background-color:#FAD86F" | ||
| − | | DC 2 Source - Shutter || | + | | DC 2 Source - Shutter || || || || || || || |
|-style="background-color:#6FD2FA" | |-style="background-color:#6FD2FA" | ||
| − | | Pressure Control (Throttle) || | + | | Pressure Control (Throttle) || Yes || Yes || Yes || Yes || Yes || || |
|-style="background-color:#FFFFFF" | |-style="background-color:#FFFFFF" | ||
| − | | Ignition Pressure (mTorr) || | + | | Ignition Pressure (mTorr) || || || || || || || |
|- | |- | ||
| || || || || || || || | | || || || || || || || | ||
|-style="background-color:#E8F213" | |-style="background-color:#E8F213" | ||
| − | | Rotation Speed (0-100%) || | + | | Rotation Speed (0-100%) || 50 || 50 || 50 || 50 || 50 || || |
|- | |- | ||
| − | | End Process (Yes) || | + | | End Process (Yes) || || || || || || || Yes |
|} | |} | ||
Revision as of 11:33, 25 January 2023
 |
|
| Tool Name | Denton Explorer14 Magnetron Sputterer |
|---|---|
| Instrument Type | Deposition |
| Staff Manager | Jason (jarohr@seas.upenn.edu) |
| Lab Location | Bay 2 |
| Tool Manufacturer | Denton |
| Tool Model | Explorer14 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | 215-898-9748 |
| SOP Link | SOP |
Description
Tool overview
The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films (such as oxides). Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. The tool is an open load system in sputter-down configuration with one dedicated DC source and two sources that can use either a DC or RF power supply. Co-deposition from two DC sources or one DC and one RF source is possible, but it is recommended to run co-deposition on PVD-03 as the sources in this tool are not in confocal mode per default. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.
Maximum power
- Maximum DC Power: 600 W.
- Maximum RF Power: 200 W.
You can inflict serious damage to the power supplies if these values are exceeded.
Main differences between PVD-05 (this tool) and PVD-03
There are several differences between our two sputtering tools. Think carefully about what your needs are before deciding what tool to get trained on. If you're ever in doubt, consult with staff.
PVD-05
- Large substrate platen that can hold several 4" wafers
- Water-cooled platen
- Three sputter sources (sputter down)
- This tool cannot sputter magnetic materials
- Open-load tool; requires at least one hour of pump-down
- Co-deposition can be done, but is not recommended (sources not in confocal mode per default)
PVD-03
- Small substrate platen that can hold one wafer up to 6"
- Four sputter sources (sputter up)
- This tool can sputter magnetic materials in source 2 and 4
- Load-lock tool; it takes approximately 7 min to load your sample
- This is out recommended tool for co-deposition as the sources are always confocal mode
Available materials & process data
All process data were recorded at a base pressure lower than 5 x 10-6 Torr; you can never exceed 200 W on RF and 600 W on DC.
| Material Name | Max power | Process data | Recorded | ||
|---|---|---|---|---|---|
| Pressure | Power | Rate | |||
| Ag (silver) | 450 W | 3 mTorr | 140 W | 7.3 Å s-1 | |
| Al (aluminum) | 450 W | 3 mTorr | 200 W | 3.0 Å s-1 | |
| Au (gold) | 140 W | 3 mTorr | 140 W | 4.6 Å s-1 | |
| Cr (chromium) | 450 W | - | - | - | |
| Cu (copper) | 450 W | 3 mTorr | 400 W | 3.4 Å s-1 | |
| Fe (iron) | 350 W | - | - | - | |
| Ge (germanium) | 140 W | - | - | - | |
| ITO (Indium tin oxide) | 140 W | - | - | - | |
| Mn (manganese) | 140 W | - | - | - | |
| Mo (molybdenum) | 450 W | 3 mTorr | 140 | 1.9 Å s-1 | |
| Ni (nickel) | 350 W | - | - | - | |
| Pd (palladium) | 140 W | - | - | - | |
| Pt (platinum) | 140 W | 3 mTorr | 140 W | 2.6 Å s-1 | |
| i-Si (intrinsic silicon) | 140 W | - | - | - | |
| n-Si (n-type silicon) | 280 W | - | - | - | |
| p-Si (p-type silicon) | 280 W | - | - | - | |
| Ti (titanium) | 350 W | 3 mTorr | 350 W | 2.0 Å s-1 | |
| TiO2 (titanium dioxide) | 140 W | - | - | - | |
| W (tungsten) | 450 W | - | - | - | |
| YSZ (yttria-stabilized zirconia) | 140 W | - | - | - | |
Resources
SOPs & Troubleshooting
Target request form
Master recipes
The listed master recipes are what we used to obtain the process data listed above. We highly recommend our users to use these recipes. However, since they are free to edit, please always double check that the recipe is correct by consulting the charts below.
