Difference between revisions of "ADT 7100 Dicing Saw"

From Quattrone Nanofabrication Facility
Jump to navigation Jump to search
Line 34: Line 34:
 
===== SOPs & Troubleshooting =====
 
===== SOPs & Troubleshooting =====
 
* [https://repository.upenn.edu/scn_sop/17/ QNF SOP]
 
* [https://repository.upenn.edu/scn_sop/17/ QNF SOP]
 +
* [https://urldefense.com/v3/__https://lnf-wiki.eecs.umich.edu/wiki/ADT_7100_Dicing_Saw__;!!IBzWLUs!CxAen2043kyzzuVvC2TIklv-FS-rzC3b7KXgT_PfrFmrvE1Yxcqru6MgJTXBi5GMrvk$  Lurie SOP]
 
* [https://drive.google.com/file/d/1OaMUS65IQB3LxHb5uDhZkGpUV1rOP8GU/view?usp=sharing Mounting Video from Lurie Lab, University of Michigan]
 
* [https://drive.google.com/file/d/1OaMUS65IQB3LxHb5uDhZkGpUV1rOP8GU/view?usp=sharing Mounting Video from Lurie Lab, University of Michigan]
* [https://urldefense.com/v3/__https://lnf-wiki.eecs.umich.edu/wiki/ADT_7100_Dicing_Saw__;!!IBzWLUs!CxAen2043kyzzuVvC2TIklv-FS-rzC3b7KXgT_PfrFmrvE1Yxcqru6MgJTXBi5GMrvk$  Lurie SOP]
 
 
* [https://alliance.seas.upenn.edu/~qnf/wiki/index.php?title=File:DicingSelection.png  Dicing Blade Selection - No blade part numbers]
 
* [https://alliance.seas.upenn.edu/~qnf/wiki/index.php?title=File:DicingSelection.png  Dicing Blade Selection - No blade part numbers]
 
* [https://upenn.box.com/s/72vdy8fglkagye8pc1at2fdlg9bvpfqc  Material Dicing Guide]
 
* [https://upenn.box.com/s/72vdy8fglkagye8pc1at2fdlg9bvpfqc  Material Dicing Guide]

Revision as of 12:59, 21 June 2022


ADT 7100 Dicing Saw
BE-04.jpeg
Tool Name ADT 7100 Dicing Saw
Instrument Type Back End
Staff Manager Eric Johnston
Lab Location Singh 104
Tool Manufacturer Advanced Dicing Technologies (ADT)
Tool Model 7122
NEMO Designation {{{NEMO_Designation}}}
Lab Phone none
SOP Link SOP

Description

Workhorse dicing saw with precision dicing and alignment system. This is an automated tool with a 2″, DC-brushless, 1.2 kW, Front-mounted, Air-bearing Spindle (60 krpm Max.), with closed-loop turntable, and is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.

Applications
  • Dicing of Si wafers
  • Dicing of glass wafers
  • Dicing of sapphire wafers
Important Considerations
  • Main cause of broken blades is having the saw descend directly onto the sample. The solution to this is to make sure your sample is centered as much as possible, and to have 10mm of over travel.

Resources

ADT Contacts:

  • Bob McCort (semi-retired): rmccort@adt-co.com
  • Bob Smith, process specialist: rhsmith@adt-co.com
SOPs & Troubleshooting