Difference between revisions of "ADT 7100 Dicing Saw"
Jump to navigation
Jump to search
Line 7: | Line 7: | ||
| imagecaption = | | imagecaption = | ||
| Instrument_Type = Back End | | Instrument_Type = Back End | ||
− | | Staff_Manager = | + | | Staff_Manager = Eric Johnston |
− | | Lab_Location = | + | | Lab_Location = Singh 104 |
| Tool_Manufacturer = Advanced Dicing Technologies (ADT) | | Tool_Manufacturer = Advanced Dicing Technologies (ADT) | ||
− | | Tool_Model = | + | | Tool_Model = 7122 |
| Iris_Designation = BE-04 | | Iris_Designation = BE-04 | ||
| Lab_Phone = none | | Lab_Phone = none | ||
Line 30: | Line 30: | ||
* [https://repository.upenn.edu/scn_sop/17/ QNF SOP] | * [https://repository.upenn.edu/scn_sop/17/ QNF SOP] | ||
* [https://alliance.seas.upenn.edu/~qnf/wiki/index.php?title=File:DicingSelection.png | Dicing Blade Selection] | * [https://alliance.seas.upenn.edu/~qnf/wiki/index.php?title=File:DicingSelection.png | Dicing Blade Selection] | ||
+ | * [https://upenn.box.com/s/72vdy8fglkagye8pc1at2fdlg9bvpfqc | Material Dicing Guide] | ||
+ | * [https://upenn.box.com/s/azdfq2hkroqw0br0razra1kktig7qx4w | Dicing Troubleshooting Guide] | ||
+ | * [https://upenn.box.com/s/z7bg2lto5jf1pgb58cc1eh5t260p6uhg | Applications Dicing Guide] | ||
+ | * [https://upenn.box.com/s/0ze3lfcdozajmu9nlyo1qdsitmcn8cbc | Detailed Material Dicing Guide] |
Revision as of 20:32, 6 April 2022
Tool Name | ADT 7100 Dicing Saw |
---|---|
Instrument Type | Back End |
Staff Manager | Eric Johnston |
Lab Location | Singh 104 |
Tool Manufacturer | Advanced Dicing Technologies (ADT) |
Tool Model | 7122 |
NEMO Designation | {{{NEMO_Designation}}} |
Lab Phone | none |
SOP Link | SOP |
Description
Workhorse dicing saw with precision dicing and alignment system. This is an automated tool with a 2″, DC-brushless, 1.2 kW, Front-mounted, Air-bearing Spindle (60 krpm Max.), with closed-loop turntable, and is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.
Applications
- Dicing of Si wafers
- Dicing of glass wafers
- Dicing of sapphire wafers