Difference between revisions of "Raith EBPG5200+ E-Beam Lithography System"
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* [[ZEP_Process_Data | ZEP520A Contrast Curve]] | * [[ZEP_Process_Data | ZEP520A Contrast Curve]] | ||
* [[Media:Dsbarth_pmma_bubbling_maebl2023.pdf | Mitigating PMMA Bubbling]] | * [[Media:Dsbarth_pmma_bubbling_maebl2023.pdf | Mitigating PMMA Bubbling]] | ||
| + | * [[ma-N_Process_Data | ma-N 2403 Process Data]] | ||
Latest revision as of 08:22, 8 September 2025
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| Tool Name | Raith EBPG5200+ EBL |
|---|---|
| Instrument Type | Lithography |
| Staff Manager | David Barth |
| Lab Location | Bay 4 |
| Tool Manufacturer | Raith |
| Tool Model | EBPG5200+ |
| NEMO Designation | EBL-03 |
| Nearest Phone | 8-9799 |
| SOP Link | SOP |
Description
The Raith EBPG5200+ is an electron beam lithography tool capable of high resolution patterning at 100 kV. It has a 125 MHz pattern generator, a maximum current of 350 nA, and a 1 mm mainfield size. It has an automatic aperture changer, automatic and dynamic focus and stigmation, and automatic alignment. The EBPG can achieve linewidths <8nm with stitching and overlay accuracy better than 10nm.
Applications
- Large scale, high speed patterning of positive and negative e-beam resists with features from <10 nm to micron/mm scale
Allowed Materials
- Standard semiconductor materials
- Low vapor pressure metals
- Resists
Resources
SOP
Useful Information