Difference between revisions of "Soft Lithography"
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[[Category:Lithography]] [[Category:Soft Lithography]] | [[Category:Lithography]] [[Category:Soft Lithography]] | ||
| + | __NOTOC__ | ||
| + | ===About=== | ||
| + | Soft lithography is the transfer of patterned microstructures with molded elastomer. The most common elastomer used in this technique is PDMS (polydimethylsiloxane), which is <u>soft</u>, low cost and easy to mold. It is also bio-compatible with high thermal stability and high chemical stability, is chemically inert, insulating, transparent to UV and visible light, mechanically flexible and durable, allowing many applications. The most common devices fabricated with this technique are microfluidics. <br> | ||
| + | <u><small>'''NOTE</u>:'''</small> You might hear soft lithography equated to "microfluidics fabrication." However, it is important to remember that not all microfluidic devices are fabricated by soft lithography and not all soft lithography is for microfluidic applications! | ||
| − | ===== | + | ===Process Flow=== |
| − | * [https://wiki.nano.upenn.edu/wiki/images/c/cf/Microfluidics_Process_Flow.pdf Making a Master - | + | *The master used can be fabricated out of photoresist or etched silicon. The most commonly used materials are epoxy-based negative photoresist (SU8 or HARE SQ). For a negative photoresist, the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development. The height of this structure is determined by the thickness of the resist, which we control through our application method. The length and width of features are patterned through the UV exposure, either by mask or direct write tools.<br> |
| − | * Making a Device | + | *For molding success, there are two important components to think about -- master durability and PDMS removal. Etched silicon molds will be more durable than patterned photoresist. However, an O2 plasma treatment under vacuum before applying resist has shown more than sufficient adhesion for patterned HARE SQ in our own tests. To enable easy release of the PDMS from the mold, it can be beneficial to do a silanization treatment before applying the PDMS.<br> |
| + | *An O2 plasma step is included if applying the PDMS to glass or another piece of PDMS to make a device. | ||
| + | |||
| + | =====QNF Example Protocols===== | ||
| + | * [https://wiki.nano.upenn.edu/wiki/images/c/cf/Microfluidics_Process_Flow.pdf Making a Master: HARE SQ, MA-03] | ||
| + | * Making a Device: PDMS to PDMS bonding | ||
<pdf height="500" width="1100"> File:SOP Microfluidics.pdf</pdf> | <pdf height="500" width="1100"> File:SOP Microfluidics.pdf</pdf> | ||
| − | ===== | + | =====Videos===== |
* [https://www.youtube.com/watch?v=ybFHtd2pPYs Spin Coating Thick Resist] | * [https://www.youtube.com/watch?v=ybFHtd2pPYs Spin Coating Thick Resist] | ||
| − | |||
* [https://www.youtube.com/watch?v=SCs87pYIn5w Negative Resist First Mask Alignment Mark] | * [https://www.youtube.com/watch?v=SCs87pYIn5w Negative Resist First Mask Alignment Mark] | ||
* [https://www.youtube.com/watch?v=Wzrsv_01ZNE Developing SU8 Resist] | * [https://www.youtube.com/watch?v=Wzrsv_01ZNE Developing SU8 Resist] | ||
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* [[How to Make a Mask]] | * [[How to Make a Mask]] | ||
| − | =====Internal | + | ===Additional Resources=== |
| + | =====Internal===== | ||
*[https://repository.upenn.edu/entities/publication/ae5bbb10-7b45-4568-9f0f-f2f27e7d95c2 T-Topping Study Report] | *[https://repository.upenn.edu/entities/publication/ae5bbb10-7b45-4568-9f0f-f2f27e7d95c2 T-Topping Study Report] | ||
*HARE SQ Adhesion Study ''- coming soon'' | *HARE SQ Adhesion Study ''- coming soon'' | ||
| Line 23: | Line 32: | ||