Note that some recipes have both ramp-up and ramp-down steps. The deposition step can always be found by locating when the shutter is open. The post-deposition cool-down time will vary for different materials depending on their propensity for oxidation. For example, Ag has a long cool-down time of 15 minutes.
Titanium (Ti)
| Step Number | T000 | T001 | T002 | T003 | T004 | T005 | T006 |
|---|---|---|---|---|---|---|---|
| Step Time (sec) | 5 | 60 | 60 | 60 | [dep] | 60 | 5 |
| Min Vacuum Setpoint (Torr) | |||||||
| Gas - (PID or Fixed) | PID | PID | PID | PID | |||
| Gas - PID Master Gas Select | 1 | 1 | 1 | 1 | |||
| Gas1 - Setpoint (sccm) | 10 | 10 | 10 | 10 | |||
| Gas2 - Setpoint (sccm) | |||||||
| Gas PID Pressure (mTorr) | 10 | 5 | 3 | 3 | |||
| RF Source - Sputter (Watts) | |||||||
| RF Source - Cathode Select | |||||||
| RF Source - Shutter | |||||||
| DC 1 Source - Sputter (Watts) | 100 | 200 | 300 | 350 | |||
| DC 1 Source - Cathode Select | 2 | 2 | 2 | 2 | |||
| DC 1 Source - Shutter | Open | ||||||
| DC 2 Source - Sputter (Watts) | |||||||
| DC 2 Source - Shutter | |||||||
| Pressure Control (Throttle) | Yes | Yes | Yes | Yes | Yes | ||
| Ignition Pressure (mTorr) | |||||||
| Rotation Speed (0-100%) | 50 | 50 | 50 | 50 | 50 | ||
| End Process (Yes) | Yes |
Aluminum (Al)
Step T004 is the deposition step and step T005 is the cool-down step.
| Step Number | T000 | T001 | T002 | T003 | T004 | T005 | T006 |
|---|---|---|---|---|---|---|---|
| Step Time (sec) | 5 | 120 | 60 | 60 | [time] | 300 | 5 |
| Min Vacuum Setpoint (Torr) | |||||||
| Gas - (PID or Fixed) | PID | PID | PID | PID | |||
| Gas - PID Master Gas Select | 1 | 1 | 1 | 1 | |||
| Gas1 - Setpoint (sccm) | 10 | 10 | 10 | 10 | |||
| Gas2 - Setpoint (sccm) | |||||||
| Gas PID Pressure (mTorr) | 10 | 5 | 3 | 3 | |||
| RF Source - Sputter (Watts) | |||||||
| RF Source - Cathode Select | |||||||
| RF Source - Shutter | |||||||
| DC 1 Source - Sputter (Watts) | |||||||
| DC 1 Source - Cathode Select | |||||||
| DC 1 Source - Shutter | |||||||
| DC 2 Source - Sputter (Watts) | 100 | 150 | 300 | 450 | |||
| DC 2 Source - Shutter | Open | ||||||
| Pressure Control (Throttle) | Yes | Yes | Yes | Yes | |||
| Ignition Pressure (mTorr) | |||||||
| Rotation Speed (0-100%) | 50 | 50 | 50 | 50 | 50 | ||
| End Process (Yes) | Yes |
Copper (Cu)
| Step Number | T000 | T001 | T002 | T003 | T004 | T005 | T006 |
|---|---|---|---|---|---|---|---|
| Step Time (sec) | - | - | - | - | - | - | - |
| Min Vacuum Setpoint (Torr) | - | - | - | - | - | - | - |
| Gas - (PID or Fixed) | - | - | - | - | - | - | - |
| Gas - PID Master Gas Select | - | - | - | - | - | - | - |
| Gas1 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas2 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas PID Pressure (mTorr) | - | - | - | - | - | - | - |
| RF Source - Sputter (Watts) | - | - | - | - | - | - | - |
| RF Source - Cathode Select | - | - | - | - | - | - | - |
| RF Source - Shutter | - | - | - | - | - | - | - |
| DC 1 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 1 Source - Cathode Select | - | - | - | - | - | - | - |
| DC 1 Source - Shutter | - | - | - | - | - | - | - |
