Difference between revisions of "Lesker PVD75 E-Beam/Thermal Evaporator"

From Quattrone Nanofabrication Facility
Jump to navigation Jump to search
Line 40: Line 40:
  
 
===== SOPs & Troubleshooting =====
 
===== SOPs & Troubleshooting =====
* [https://www.seas.upenn.edu/~nanosop/PVD75_E-beam_Thermal_SOP.htm QNF SOP]
+
* [https://www.seas.upenn.edu/~nanosop/PVD75_E-beam_Thermal_SOP.htm SOP]

Revision as of 15:57, 5 May 2022


Lesker PVD75 E-Beam/Thermal Evaporator
PVD-02.jpeg
Tool Name Lesker PVD75 E-Beam/Thermal Evaporator
Instrument Type Deposition
Staff Manager David Barth
Lab Location Bay 2
Tool Manufacturer Kurt J. Lesker
Tool Model PVD75
NEMO Designation {{{NEMO_Designation}}}
Lab Phone XXXXX
SOP Link SOP

Description

The Kurt J. Lesker PVD 75 thin film deposition system is equipped for electron-beam (4 pockets) and thermal evaporation (2 sources). The evaporator is used to deposit metals and semiconductor materials. E-beam is the preferred evaporation technique for the high melting point materials. Evaporation provides directionality in depositions, which is beneficial when doing liftoff metallization (as opposed to conformal coating with sputtering deposition). Crystal oscillators are used to monitor deposition rates and thickness.

The system can accommodate pieces through wafers up to 150 mm in diameter and is configured with platen rotation and a cooling stage.


Deposition Sources

A wide variety of materials are used in this tool. Certain materials with low vapor pressure or a high likelihood to contaminate other processes (such as indium) are not allowed. Some of the more commonly used materials are listed below.

  • Aluminum
  • Copper
  • Titanium
  • SiO2
  • Platinum
  • Gold
  • Chromium
  • Germanium
  • Silver
  • Al2O3

Resources

SOPs & Troubleshooting