Difference between revisions of "EVG 510 Wafer Bonder"
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Revision as of 12:35, 2 May 2022
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| Tool Name | EVG 510 Wafer Bonder |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Eric Johnston |
| Lab Location | Bay 2 |
| Tool Manufacturer | EV Group |
| Tool Model | 510 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
The EVG501 Wafer Bonding System is a highly flexible R&D system that can handle small substrate pieces up to 100 mm wafers. The new tool supports a variety of bonding processes, such as anodic, eutectic, diffusion, fusion, solder, and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than five minutes, making it ideal for universities and R&D as well as small-volume production applications.
Specification Maximum contact force: 10 kN Maximum temperature: 550 ºC Vacuum: ~0.1 mbar Power supply for anodic bonding: 0-2000 V and 50 mA
Applications
- Anodic wafer bonding
- Eutectic wafer bonding
- Diffusion wafer bonding
- Fusion wafer bonding
- Adhesive wafer bonding