Difference between revisions of "SUSS MicroTec AS8 AltaSpray"
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| − | [[Category:Lithography]][[Category:Photolithography]][[Category:Resist Coating]] | + | [[Category:Lithography]][[Category:Photolithography]][[Category:Resist Coating]][[Category:Equipment]] |
{{EquipmentInfo | {{EquipmentInfo | ||
Latest revision as of 12:32, 28 July 2025
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| Tool Name | SUSS MicroTec AS8 AltaSpray |
|---|---|
| Instrument Type | Lithography |
| Staff Manager | Ana Cohen |
| Lab Location | Bay 5 |
| Tool Manufacturer | SUSS MicroTec |
| Tool Model | AS8 AltaSpray |
| NEMO Designation | RC-01 |
| Nearest Phone | XXXXX |
| SOP Link | SOP |
Description
SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging. Wafer sizes from pieces to 200mm.
Applications
- Automated resist spray coater for high topographies