| DC 2 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 2 Source - Shutter | - | - | - | - | - | - | - |
| Pressure Control (Throttle) | - | - | - | - | - | - | - |
| Ignition Pressure (mTorr) | - | - | - | - | - | - | - |
| Rotation Speed (0-100%) | - | - | - | - | - | - | - |
| End Process (Yes) | - | - | - | - | - | - | - |
Silver (Ag)
Note the extra long cool-down time. Reducing this time can affect the target.
| Step Number | T000 | T001 | T002 | T003 | T004 | T005 | T006 |
|---|---|---|---|---|---|---|---|
| Step Time (sec) | - | - | - | - | - | - | - |
| Min Vacuum Setpoint (Torr) | - | - | - | - | - | - | - |
| Gas - (PID or Fixed) | - | - | - | - | - | - | - |
| Gas - PID Master Gas Select | - | - | - | - | - | - | - |
| Gas1 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas2 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas PID Pressure (mTorr) | - | - | - | - | - | - | - |
| RF Source - Sputter (Watts) | - | - | - | - | - | - | - |
| RF Source - Cathode Select | - | - | - | - | - | - | - |
| RF Source - Shutter | - | - | - | - | - | - | - |
| DC 1 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 1 Source - Cathode Select | - | - | - | - | - | - | - |
| DC 1 Source - Shutter | - | - | - | - | - | - | - |
| DC 2 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 2 Source - Shutter | - | - | - | - | - | - | - |
| Pressure Control (Throttle) | - | - | - | - | - | - | - |
| Ignition Pressure (mTorr) | - | - | - | - | - | - | - |
| Rotation Speed (0-100%) | - | - | - | - | - | - | - |
| End Process (Yes) | - | - | - | - | - | - | - |
Gold (Au)
| Step Number | T000 | T001 | T002 | T003 | T004 | T005 | T006 |
|---|---|---|---|---|---|---|---|
| Step Time (sec) | - | - | - | - | - | - | - |
| Min Vacuum Setpoint (Torr) | - | - | - | - | - | - | - |
| Gas - (PID or Fixed) | - | - | - | - | - | - | - |
| Gas - PID Master Gas Select | - | - | - | - | - | - | - |
| Gas1 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas2 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas PID Pressure (mTorr) | - | - | - | - | - | - | - |
| RF Source - Sputter (Watts) | - | - | - | - | - | - | - |
| RF Source - Cathode Select | - | - | - | - | - | - | - |
| RF Source - Shutter | - | - | - | - | - | - | - |
| DC 1 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 1 Source - Cathode Select | - | - | - | - | - | - | - |
| DC 1 Source - Shutter | - | - | - | - | - | - | - |
| DC 2 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 2 Source - Shutter | - | - | - | - | - | - | - |
| Pressure Control (Throttle) | - | - | - | - | - | - | - |
| Ignition Pressure (mTorr) | - | - | - | - | - | - | - |
| Rotation Speed (0-100%) | - | - | - | - | - | - | - |
| End Process (Yes) | - | - | - | - | - | - | - |
Platinum (Pt)
| Step Number | T000 | T001 | T002 | T003 | T004 | T005 | T006 |
|---|---|---|---|---|---|---|---|
| Step Time (sec) | - | - | - | - | - | - | - |
| Min Vacuum Setpoint (Torr) | - | - | - | - | - | - | - |
| Gas - (PID or Fixed) | - | - | - | - | - | - | - |
| Gas - PID Master Gas Select | - | - | - | - | - | - | - |