* [https://upenn.box.com/s/xrlkb6agcqae7ietb16mk5d84zqbcbr0 Presentation for Workshop - Biological Researchers (PDF Format)] | * [https://upenn.box.com/s/xrlkb6agcqae7ietb16mk5d84zqbcbr0 Presentation for Workshop - Biological Researchers (PDF Format)] | ||
* [https://upenn.box.com/s/10wkjldwrt3f6it5ted0jo74b72eu0m4 Presentation for ESE 536 Course Module (PDF Format)] | * [https://upenn.box.com/s/10wkjldwrt3f6it5ted0jo74b72eu0m4 Presentation for ESE 536 Course Module (PDF Format)] | ||
| − | + | =====External===== | |
| − | =====External | ||
*[https://df393c79-ecb8-453c-bf20-359d99bdbc77.filesusr.com/ugd/5b8579_bc178fb3a8fb47828522de434712b455.pdf HARE SQ Dispensing and Handling Techniques - KemLab] | *[https://df393c79-ecb8-453c-bf20-359d99bdbc77.filesusr.com/ugd/5b8579_bc178fb3a8fb47828522de434712b455.pdf HARE SQ Dispensing and Handling Techniques - KemLab] | ||
*[https://piescientific.com/resource-pdms-bonding/ PDMS Bonding - PIE Scientific] | *[https://piescientific.com/resource-pdms-bonding/ PDMS Bonding - PIE Scientific] | ||
*Microfluidics and Nanofluidics Handbook: SU-8 Photolithography and Its Impact on Microfluidics by Rodrigo Martinez-Duarte and Marc J. Madou | *Microfluidics and Nanofluidics Handbook: SU-8 Photolithography and Its Impact on Microfluidics by Rodrigo Martinez-Duarte and Marc J. Madou | ||
Revision as of 14:01, 30 July 2025
About
Soft lithography is the transfer of patterned microstructures with molded elastomer. The most common elastomer used in this technique is PDMS (polydimethylsiloxane), which is soft, low cost and easy to mold. It is also bio-compatible with high thermal stability and high chemical stability, is chemically inert, insulating, transparent to UV and visible light, mechanically flexible and durable, allowing many applications. The most common devices fabricated with this technique are microfluidics.
NOTE: You might hear soft lithography equated to "microfluidics fabrication." However, it is important to remember that not all microfluidic devices are fabricated by soft lithography and not all soft lithography is for microfluidic applications!
Process Flow
- The master used can be fabricated out of photoresist or etched silicon. The most commonly used materials are epoxy-based negative photoresist (SU8 or HARE SQ). For a negative photoresist, the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development. The height of this structure is determined by the thickness of the resist, which we control through our application method. The length and width of features are patterned through the UV exposure, either by mask or direct write tools.
- For molding success, there are two important components to think about -- master durability and PDMS removal. Etched silicon molds will be more durable than patterned photoresist. However, an O2 plasma treatment under vacuum before applying resist has shown more than sufficient adhesion for patterned HARE SQ in our own tests. To enable easy release of the PDMS from the mold, it can be beneficial to do a silanization treatment before applying the PDMS.
- An O2 plasma step is included if applying the PDMS to glass or another piece of PDMS to make a device.
QNF Example Protocols
- Making a Master: HARE SQ, MA-03
- Making a Device: PDMS to PDMS bonding
Videos
- Spin Coating Thick Resist
- Negative Resist First Mask Alignment Mark
- Developing SU8 Resist
- Degassing PDMS
Related Information
Additional Resources
Internal
- T-Topping Study Report
- HARE SQ Adhesion Study - coming soon
- QNF Soft Lithography Workshop Process Flow - SU8 3050
- Presentation for Workshop - Biological Researchers (PDF Format)
- Presentation for ESE 536 Course Module (PDF Format)
External
- HARE SQ Dispensing and Handling Techniques - KemLab
- PDMS Bonding - PIE Scientific
- Microfluidics and Nanofluidics Handbook: SU-8 Photolithography and Its Impact on Microfluidics by Rodrigo Martinez-Duarte and Marc J. Madou