Difference between revisions of "Denton Explorer14 Magnetron Sputterer"

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== Master recipes ==
 
== Master recipes ==
  
−
Note that some recipes have ramp-up and ramp-down steps. The deposition step can always be found by locating when the shutter is open.
+
Note that some recipes have both ramp-up and ramp-down steps. The deposition step can always be found by locating when the shutter is open.
 +
 
 +
The post-deposition cool-down time will vary for different materials depending on their propensity for oxidation. For example, Ag has a long cool-down time of 15 minutes.
  
 
===== Titanium (Ti) =====
 
===== Titanium (Ti) =====

Revision as of 15:34, 24 January 2023


Denton Explorer14 Magnetron Sputterer
PVD-05.jpeg
Tool Name Denton Explorer14 Magnetron Sputterer
Instrument Type Deposition
Staff Manager Jason (jarohr@seas.upenn.edu)
Lab Location Bay 2
Tool Manufacturer Denton
Tool Model Explorer14
NEMO Designation {{{NEMO_Designation}}}
Lab Phone 215-898-9748
SOP Link SOP

Description

Tool overview

The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films (such as oxides). Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. The tool is an open load system in sputter-down configuration with one dedicated DC source and two sources that can use either a DC or RF power supply. Co-deposition from two DC sources or one DC and one RF source is possible, but it is recommended to run co-deposition on PVD-03 as the sources in this tool are not in confocal mode per default. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.

Maximum power
  • Maximum DC Power: 600 W.
  • Maximum RF Power: 200 W.

You can inflict serious damage to the power supplies if these values are exceeded.

Available materials & process data

All process data were recorded at a base pressure lower than 5 x 10-6 Torr; you can never exceed 200 W on RF and 600 W on DC.

Material Name Max power Process data Recorded
Pressure Power Rate
Ag (silver) 450 W 3 mTorr 140 W 7.3 Å s-1
Al (aluminum) 450 W 3 mTorr 200 W 3.0 Å s-1
Au (gold) 140 W 3 mTorr 140 W 4.6 Å s-1
Cr (chromium) 450 W - - -
Cu (copper) 450 W 3 mTorr 400 W 3.4 Å s-1
Fe (iron) 350 W - - -
Ge (germanium) 140 W - - -
ITO (Indium tin oxide) 140 W - - -
Mn (manganese) 140 W - - -
Mo (molybdenum) 450 W 3 mTorr 140 1.9 Å s-1
Ni (nickel) 350 W - - -
Pd (palladium) 140 W - - -
Pt (platinum) 140 W 3 mTorr 140 W 2.6 Å s-1
i-Si (intrinsic silicon) 140 W - - -
n-Si (n-type silicon) 280 W - - -
p-Si (p-type silicon) 280 W - - -
Ti (titanium) 350 W 3 mTorr 350 W 2.0 Å s-1
TiO2 (titanium dioxide) 140 W - - -
W (tungsten) 450 W - - -
YSZ (yttria-stabilized zirconia) 140 W - - -

Resources

SOPs & Troubleshooting

Master recipes

Note that some recipes have both ramp-up and ramp-down steps. The deposition step can always be found by locating when the shutter is open.

The post-deposition cool-down time will vary for different materials depending on their propensity for oxidation. For example, Ag has a long cool-down time of 15 minutes.

Titanium (Ti)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Aluminum (Al)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Copper (Cu)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Silver (Ag)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Gold (Au)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Platinum (Pt)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Tungsten (W)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
Molybdenum (Mo)
Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -
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