| Gas1 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas2 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas PID Pressure (mTorr) | - | - | - | - | - | - | - |
| RF Source - Sputter (Watts) | - | - | - | - | - | - | - |
| RF Source - Cathode Select | - | - | - | - | - | - | - |
| RF Source - Shutter | - | - | - | - | - | - | - |
| DC 1 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 1 Source - Cathode Select | - | - | - | - | - | - | - |
| DC 1 Source - Shutter | - | - | - | - | - | - | - |
| DC 2 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 2 Source - Shutter | - | - | - | - | - | - | - |
| Pressure Control (Throttle) | - | - | - | - | - | - | - |
| Ignition Pressure (mTorr) | - | - | - | - | - | - | - |
| Rotation Speed (0-100%) | - | - | - | - | - | - | - |
| End Process (Yes) | - | - | - | - | - | - | - |
Tungsten (W)
| Step Number | T000 | T001 | T002 | T003 | T004 | T005 | T006 |
|---|---|---|---|---|---|---|---|
| Step Time (sec) | - | - | - | - | - | - | - |
| Min Vacuum Setpoint (Torr) | - | - | - | - | - | - | - |
| Gas - (PID or Fixed) | - | - | - | - | - | - | - |
| Gas - PID Master Gas Select | - | - | - | - | - | - | - |
| Gas1 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas2 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas PID Pressure (mTorr) | - | - | - | - | - | - | - |
| RF Source - Sputter (Watts) | - | - | - | - | - | - | - |
| RF Source - Cathode Select | - | - | - | - | - | - | - |
| RF Source - Shutter | - | - | - | - | - | - | - |
| DC 1 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 1 Source - Cathode Select | - | - | - | - | - | - | - |
| DC 1 Source - Shutter | - | - | - | - | - | - | - |
| DC 2 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 2 Source - Shutter | - | - | - | - | - | - | - |
| Pressure Control (Throttle) | - | - | - | - | - | - | - |
| Ignition Pressure (mTorr) | - | - | - | - | - | - | - |
| Rotation Speed (0-100%) | - | - | - | - | - | - | - |
| End Process (Yes) | - | - | - | - | - | - | - |
Molybdenum (Mo)
| Step Number | T000 | T001 | T002 | T003 | T004 | T005 | T006 |
|---|---|---|---|---|---|---|---|
| Step Time (sec) | - | - | - | - | - | - | - |
| Min Vacuum Setpoint (Torr) | - | - | - | - | - | - | - |
| Gas - (PID or Fixed) | - | - | - | - | - | - | - |
| Gas - PID Master Gas Select | - | - | - | - | - | - | - |
| Gas1 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas2 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas PID Pressure (mTorr) | - | - | - | - | - | - | - |
| RF Source - Sputter (Watts) | - | - | - | - | - | - | - |
| RF Source - Cathode Select | - | - | - | - | - | - | - |
| RF Source - Shutter | - | - | - | - | - | - | - |
| DC 1 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 1 Source - Cathode Select | - | - | - | - | - | - | - |
| DC 1 Source - Shutter | - | - | - | - | - | - | - |
| DC 2 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 2 Source - Shutter | - | - | - | - | - | - | - |
| Pressure Control (Throttle) | - | - | - | - | - | - | - |
| Ignition Pressure (mTorr) | - | - | - | - | - | - | - |
| Rotation Speed (0-100%) | - | - | - | - | - | - | - |
| End Process (Yes) | - | - | - | - | - | - | - |